Patents by Inventor Nobuaki Nakasu

Nobuaki Nakasu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190275675
    Abstract: A trajectory planning apparatus including a joint axis classification unit for classifying a plurality of joint axes of a robot into axis groups, according to joint axis classification information for classifying into the axis groups including at least a path search axis group, a path search unit for searching for a path of an angle of the joint axis classified into the path search axis group that minimizes an evaluation function for evaluating a planed trajectory, based on trajectory start point information representing a posture of the robot at a start point of the planed trajectory and trajectory endpoint information representing a posture of the robot at an end point of the planned trajectory, and an axis group angle calculation unit for calculating an angle of the joint axis classified into each axis group other than the path search axis group during the search of the path.
    Type: Application
    Filed: October 22, 2018
    Publication date: September 12, 2019
    Applicant: HITACHI, LTD.
    Inventors: Takashi SENO, Daisuke TSUTSUMI, Daiki KAJITA, Nobuaki NAKASU
  • Publication number: 20190217472
    Abstract: A robot controlling device inputs an operation state of a worker from a sensor. The robot controlling device calculates a position vector and a velocity vector of each of the robot and the worker from the operation state of the robot and the operation state of the worker, generates a risk determination area (an area where the robot is stopped, an area where the robot is evacuated, and an area where the robot is decelerated) around each of the robot and the worker, determines a risk based on overlapping between the generated risk determination area of the robot and the generated risk determination area of the worker, generates a collision avoidance trajectory in which collision between the robot and the worker is avoided from a result of the determination, and controls the robot based on the generated collision avoidance trajectory.
    Type: Application
    Filed: December 31, 2018
    Publication date: July 18, 2019
    Inventors: Nobuaki NAKASU, Kei IMAZAWA
  • Patent number: 9419490
    Abstract: The present invention is directed to connection technology for providing a sufficient connection strength in bonding a wire material and a twisted wire each having a large diameter when directly bonding the wire material, which is used for a stator of an electric motor and a generator, and the twisted wire serving as a lead wire by ultrasonic bonding. A twisted wire having a plurality of core wires is hardened by ultrasonic vibration using a pressurized vibration tool when the twisted wire is connected to a wire material. After that, the twisted wire is reversed such that the hardened surface thereof faces the wire material and then comes into contact with the wire material. In this state, ultrasonic waves are applied to the hardened surface from the opposite side using the vibration tool, thereby connecting the hardened surface of the twisted wire and the wire material.
    Type: Grant
    Filed: November 11, 2011
    Date of Patent: August 16, 2016
    Assignee: Hitachi Automotive Systems, Ltd.
    Inventors: Daiki Kajita, Nobuaki Nakasu, Hiroshi Hamano, Yoshimi Mori, Takeshi Matsuo
  • Patent number: 9261421
    Abstract: A fixing force measuring apparatus including a section for applying a predetermined controlled hammering force to a wedge surface to generate a hammering sound, a section for controlling the hammering sound generated, a section for obtaining plural kinds of feature quantities such as a feature quantity due to a hammering sound energy, and a feature quantity due to a frequency of the hammering sound from the hammering sound collected by an arithmetic operation, and a section for obtaining a fixing force corresponding to the plural kinds of feature quantities by using a correlative relationship between the wedge fixing force previously obtained, and the plural kinds of feature quantities.
    Type: Grant
    Filed: December 10, 2013
    Date of Patent: February 16, 2016
    Assignee: Mitsubishi Hitachi Power Systems, Ltd.
    Inventors: Yoshitaka Tsutsui, Nobuaki Nakasu, Keiji Suzuki, Kengo Iwashige, Mitsuru Onoda, Harumasa Tsuchiya, Yasuaki Kageyama
  • Patent number: 9255908
    Abstract: According to a method by a frequency analysis of tap tones at the time when a tightness of a ripple member fixed by an elastic force has been tapped by a hammer or a method of detecting a response at the time when the ripple member has been vibrated, an enough precision cannot be obtained for a tightness estimation. A tapping force is applied to a plurality of positions on the member surface, thereby allowing a plurality of tap tones to be generated. Feature amounts are obtained from the plurality of tap tones. An average feature amount is obtained by averaging the feature amounts. The tightness of the ripple member is estimated from the average feature amount by using a correlation between the tightness of the ripple member and the average feature amount.
    Type: Grant
    Filed: December 7, 2012
    Date of Patent: February 9, 2016
    Assignee: Mitsubishi Hitachi Power Systems, Ltd.
    Inventors: Yoshitaka Tsutsui, Nobuaki Nakasu, Harumasa Tsuchiya, Keiji Suzuki, Mitsuru Onoda, Yasuaki Kageyama
  • Patent number: 9063356
    Abstract: An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairing apparatus for repairing a pattern defect on a surface of a substrate in a display device where an electronic circuit pattern having the above described pattern defect is formed, characterized by having a plasma irradiation means for repairing the above described pattern defect through local irradiation of a region including the above described pattern defect with plasma.
    Type: Grant
    Filed: July 23, 2009
    Date of Patent: June 23, 2015
    Assignees: JAPAN DISPLAY INC., PANASONIC LIQUID CRYSTAL DISPLAY CO., LTD.
    Inventors: Takeshi Arai, Nobuaki Nakasu, Tadao Edamura, Noriyuki Oroku
  • Patent number: 8957962
    Abstract: Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.
    Type: Grant
    Filed: May 21, 2010
    Date of Patent: February 17, 2015
    Assignees: Japan Display Inc., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Takeshi Arai, Nobuaki Nakasu
  • Publication number: 20140288882
    Abstract: A cutting state quantity caused by processing, in which a cutting tool is rotated, is measured, cutting force components containing a fundamental and harmonics are extracted from a measured signal, a threshold for abnormality determination is calculated on the basis of harmonic ratios that are ratios between the fundamental and harmonics of the cutting force components, a cutting force is calculated from the extracted cutting force components, and an abnormality is determined on the basis of the calculated cutting force and the calculated threshold.
    Type: Application
    Filed: June 25, 2012
    Publication date: September 25, 2014
    Applicant: Hitachi, Ltd.
    Inventors: Nobuaki Nakasu, Hideaki Onozuka
  • Publication number: 20140260526
    Abstract: A fixing force measuring apparatus including a section for applying a predetermined controlled hammering force to a wedge surface to generate a hammering sound, a section for controlling the hammering sound generated, a section for obtaining plural kinds of feature quantities such as a feature quantity due to a hammering sound energy, and a feature quantity due to a frequency of the hammering sound from the hammering sound collected by an arithmetic operation, and a section for obtaining a fixing force corresponding to the plural kinds of feature quantities by using a correlative relationship between the wedge fixing force previously obtained, and the plural kinds of feature quantities.
    Type: Application
    Filed: December 10, 2013
    Publication date: September 18, 2014
    Applicant: Hitachi, Ltd.
    Inventors: Yoshitaka TSUTSUI, Nobuaki NAKASU, Keiji SUZUKI, Kengo IWASHIGE, Mitsuru ONODA, Harumasa TSUCHIYA, Yasuaki KAGEYAMA
  • Publication number: 20140123740
    Abstract: Provided are a device and a method which determine a threshold value for detecting abnormality in a working path in which the cutting condition changes momentarily to thereby enable abnormality determination. Cutting force that becomes an abnormality determination value and threshold value information are previously calculated by cutting simulation, and a threshold value with which a comparison is to be made is determined from the position coordinates of a working machine which have been acquired during cutting and the measurement result of cutting force to thereby enable abnormality determination.
    Type: Application
    Filed: May 7, 2012
    Publication date: May 8, 2014
    Applicant: Hitachi, Ltd.
    Inventors: Takehisa Yoshikawa, Hideaki Onozuka, Nobuaki Nakasu
  • Publication number: 20130293045
    Abstract: The present invention is directed to connection technology for providing a sufficient connection strength in bonding a wire material and a twisted wire each having a large diameter when directly bonding the wire material, which is used for a stator of an electric motor and a generator, and the twisted wire serving as a lead wire by ultrasonic bonding. A twisted wire having a plurality of core wires is hardened by ultrasonic vibration using a pressurized vibration tool when the twisted wire is connected to a wire material. After that, the twisted wire is reversed such that the hardened surface thereof faces the wire material and then comes into contact with the wire material. In this state, ultrasonic waves are applied to the hardened surface from the opposite side using the vibration tool, thereby connecting the hardened surface of the twisted wire and the wire material.
    Type: Application
    Filed: November 11, 2011
    Publication date: November 7, 2013
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Daiki Kajita, Nobuaki Nakasu, Hiroshi Hamano, Yoshimi Mori, Takeshi Matsuo
  • Patent number: 8206775
    Abstract: The pattern defect repairing apparatus comprises an application head, a waste ejection board, a waste ejection vessel, a waste ejection board moving stage, a head lifting stage, and an application unit base. The application head comprises an ink-jet head and a head holder. An ink jet head has an ejection nozzle, and is attached to the head holder and able to be moved up and down by the head lifting stage. The waste ejection vessel is provided to the waste ejection board and able to be moved between a waste ejection position and a retreated position by the waste ejection board moving stage. Repairing material is ejected for waste onto the waste ejection board set in the vicinity of the nozzle immediately before application to repair the defect. The tip end of the nozzle is prevented from being dried.
    Type: Grant
    Filed: January 26, 2009
    Date of Patent: June 26, 2012
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventors: Nobuaki Nakasu, Tadao Edamura, Hirofumi Sunaoshi, Takemi Igeta, Kazuhiro Fukuchi
  • Patent number: 8112883
    Abstract: A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.
    Type: Grant
    Filed: June 10, 2008
    Date of Patent: February 14, 2012
    Assignees: Hitachi Displays, Ltd., Panasonic Liquid Crystal Display Co., Ltd.
    Inventor: Nobuaki Nakasu
  • Patent number: 8035058
    Abstract: A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.
    Type: Grant
    Filed: June 3, 2005
    Date of Patent: October 11, 2011
    Assignee: Hitachi Displays, Ltd.
    Inventors: Nobuaki Nakasu, Kaoru Yamada, Yuichiro Tanaka, Takeshi Arai, Hideyuki Honoki, Kazushi Yoshimura, Tetsuya Kawamura, Masanori Okawa
  • Publication number: 20100302360
    Abstract: Provided is a defect correcting device for an electronic circuit pattern, which is capable of making a defect seed obvious, and normalizing a pixel or forming a pixel into a semi-black spot. A defect correcting device for an electronic circuit pattern includes: an imaging unit for irradiating a defective portion of the electronic circuit pattern with irradiation light having a wavelength of a visible light region and a wavelength of an infrared light region, and receiving reflected light having the wavelength of the visible light region and the wavelength of the infrared light region from the electronic circuit pattern; a signal processing unit for extracting the defective portion from a picked-up image, and determining a correcting method; a laser irradiating unit for irradiating the defective portion with laser light; and a correction determining unit for determining success or failure of defect correction before and after laser irradiation.
    Type: Application
    Filed: May 21, 2010
    Publication date: December 2, 2010
    Inventors: Takeshi Arai, Nobuaki Nakasu
  • Publication number: 20100062182
    Abstract: An object of the present invention is to provide a method for repairing a display device according to which a wide variety of regions can be repaired in various ways using various materials, as well as an apparatus for the same. The present invention provides a repairing apparatus for repairing a pattern defect on a surface of a substrate in a display device where an electronic circuit pattern having the above described pattern defect is formed, characterized by having a plasma irradiation means for repairing the above described pattern defect through local irradiation of a region including the above described pattern defect with plasma.
    Type: Application
    Filed: July 23, 2009
    Publication date: March 11, 2010
    Inventors: Takeshi ARAI, Nobuaki NAKASU, Tadao EDAMURA, Noriyuki OROKU
  • Publication number: 20090196978
    Abstract: The pattern defect repairing apparatus comprises an application head, a waste ejection board, a waste ejection vessel, a waste ejection board moving stage, a head lifting stage, and an application unit base. The application head comprises an ink-jet head and a head holder. An ink jet head has an ejection nozzle, and is attached to the head holder and able to be moved up and down by the head lifting stage. The waste ejection vessel is provided to the waste ejection board and able to be moved between a waste ejection position and a retreated position by the waste ejection board moving stage. Repairing material is ejected for waste onto the waste ejection board set in the vicinity of the nozzle immediately before application to repair the defect. The tip end of the nozzle is prevented from being dried.
    Type: Application
    Filed: January 26, 2009
    Publication date: August 6, 2009
    Inventors: Nobuaki NAKASU, Tadao Edamura, Hirofumi Sunaoshi, Takemi Igeta, Kazuhiro Fukuchi
  • Publication number: 20080313893
    Abstract: A method for manufacturing an electronic circuit board which contains an electronic circuit on a main surface of a glass substrate according to the invention sequentially performs a step of electrically inspecting the main surface of the glass substrate on which the electronic circuit is formed, a step of specifying positions and defect types of defects on the main surface of the glass substrate, a step of calculating reference point coordinates on the main surface of the glass substrate and correcting the coordinates, a step of extracting respective defects from an image around the defects and specifying a defect to be corrected in the extracted defects by referring to a defect existing range registered in advance for each defect type, and a step of cutting the specified defect. By this method, a foreign material adhering to the glass substrate is not erroneously judged as short-circuit defect causing short-circuit on the electronic circuit, and only defect actually requiring correction can be removed.
    Type: Application
    Filed: June 10, 2008
    Publication date: December 25, 2008
    Inventor: Nobuaki Nakasu
  • Publication number: 20060065645
    Abstract: A region surrounded by two gate wiring and two drain wiring includes pixels and when there is a defect of short-circuit in adjacent pixel electrodes, the short-circuited portion is removed by irradiating a laser via a mask having a transmission pattern, which corresponds to a pattern of the gate wiring, drain wiring and pixel electrodes in the short-circuited portion. The above short-circuited portion is identified and removed in comparison to a normal pattern, by use of information from an inspection apparatus, and the pattern defect formed on the substrate is automatically repaired. By applying the above method to a manufacturing process of display apparatus, in particular, to a resist pattern forming process, a display apparatus having a highly qualified display property may be achieved.
    Type: Application
    Filed: June 3, 2005
    Publication date: March 30, 2006
    Inventors: Nobuaki Nakasu, Kaoru Yamada, Yuichiro Tanaka, Takeshi Arai, Hideyuki Honoki, Kazushi Yoshimura, Tetsuya Kawamura, Masanori Okawa
  • Patent number: 6867841
    Abstract: The invention provides a high quality liquid crystal panel with low non-uniformity by enveloping a pair of glass substrates sandwiching an uncured thermosetting seal member with heat-resistant metal sheets, bringing the insides of the sheets into a substantially hermetically closed state to decompress the space around the substrates, pressing the glass substrates and the seal member by a pressure difference from the atmospheric pressure in a predetermined space created by the enveloping sheets, heating the sheets, the glass substrates and the seal member with a heater disposed at a position remote from the sheet and curing the seal member, and maintaining the gap between the pair of glass substrates to prevent non-uniformity of the gap between the pair of glass substrates constituting the liquid crystal panel.
    Type: Grant
    Filed: December 27, 2002
    Date of Patent: March 15, 2005
    Assignee: Hitachi, Ltd.
    Inventors: Nobuaki Nakasu, Hiroyasu Matsuura, Toshiyuki Koshita, Mitsuaki Shiba, Hitoshi Azuma, Yoshiteru Tomizuka, Tsuneo Okada