Patents by Inventor Nobuaki Ogawa

Nobuaki Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240072203
    Abstract: A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: SemiLEDs Corporation, SHIN-ETSU CHEMICAL CO., LTD.
    Inventors: Chen-Fu Chu, Shih-Kai Chan, Yi-Feng Shih, David Trung Doan, Trung Tri Doan, Yoshinori Ogawa, Kohei Otake, Kazunori Kondo, Keiji Ohori, Taichi Kitagawa, Nobuaki Matsumoto, Toshiyuki Ozai, Shuhei Ueda
  • Publication number: 20230371219
    Abstract: A module includes a substrate and a first metal member. The substrate has an upper main surface and a lower main surface arranged in an up-down direction. The first metal member includes a first plate-shaped portion provided on the upper main surface of the substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The first metal member further includes a first left support portion. A boundary between the first plate-shaped portion and the first left support portion is defined as a first left boundary. The first left support portion bends with respect to the first plate-shaped portion at the first left boundary so as to be located behind the first plate-shaped portion.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 16, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Akihiro MURANAKA, Takanori UEJIMA, Hiromichi KITAJIMA
  • Publication number: 20230360981
    Abstract: A module includes a substrate having an upper main surface and a lower main surface arranged in an up-down direction, and a metal member including a plate-shaped portion provided on the upper main surface of the substrate, the plate-shaped portion having a front main surface, a back main surface, and a lower end surface arranged in the front-back direction when viewed in the up-down direction. The lower end surface of the plate-shaped portion includes a straight portion extending in the left-right direction and one or more protruding portions protruding in the forward direction or the backward direction with respect to the straight portion, and the straight portion and the one or more protruding portions are visually recognized when viewed in the upward direction.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO
  • Publication number: 20230360983
    Abstract: In a module, a metal member includes a right support portion, the right support portion has a right support foremost portion located at a foremost in the right support portion and located in front of the plate-shaped portion, the right support portion bends in a forward direction from a right boundary when the right support portion has the right support foremost portion, the right support portion bends in a backward direction and a right direction from the right support foremost portion when the right support portion has the right support foremost portion, and the right support portion is provided with a first lower notch extending in an upward direction from a lower side and overlapping the right support foremost portion when viewed in the up-down direction.
    Type: Application
    Filed: July 13, 2023
    Publication date: November 9, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Akihiro MURANAKA
  • Publication number: 20230209788
    Abstract: A module includes: a substrate having an upper main surface and a lower main surface arranged in an up-down direction; a metal member provided on the upper main surface of the substrate, the metal member having a plate-shaped portion including a front main surface and a back main surface arranged in a front-back direction; a first electronic component mounted on the upper main surface of the substrate and disposed in front of the metal member; a second electronic component mounted on the upper main surface of the substrate and disposed behind the metal member; and a sealing resin layer provided on the upper main surface of the substrate and covering the first electronic component, the second electronic component, and the metal member. The metal member includes an upper protruding portion extending on one side of the front-back direction from an upper end of the plate-shaped portion.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 29, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Takanori UEJIMA, Hiromichi KITAJIMA, Takahiro EGUCHI
  • Publication number: 20230200032
    Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The metal member further includes one or more foot portions extending forward or backward from the lower side.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 22, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Takanori UEJIMA, Hiromichi KITAJIMA, Takahiro EGUCHI
  • Publication number: 20230199939
    Abstract: A high-frequency module includes a module substrate having a main surface, circuit components arranged on the main surface, a resin member covering at least a part of the main surface and the circuit components, a metallic shield layer covering at least an upper surface of the resin member, and a metallic shield plate arranged on the main surface and between the circuit component and the circuit component when the main surface is viewed in a plan view. The metallic shield plate is in contact with the metallic shield layer. An engraved mark portion indicating predetermined information is provided on the upper surface of the resin member.
    Type: Application
    Filed: February 21, 2023
    Publication date: June 22, 2023
    Inventors: Takanori UEJIMA, Hiromichi KITAJIMA, Takahiro EGUCHI, Nobuaki OGAWA, Yuki ASANO, Shota HAYASHI
  • Publication number: 20230189490
    Abstract: A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, and includes a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side. The metal member further includes a plurality of foot portions. All of the plurality of foot portions extend backward from the lower side.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Shota Hayashi, Nobuaki Ogawa, Yuki Asano, Akihiro Muranaka, Takanori Uejima, Hiromichi Katajima, Takahiro Eguchi
  • Publication number: 20230187297
    Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. A metal member includes a plate-shaped portion provided on an upper main surface of a substrate, the plate-shaped portion having a front main surface and a back main surface arranged in a front-back direction when viewed in an up-down direction. The sealing resin layer is provided on the upper main surface of the substrate, covers the metal member, the first electronic component, and the second electronic component, and has an upper surface. The shield is provided on the upper surface of the sealing resin layer so as to be connected to the upper end of the plate-shaped portion. The plate-shaped portion is inclined with respect to the up-down direction such that an upper end of the plate-shaped portion is located in front of a lower end of the plate-shaped portion.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Takanori UEJIMA, Hiromichi KITAJIMA, Takahiro EGUCHI, Kunitoshi HANAOKA
  • Publication number: 20230187295
    Abstract: A metal member includes a plate-shaped portion extending upward from an upper main surface of a substrate, and has a front main surface and a back main surface arranged in the front-back direction when viewed in the up-down direction. A first electronic component is mounted on the upper main surface of the substrate and is disposed in front of the metal member. A second electronic component is mounted on the upper main surface of the substrate and is disposed behind the metal member. A sealing resin layer is provided on the upper main surface of the substrate and covers the metal member and the one or more electronic components. The plate-shaped portion is provided with one or more upper notches extending downward from the upper side. The plate-shaped portion is provided with one or more lower notches extending upward from the lower side.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Takanori UEJIMA, Hiromichi KITAJIMA, Takahiro EGUCHI
  • Publication number: 20230187388
    Abstract: A substrate has an upper main surface and a lower main surface arranged in an up-down direction. The metal member is provided on the upper main surface of the substrate. The metal member includes a plate-shaped portion and one or more foot portions. The plate-shaped portion has a front main surface and a back main surface arranged in a front-back direction when viewed in the up-down direction. The one or more foot portions extend backward from the lower side by bending the metal member at the lower side of the plate-shaped portion. A line extending in a predetermined direction is provided on the front main surface, the back main surface, the outer surface of the portion where the metal member is bent, and the inner surface of the portion where the metal member is bent.
    Type: Application
    Filed: February 9, 2023
    Publication date: June 15, 2023
    Inventors: Shota HAYASHI, Nobuaki OGAWA, Yuki ASANO, Takanori UEJIMA, Hiromichi KITAJIMA, Takahiro EGUCHI
  • Patent number: 10421334
    Abstract: An electric compressor mounted to a vehicle includes a motor, a compression unit driven by the motor, an inverter unit for driving the motor, a housing for accommodating the motor, the compression unit, and the inverter unit, and a cover mounted to the housing for closing a space accommodating the inverter unit. The electric compressor is fixed to the vehicle by means of a first mounting leg provided to the housing, and a second mounting leg provided to the cover. The second mounting leg includes a stress concentration part at which stress concentrates as compared with another portion of the second mounting leg.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: September 24, 2019
    Assignee: Panasonic Intellectual Property Management Co., Ltd.
    Inventors: Kei Nishibori, Makoto Iwasa, Nobuaki Ogawa, Takeshi Imanishi, Yoshifumi Abe
  • Patent number: 10098229
    Abstract: To provide a compact module that is capable of achieving a low profile and that has excellent high-frequency characteristics, a module includes a parent board; first and second child boards arranged so as to face the parent board; multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the first child board, the second electrodes being connected to the parent board; and multiple electronic components that include first electrodes and second electrodes electrically connected to the first electrodes, respectively, on both opposing faces, the first electrodes being connected to the second child board, the second electrodes being connected to the parent board.
    Type: Grant
    Filed: August 21, 2015
    Date of Patent: October 9, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoichi Takagi, Tadashi Nomura, Masato Yoshida, Nobuaki Ogawa, Mitsuhiro Matsumoto
  • Patent number: 9907180
    Abstract: The present disclosure enhances the design flexibility of a multilayer electronic device. A multilayer electronic device is formed by alternately stacking, in a top-bottom direction, substrate layers in which substrates are disposed and a component layer in which at least one component is disposed. A non-superposing region in which a substrate of a first substrate layer positioned on the upper side of a first component layer is not superposed on a substrate of a second substrate layer positioned on the lower side of the first component layer, as viewed from above, is formed in the substrate. Accordingly, within the multilayer electronic device, a space in which the substrate of the second substrate layer is not located can be formed in a region under the non-superposing region of the substrate of the first substrate layer. By using this space, the design flexibility of the multilayer electronic device can be enhanced.
    Type: Grant
    Filed: June 12, 2015
    Date of Patent: February 27, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Yoshihito Otsubo, Nobuaki Ogawa
  • Patent number: 9832871
    Abstract: A module having high reliability in terms of its connection to an external unit is provided. The module includes: a wiring substrate that mounts components and 3b thereon; a substrate electrode formed on one main surface of the wiring substrate; a columnar conductor connected at one end to the substrate electrode; an intermediate coating formed to cover an outer peripheral surface of the columnar conductor; and a first sealing resin layer provided to cover one main surface of the wiring substrate and the intermediate coating. The intermediate coating has a coefficient of linear expansion which is between that of the columnar conductor and that of the first sealing resin layer.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: November 28, 2017
    Assignee: MURATA MANUFACTURING CO, LTD.
    Inventors: Nobuaki Ogawa, Tadashi Nomura
  • Publication number: 20170259647
    Abstract: An electric compressor mounted to a vehicle includes a motor, a compression unit driven by the motor, an inverter unit for driving the motor, a housing for accommodating the motor, the compression unit, and the inverter unit, and a cover mounted to the housing for closing a space accommodating the inverter unit. The electric compressor is fixed to the vehicle by means of a first mounting leg provided to the housing, and a second mounting leg provided to the cover. The second mounting leg includes a stress concentration part at which stress concentrates as compared with another portion of the second mounting leg.
    Type: Application
    Filed: November 17, 2015
    Publication date: September 14, 2017
    Inventors: KEI NISHIBORI, MAKOTO IWASA, NOBUAKI OGAWA, TAKESHI IMANISHI, YOSHIFUMI ABE
  • Patent number: 9590462
    Abstract: An electric compressor includes a hermetic container 103, an electric motor drive circuit section 201, a through hole 120, a hermetic terminal 207, a conductive terminal 301, a connecting terminal 302, and a housing 300. The terminal connecting portion connects the conductive terminal 301 and the cluster terminal 302 to each other. The housing is composed of a plurality of structure bodies. A convexo-concave shape is provided between bonding surfaces of the plurality of structure bodies. The housing 300 is provided with a cylindrical structure 311 into which the conductive terminal 301 is inserted. A convex structure 316 which comes into contact with the wire 306 is formed on an inner surface of the wire-insertion hole 307.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: March 7, 2017
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Gento Kobayashi, Nobuyuki Nishii, Nobuaki Ogawa, Minoru Fukumoto
  • Patent number: 9538649
    Abstract: When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: January 3, 2017
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuaki Ogawa, Yoshihito Otsubo
  • Patent number: 9491846
    Abstract: A module 100 can be precisely manufactured by mounting an electronic component 102 and a terminal assembly 10 having a simple configuration, in which a plurality of connection terminals 11 are supported by a support body 12, the configuration being highly precise, inexpensive, and new, on one principal surface of a wiring substrate; and by sealing the electronic component 102 and the terminal assembly 10 mounted on the one principal surface of the wiring substrate 101, with a first resin layer 103. Also, since the plurality of connection terminals 11 are merely supported by the support body 12, the support body 12 can be easily removed from the plurality of connection terminals 11. Accordingly, the manufacturing time of the module 100 is decreased.
    Type: Grant
    Filed: March 7, 2014
    Date of Patent: November 8, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Nobuaki Ogawa, Yoichi Takagi
  • Patent number: 9414513
    Abstract: A plating layer of a Cu-M-based alloy (M represents Ni and/or Mn) is formed on an end surface of a connection terminal member at an exposed side, the Cu-M-based alloy being capable of generating an intermetallic compound with an Sn-based low-melting-point metal contained in a bonding material forming a bonding portion and having a lattice constant different from that of the intermetallic compound by 50% or more. In the reflow process, even if the bonding material is about to flow out by re-melting thereof, since the bonding material is brought into contact with the Cu-M-based plating layer, a high-melting-point alloy of the intermetallic compound is formed so as to block the interface between the connection terminal member and the resin layer.
    Type: Grant
    Filed: December 19, 2014
    Date of Patent: August 9, 2016
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Hideo Nakagoshi, Yoichi Takagi, Nobuaki Ogawa, Hidekiyo Takaoka, Kosuke Nakono, Akihiko Kamada, Masaaki Mizushiro