Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

Abstract: A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

Abstract: A liquid residue on a bottom surface of a substrate can be reduced while placing the substrate accurately. A liquid processing apparatus includes an inclined portion, a plurality of supporting members, a processing liquid supply unit and a rotation unit. The inclined portion is provided under the substrate, and has an inclined surface which is inclined downwards from an outer side of the substrate toward an inner side thereof and is extended along a circumferential direction of the substrate. The supporting members are protruded from the inclined surface and configured to support the substrate from below. The processing liquid supply unit is configured to supply a processing liquid onto a top surface of the substrate. The rotation unit is configured to rotate the inclined portion. Further, each of the supporting members has a long narrow shape extended from the outer side of the substrate toward the inner side thereof.

Abstract: A substrate processing apparatus includes: a substrate holder; a processing liquid supply nozzle that supplies a processing liquid to a substrate held by the substrate holder; a liquid receiving cup that receives the processing liquid supplied to the substrate; a processing chamber that accommodates the liquid receiving cup and has an opening at an upper side; a shield that shields a region outside the liquid receiving cup in the opening of the processing chamber; a driver that moves the liquid receiving cup between a first processing position separated from the shield and a second processing position above the shield; and a processing liquid guide that causes a processing liquid dropped onto the shield to fall downward.

Abstract: A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

Abstract: A liquid residue on a bottom surface of a substrate can be reduced while placing the substrate accurately. A liquid processing apparatus includes an inclined portion, a plurality of supporting members, a processing liquid supply unit and a rotation unit. The inclined portion is provided under the substrate, and has an inclined surface which is inclined downwards from an outer side of the substrate toward an inner side thereof and is extended along a circumferential direction of the substrate. The supporting members are protruded from the inclined surface and configured to support the substrate from below. The processing liquid supply unit is configured to supply a processing liquid onto a top surface of the substrate. The rotation unit is configured to rotate the inclined portion. Further, each of the supporting members has a long narrow shape extended from the outer side of the substrate toward the inner side thereof.

Abstract: Provided are a rear substrate surface polishing device polishing a rear surface of a substrate, a rear substrate surface polishing system including the rear substrate surface polishing device, a rear substrate surface polishing method used in the rear substrate surface polishing device, and a storage medium for storing a program implemented with the rear substrate surface polishing method. In particular, the rear surface of the substrate is polished by a substrate polishing unit in accordance with information acquired from a prior process performed prior to the polishing process of the rear surface of the substrate at the substrate polishing unit. Further, the substrate polishing unit polishes the substrate with a polishing area determined on the basis of information acquired from a prior process. Furthermore, the polishing is performed by using any one or all of a plurality of substrate polishing units determined on the basis of information acquired from a prior process.

Abstract: To provide a substrate cleaning apparatus capable of effectively removing deposits adhering to at least an end surface of a substrate by means of a sponge-like brush. A substrate cleaning apparatus includes: a spin chuck configured to rotatably hold a substrate W; a motor configured to rotate the substrate W held by the spin chuck; a cleaning-liquid supply mechanism configured to supply a cleaning liquid to the substrate W held by the spin chuck. The cleaning mechanism includes: a brush made of a sponge-like resin, which is brought into contact with at least an end surface of the wafer W during the cleaning; and a brush compressing mechanism configured to compress the brush. The brush is compressed by the compressing mechanism, and cleans at least the end surface of the substrate W.

Abstract: Provided are a rear substrate surface polishing device polishing a rear surface of a substrate, a rear substrate surface polishing system including the rear substrate surface polishing device, a rear substrate surface polishing method used in the rear substrate surface polishing device, and a storage medium for storing a program implemented with the rear substrate surface polishing method. In particular, the rear surface of the substrate is polished by a substrate polishing unit in accordance with information acquired from a prior process performed prior to the polishing process of the rear surface of the substrate at the substrate polishing unit. Further, the substrate polishing unit polishes the substrate with a polishing area determined on the basis of information acquired from a prior process. Furthermore, the polishing is performed by using any one or all of a plurality of substrate polishing units determined on the basis of information acquired from a prior process.

Abstract: A substrate liquid cleaning process is disclosed by utilizing a substrate liquid processing apparatus having, inter alia, a rotating mechanism that rotates a substrate to be cleaned, a peripheral edge cleaning mechanism that cleans the peripheral edge of the substrate by a rotating cleaning body, and a cleaning solution supply mechanism that supplies the cleaning solution to the substrate. The substrate liquid cleaning process is performed by contacting the rotating cleaning body to a peripheral edge of a rotating substrate while supplying a cleaning solution. The rotational direction of the substrate and the cleaning body is set to be an opposite direction so that the proceeding direction of the substrate and the cleaning body becomes the same at a contacting portion where the substrate and the cleaning body are contacted. A rotational speed ratio of the substrate and the cleaning body is set to be about 1:1˜3.5:1.

Abstract: Disclosed are a substrate processing apparatus and a substrate cleaning method to satisfactorily clean the entire circumferential periphery of a substrate, including an upper surface circumferential periphery, an end, and a lower surface circumferential periphery of the substrate. The substrate processing apparatus includes a substrate supporter to support the substrate, a first cleaner to clean the upper surface circumferential periphery of the substrate with a pressurized cleaning liquid, and a second cleaner to clean the end and the lower surface circumferential periphery of the substrate while contacting the end and the lower surface circumferential periphery of the substrate with a cleaning member. The first cleaner cleans the upper surface circumferential periphery of the substrate, and the second cleaner cleans the end and the lower surface circumferential periphery of the substrate.

Abstract: To provide a substrate cleaning apparatus capable of effectively removing deposits adhering to at least an end surface of a substrate by means of a sponge-like brush. A substrate cleaning apparatus includes: a spin chuck 3 configured to rotatably hold a substrate W; a motor 4 configured to rotate the substrate W held by the spin chuck 3; a cleaning-liquid supply mechanism 10 configured to supply a cleaning liquid to the substrate W held by the spin chuck 3. The cleaning mechanism includes: a brush 21 made of a sponge-like resin, which is brought into contact with at least an end surface of the wafer W during the cleaning; and a brush compressing mechanism 23a, 23b, and 24 configured to compress the brush 21. The brush 21 is compressed by the compressing mechanism 23a, 23b, and 24, and cleans at least the end surface of the substrate W.

Abstract: Disclosed is a substrate cleaning apparatus capable of efficiently removing extraneous matters attached on a periphery of the substrate with a brush. The substrate cleaning apparatus includes a spin chuck to rotatably hold a wafer a motor to rotate the wafer held by the spin chuck, a cleaning liquid supplying device to supply cleaning liquid to the wafer held by the spin chuck, and a cleaning device including a brush, a rotating device and a pressing device. The brush includes a periphery cleaning part in contact with a periphery of the wafer during cleaning. The rotating device rotates the brush, and the pressing device pushes the brush to the wafer. The periphery cleaning part includes a changing part. The property of the changing part is changed along a diameter of the periphery cleaning part to distribute cleaning performance.