Patents by Inventor Nobuhiro Imaizumi

Nobuhiro Imaizumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060030071
    Abstract: The present invention realizes a semiconductor device of high reliability which allows metal terminals which have a uniform height, are flat and smooth to be formed under low load and at low costs and to be mounted with low damage. The electrodes 5 and the insulating film 6 are both formed of materials having the property that they are solid and do not exhibit the adhesiveness at room temperature and exhibit the adhesiveness at a temperature not lower than a first temperature and cure at a temperature not lower than a second temperature higher than the first temperature. The surfaces of the electrodes 5 and the insulating film 6 of a semiconductor chip 1a are planarized in continuously flat with a hard cutting tool, as of diamond or others.
    Type: Application
    Filed: August 4, 2005
    Publication date: February 9, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Masataka Mizukoshi, Nobuhiro Imaizumi, Yoshikatsu Ishizuki
  • Publication number: 20060027936
    Abstract: Electrodes and an insulating film are both formed of materials which have characteristics that they are solid and do not exhibit adhesiveness at a room temperature, exhibit adhesiveness at and above a first temperature higher than this, and are cured at and above a second temperature higher than this. Planarication processing is carried out by performing cutting with a hard cutting tool made of diamond and the like so that surfaces film the electrodes and a surface of the insulating film become continuously planar.
    Type: Application
    Filed: December 22, 2004
    Publication date: February 9, 2006
    Applicant: FUJITSU LIMITED
    Inventors: Masataka Mizukoshi, Nobuhiro Imaizumi, Yoshikatsu Ishizuki
  • Publication number: 20050227474
    Abstract: The present invention is aimed at providing a method of connecting base materials capable of forming metal terminals having a uniform height and smooth surface with a low cost, and of realizing a low-damage mounting, in which a work is planarized while keeping the temperature of the insulating film, possibly elevated due to frictional heat generated during cutting using a cutting tool, lower than 80° C., and keeping the temperature range lower than 80° C. throughout the entire period of the cutting, the electrodes and electrodes are opposed and brought into contact at a temperature of 80° C. or above but lower than the curing temperature of the insulating film, the insulating film is liquefied and a space between the electrodes and electrodes is filled with an insulating resin composing the insulating film, and the insulating resin is cured at the curing temperature or above.
    Type: Application
    Filed: December 23, 2004
    Publication date: October 13, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Masataka Mizukoshi, Nobuhiro Imaizumi, Taiji Sakai
  • Publication number: 20050110169
    Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.
    Type: Application
    Filed: December 23, 2004
    Publication date: May 26, 2005
    Applicant: FUJITSU LIMITED
    Inventors: Tomohisa Yagi, Nobuhiro Imaizumi, Yasuhiro Usui, Kenji Fukuzono
  • Patent number: 6873056
    Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: March 29, 2005
    Assignee: Fujitsu Limited
    Inventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
  • Patent number: 6869822
    Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: March 22, 2005
    Assignee: Fujitsu Limited
    Inventors: Tomohisa Yagi, Nobuhiro Imaizumi, Yasuhiro Usui, Kenji Fukuzono
  • Patent number: 6790881
    Abstract: A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.
    Type: Grant
    Filed: September 26, 2002
    Date of Patent: September 14, 2004
    Assignee: Fujitsu Limited
    Inventors: Hiroaki Date, Tomohisa Yagi, Makoto Sasaki, Hideshi Tokuhira, Nobuhiro Imaizumi
  • Publication number: 20040106232
    Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.
    Type: Application
    Filed: November 12, 2003
    Publication date: June 3, 2004
    Applicant: FUJITSU LIMITED
    Inventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
  • Patent number: 6670264
    Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.
    Type: Grant
    Filed: April 18, 2002
    Date of Patent: December 30, 2003
    Assignee: Fujitsu Limited
    Inventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
  • Patent number: 6576081
    Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: June 10, 2003
    Assignee: Fujitsu Limited
    Inventors: Hiroaki Date, Yuko Motoyama, Hideshi Tokuhira, Makoto Usui, Nobuhiro Imaizumi
  • Publication number: 20030080397
    Abstract: A process of making an electrode-to-electrode bond structure includes a step of forming a resin coating on a first bonding object having a first electrode portion in a manner such that the resin coating covers the first electrode portion. Then, an opening is formed in the resin coating to expose the first electrode portion. Then, the opening is filled with a metal paste containing a metal and a resin component. Then, the first bonding object is placed on a second bonding object having a second electrode portion in a manner such that the metal paste filled in the opening faces the second electrode portion while the resin coating contacts the second bonding object. Finally, heat-treatment is performed to cause the first electrode portion and the second electrode portion to be electrically connected with each other via the metal while causing the resin coating to harden.
    Type: Application
    Filed: April 18, 2002
    Publication date: May 1, 2003
    Applicant: Fujitsu Limited
    Inventors: Seiki Sakuyama, Nobuhiro Imaizumi, Tomohisa Yagi
  • Publication number: 20030069333
    Abstract: A single-liquid type adhesive composition contains a main agent, an imidazole serving as a hardener, and a hardening promoter for increased hardening speed. The imidazole has its surface covered by a thermoplastic resin, and the hardening promoter is provided by a modified imidazole composition with its imino group (—NH—) having the H replaced by a specific reaction retarder group.
    Type: Application
    Filed: September 26, 2002
    Publication date: April 10, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Hiroaki Date, Tomohisa Yagi, Makoto Sasaki, Hideshi Tokuhira, Nobuhiro Imaizumi
  • Publication number: 20030049888
    Abstract: According to a method of making a semiconductor device, a semiconductor chip is bonded to a substrate via bumps by flip-chip bonding. Then, a sealing adhesive composition is loaded between the semiconductor chip and the substrate to provide an adhesive sealing. The sealing adhesive composition, which is capable of hardening in two stages, contains at least a first main resin ingredient, a second main resin ingredient and a hardening agent. Then, the adhesive sealing is heated for primary hardening. Then, the substrate is placed on a mother board with a solder material interposed between the substrate and the mother board. Finally, the adhesive sealing is heated for secondary hardening while the solder material is reflowed for bonding the substrate to the mother board.
    Type: Application
    Filed: March 26, 2002
    Publication date: March 13, 2003
    Applicant: Fujitsu Limited
    Inventors: Tomohisa Yagi, Nobuhiro Imaizumi, Yasuhiro Usui, Kenji Fukuzono
  • Patent number: 6522935
    Abstract: In designing the connection correspondence of the control switches to the loads, the control-specification design management system used for the load control devices refers to the connection correspondence stored in the look-up table or a slip file prepared in the preceding design, and presents to a designer candidates for the loads that can be controlled when these are connected to the control switches. While seeing the candidates, the designer selects the most suitable one from among those presented candidates. He designs control-specification information and prints out the contents of the slip file.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: February 18, 2003
    Assignee: Yazaki Corporation
    Inventors: Nobuhiro Imaizumi, Tatsuaki Oniishi
  • Publication number: 20020084019
    Abstract: The present invention is characterized by comprising a two-pack adhesive of an A agent selected from components, an acrylic monomer, a peroxide, a reducing agent, an epoxy resin precursor and a curing agent and containing at least one or two of the acrylic monomer, the peroxide and the reducing agent, and a B agent containing all of the remaining components which are not selected in the A agent. The use of this adhesive makes it possible to stably obtain the bonding free from a thermal stress with the excellent heat resistance and the good reliability.
    Type: Application
    Filed: November 12, 1999
    Publication date: July 4, 2002
    Inventors: HIROAKI DATE, YUKO MOTOYAMA, HIDESHI TOKUHIRA, MAKOTO USUI, NOBUHIRO IMAIZUMI
  • Patent number: 6009105
    Abstract: In a multiplex communication system for a bus vehicle, including: a plurality of loads disposed in the bus vehicle and connected to a wire harness; a switch unit for inputting signals to operate the loads and generating multiplex data; a first load drive unit for controlling the loads placed mainly on a floor of the bus vehicle; and a second load drive unit for controlling the loads placed mainly on a ceiling of the bus vehicle, the multiplex communication system further includes a multiplex line interconnecting the switch unit, the first load drive unit and the second load drive unit, and transmitting the multiplex data to the first and second load drive units to execute a multiplex communication, each the first and second load drive units controlling the loads in accordance with the multiplex data received through the multiplex line from the switch unit. The wire harness can be formed with high assembling performance or productivity in the bus vehicle.
    Type: Grant
    Filed: June 28, 1996
    Date of Patent: December 28, 1999
    Assignee: Yazaki Corporation
    Inventors: Kiyoshi Hosokawa, Nobuhiro Imaizumi, Tatsuaki Oniishi
  • Patent number: 5978352
    Abstract: A multiplex transmission system is made up of a master load control unit which is connected to a multiplex transmission network and is capable of executing a multiplexing operation based on control specification information as a master system, slave load control units capable of the multiplexing operation as a slave system, and a nonvolatile removable external storage unit capable of reading the control specification information as required. Abnormalities associated with the multiplexing operation which arise in the multiplex transmission system are detected, and load control units in an abnormal condition can be restored to a normal condition by resetting.
    Type: Grant
    Filed: July 1, 1996
    Date of Patent: November 2, 1999
    Assignee: Yazaki Corporation
    Inventors: Nobuhiro Imaizumi, Tatsuaki Oniishi
  • Patent number: 5943315
    Abstract: A multiplex transmission system includes a multiplex transmission network through which normality and abnormality processing control specification information (PCSI) for loads are transmitted. A master load control unit (LCU) is connected to the multiplex transmission network. The master load control unit can multiplex the abnormality PCSi for a load as a main operation. A slave load control unit (LCU) is connected to the multiplex transmission network. The slave load control unit can multiplex the abnormality PCSI as a slave operation between itself and the main LCU. A storage device is mounted in the master and slave LCUs. The storage device can update and hold the information and read it at any time. In this multiplex transmission system, multiplexing abnormality can be detected and abnormality processing in the LCU in an abnormal state is controlled to urge its recovery of the LCU to a normal state.
    Type: Grant
    Filed: June 19, 1997
    Date of Patent: August 24, 1999
    Assignee: Yazaki Corporation
    Inventors: Yoshio Iwasawa, Nobuhiro Imaizumi
  • Patent number: 5926010
    Abstract: An overcurrent breaking circuit includes a semiconductor switch inserted in a main current path; a current detector circuit for detecting a current passing through the main current path; a logic circuit for switching off the semiconductor switch when the current detector circuit detects a current exceeding a set value for an overcurrent level; a first unit for prohibiting the logic circuit from performing an operation for switching off the semiconductor switch even if the current detector circuit detects a current exceeding the set value for a first short time period immediately after the semiconductor switch is switched from a breaking state to a conductive state; and a second unit for prohibiting the logic circuit from performing an operation for switching off the semiconductor switch for a second short time period even if the current detector circuit detects a current exceeding the set value when the semiconductor switch remains in a conductive state.
    Type: Grant
    Filed: January 12, 1998
    Date of Patent: July 20, 1999
    Assignee: Yazaki Corporation
    Inventors: Kiyoshi Hosokawa, Nobuhiro Imaizumi
  • Patent number: 5895989
    Abstract: A power supply unit adapted to supply power from a power supply section to a load via a plurality of power supply lines connected by an on/off switch and connectors. The power supply unit includes a load open detection section for detecting an open state between the on/off switch and the load, a monitor section for monitoring the number of times the open state has been entered per unit time based on the detection result of the load open detection section, and a control section for controlling the on/off switch off when the number of times the open state has been entered per unit time is greater than a predetermined number of times.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: April 20, 1999
    Assignee: Yazaki Corporation
    Inventors: Nobuhiro Imaizumi, Hiromichi Hanaoka, Tatsuaki Oniishi