Patents by Inventor Nobuya Nishida

Nobuya Nishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10211642
    Abstract: An electric-power converting device having an inverter circuit of a 4-parallel configuration is realized by a combination of four first to third power semiconductor module devices. In each of module device groups, a single unit of the first power semiconductor module device and a single unit of the second power semiconductor module device are mixedly disposed so as to be alternately disposed. Furthermore, the first to third power semiconductor module devices have circuit element groups which have a common point that each circuit element group includes at least one of first and second transistors and first and second diodes.
    Type: Grant
    Filed: January 9, 2018
    Date of Patent: February 19, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventor: Nobuya Nishida
  • Publication number: 20180233918
    Abstract: An electric-power converting device having an inverter circuit of a 4-parallel configuration is realized by a combination of four first to third power semiconductor module devices. In each of module device groups, a single unit of the first power semiconductor module device and a single unit of the second power semiconductor module device are mixedly disposed so as to be alternately disposed. Furthermore, the first to third power semiconductor module devices have circuit element groups which have a common point that each circuit element group includes at least one of first and second transistors and first and second diodes.
    Type: Application
    Filed: January 9, 2018
    Publication date: August 16, 2018
    Applicant: Mitsubishi Electric Corporation
    Inventor: Nobuya NISHIDA
  • Patent number: 9800130
    Abstract: A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: October 24, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Yoshida, Kyoko Oyama, Yoshikazu Tanaka, Shiori Uota, Nobuya Nishida
  • Publication number: 20170229952
    Abstract: A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit.
    Type: Application
    Filed: April 21, 2017
    Publication date: August 10, 2017
    Applicant: Mitsubishi Electric Corporation
    Inventors: Hiroshi YOSHIDA, Kyoko OYAMA, Yoshikazu TANAKA, Shiori UOTA, Nobuya NISHIDA
  • Patent number: 9685862
    Abstract: A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit.
    Type: Grant
    Filed: June 2, 2014
    Date of Patent: June 20, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Hiroshi Yoshida, Kyoko Oyama, Yoshikazu Tanaka, Shiori Uota, Nobuya Nishida
  • Patent number: 9613888
    Abstract: A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.
    Type: Grant
    Filed: January 10, 2014
    Date of Patent: April 4, 2017
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Hiroyuki Okabe, Nobuya Nishida, Taichi Obara
  • Patent number: 9521737
    Abstract: In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.
    Type: Grant
    Filed: May 20, 2013
    Date of Patent: December 13, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Shinichi Izuo, Masaki Taya, Taichi Obara, Nobuya Nishida
  • Publication number: 20160049358
    Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
    Type: Application
    Filed: October 30, 2015
    Publication date: February 18, 2016
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Rei YONEYAMA, Nobuya NISHIDA, Hiroyuki OKABE
  • Patent number: 9252087
    Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
    Type: Grant
    Filed: July 25, 2013
    Date of Patent: February 2, 2016
    Assignee: Mitsubishi Electric Corporation
    Inventors: Rei Yoneyama, Nobuya Nishida, Hiroyuki Okabe
  • Publication number: 20150289356
    Abstract: In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin.
    Type: Application
    Filed: May 20, 2013
    Publication date: October 8, 2015
    Applicant: Mitsubishi Electric Corporation
    Inventors: Shinichi Izuo, Masaki Taya, Taichi Obara, Nobuya Nishida
  • Publication number: 20150115718
    Abstract: A semiconductor device includes: a voltage-dividing resistor circuit including first and second resistors connected in series between a power supply potential and a reference potential and outputting a potential at a point of connection between the first and second resistors; a transient response detection circuit including a third resistor having a first end connected to the power supply potential and a capacitor connected between a second end of the third resistor and the reference potential, and outputting a potential at a point of connection between the third resistor and the capacitor; an AND circuit ANDing an output signal of the voltage-dividing resistor circuit and an output signal of the transient response detection circuit; and an output circuit, wherein switching of the output circuit is controlled by an output signal of the AND circuit.
    Type: Application
    Filed: June 2, 2014
    Publication date: April 30, 2015
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Hiroshi YOSHIDA, Kyoko OYAMA, Yoshikazu TANAKA, Shiori UOTA, Nobuya NISHIDA
  • Publication number: 20140291825
    Abstract: A semiconductor device in the preferred embodiment includes: a lead frame comprising a die pad and an electrode terminal; and at least one semiconductor chip bonded to a surface of the die pad, wherein the lead frame excluding a bottom surface thereof and the semiconductor chip are sealed by a sealing resin, and an unevenness is introduced on a bonding interface between the surface of the die pad and the semiconductor chip.
    Type: Application
    Filed: January 10, 2014
    Publication date: October 2, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Rei YONEYAMA, Hiroyuki OKABE, Nobuya NISHIDA, Taichi OBARA
  • Publication number: 20140138706
    Abstract: An electronic circuit according to this invention includes a printed circuit board and an electronic component that is soldered onto the printed circuit board. The electronic component is a flat package including a die pad exposed to outside and external electrode terminals. A gap is provided between the printed circuit board and the electronic component. The printed circuit board is provided with a hole between the die pad and the external electrode terminals in planar view. The gap is filled with insulating resin at least partially between the die pad and the external electrode terminals. The insulating resin is injected through the hole.
    Type: Application
    Filed: July 25, 2013
    Publication date: May 22, 2014
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Rei YONEYAMA, Nobuya NISHIDA, Hiroyuki OKABE
  • Patent number: 7619503
    Abstract: A power semiconductor apparatus is provided with power controlling semiconductor modules connected in parallel to each other. Each power controlling semiconductor module controls driving of a power semiconductor device. The power semiconductor apparatus includes a transmission circuit and a reception circuit provided in one and another power controlling semiconductor modules, respectively. The transmission circuit transmits a predetermined communication signal to another power controlling semiconductor module based on a predetermined activation signal generated by one power controlling semiconductor module. The reception circuit receives the transmitted communication signal, and controls driving control operation of another power controlling semiconductor module based on the received communication signal.
    Type: Grant
    Filed: January 23, 2006
    Date of Patent: November 17, 2009
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Motonobu Joukou, Masanori Fukunaga, Nobutake Taniguchi, Takahiro Inoue, Nobuya Nishida
  • Publication number: 20060193091
    Abstract: A power semiconductor apparatus is provided with power controlling semiconductor modules connected in parallel to each other. Each power controlling semiconductor module controls driving of a power semiconductor device. The power semiconductor apparatus includes a transmission circuit and a reception circuit provided in one and another power controlling semiconductor modules, respectively. The transmission circuit transmits a predetermined communication signal to another power controlling semiconductor module based on a predetermined activation signal generated by one power controlling semiconductor module. The reception circuit receives the transmitted communication signal, and controls driving control operation of another power controlling semiconductor module based on the received communication signal.
    Type: Application
    Filed: January 23, 2006
    Publication date: August 31, 2006
    Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA
    Inventors: Motonobu Joukou, Masanori Fukunaga, Nobutake Taniguchi, Takahiro Inoue, Nobuya Nishida
  • Patent number: 4783740
    Abstract: The inventory management system comprises a central control unit, a number of parts terminal units deposed at each parts container, and some guide terminal units arranged at each parts container shelf. A worker goes to a parts container in accordance with the guidance on the guide terminal units, performs parts storing, parts collecting or stocktaking jobs in accordance with a job display and parts quantity display on the parts terminal unit and can also correct a displayed parts quantity if the quantity displayed is not correct.
    Type: Grant
    Filed: December 24, 1986
    Date of Patent: November 8, 1988
    Assignees: Kabushiki Kaisha Toshiba, Yamato Electric Industry Co., Ltd.
    Inventors: Toshimichi Ishizawa, Ryuichi Nakagawa, Youji Yamaguchi, Takashi Kobayashi, Yoshihisa Toyoda, Nobuya Nishida, Yoshitaka Naya, Hiroshi Araki, Isao Adachi, Akimichi Ishikawa, Eiji Ootaki, Masayuki Nagatsuka