Patents by Inventor Nobuya Nishio

Nobuya Nishio has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11673522
    Abstract: A front bumper includes a bumper fascia, an upper panel, and a shock absorbing member and a rigidity member in the interior of the upper panel. The shock absorbing member is formed in a hat shape in cross section by a front wall, an upper wall (a front-side upper wall and a rear-side upper wall), a rear wall, and a lower wall. The rigidity member includes an upper end portion fixed to the upper wall, a lower end portion fixed to the lower wall, and an intermediate portion connecting the upper end portion and the lower end portion in the vehicle up-down direction. The intermediate portion is spaced apart from the rear wall in the vehicle front-rear direction.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: June 13, 2023
    Assignee: MAZDA MOTOR CORPORATION
    Inventors: Nobuya Nishio, Hiroshi Mizuguchi
  • Patent number: 11628885
    Abstract: A vehicle-body structure of a vehicle of the present invention comprises a bumper support portion provided at a vehicle body of the vehicle to support to bumper, a connection portion connecting the bumper and the bumper support portion and supporting the bumper, and a slide allowance portion configured to allow the bumper to slide in a vehicle longitudinal direction relative to the bumper support portion when a longitudinal load having a specified magnitude or larger is applied to the bumper from a vehicle outside, wherein the connection portion is provided on an upper face of the bumper support portion, and the slide allowance portion is configured to allow the longitudinal sliding of the bumper independently from the supporting of the bumper by the connection portion.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 18, 2023
    Assignee: MAZDA MOTOR CORPORATION
    Inventor: Nobuya Nishio
  • Publication number: 20220153351
    Abstract: A vehicle-body structure of a vehicle of the present invention comprises a bumper support portion provided at a vehicle body of the vehicle to support to bumper, a connection portion connecting the bumper and the bumper support portion and supporting the bumper, and a slide allowance portion configured to allow the bumper to slide in a vehicle longitudinal direction relative to the bumper support portion when a longitudinal load having a specified magnitude or larger is applied to the bumper from a vehicle outside, wherein the connection portion is provided on an upper face of the bumper support portion, and the slide allowance portion is configured to allow the longitudinal sliding of the bumper independently from the supporting of the bumper by the connection portion.
    Type: Application
    Filed: September 8, 2021
    Publication date: May 19, 2022
    Applicant: MAZDA MOTOR CORPORATION
    Inventor: Nobuya NISHIO
  • Publication number: 20220111809
    Abstract: A front bumper includes a bumper fascia, an upper panel, and a shock absorbing member and a rigidity member in the interior of the upper panel. The shock absorbing member is formed in a hat shape in cross section by a front wall, an upper wall (a front-side upper wall and a rear-side upper wall), a rear wall, and a lower wall. The rigidity member includes an upper end portion fixed to the upper wall, a lower end portion fixed to the lower wall, and an intermediate portion connecting the upper end portion and the lower end portion in the vehicle up-down direction. The intermediate portion is spaced apart from the rear wall in the vehicle front-rear direction.
    Type: Application
    Filed: October 6, 2021
    Publication date: April 14, 2022
    Applicant: Mazda Motor Corporation
    Inventors: Nobuya NISHIO, Hiroshi MIZUGUCHI
  • Patent number: 7371842
    Abstract: It is intended to provide a protein participating in the regulation of sugar production, a polynucleotide encoding the same, a method of screening a compound participating in the regulation of sugar production and a drug for treating or preventing diabetes which contains the compound participating in the regulation of sugar production. A polynucleotide encoding a protein specifically binding to a substance WF00144 is found out from rat liver cells and thus a protein participating in the regulation of sugar production and a polynucleotide encoding the same are provided. Moreover, a method and a substance relating to a method of treating and preventing diabetes are found out and thus a method of treating diabetes relating to the regulation of sugar production relating to the method of treating and preventing diabetes is provided.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: May 13, 2008
    Assignee: Astellas Pharma Inc.
    Inventors: Hidenori Nakajima, Mitsuru Ohkubo, Seiji Yoshimura, Nobuya Nishio, Kaori Nishio
  • Publication number: 20050214858
    Abstract: It is intended to provide a protein participating in the regulation of sugar production, a polynucleotide encoding the same, a method of screening a compound participating in the regulation of sugar production and a drug for treating or preventing diabetes which contains the compound participating in the regulation of sugar production. A polynucleotide encoding a protein specifically binding to a substance WF00144 is found out from rat liver cells and thus a protein participating in the regulation of sugar production and a polynucleotide encoding the same are provided. Moreover, a method and a substance relating to a method of treating and preventing diabetes are found out and thus a method of treating diabetes relating to the regulation of sugar production relating to the method of treating and preventing diabetes is provided.
    Type: Application
    Filed: April 28, 2003
    Publication date: September 29, 2005
    Applicant: FUJISAWA PHARMACEUTICAL CO. LTD
    Inventors: Hidenori Nakajima, Mitsuru Ohkubo, Seiji Yoshimura, Nobuya Nishio, Kaori Nishio
  • Patent number: 6525548
    Abstract: The present invention provides a check pattern for evaluating the result of via openings during fabrication of a semiconductor device. The check pattern uses a Wheatstone bridge circuit so as to eliminate any influence of variation of wiring resistance and/or contact resistance. In the bridge circuit, four terminals are provided, namely first, second, third and fourth terminals. Each of four sides of the bridge circuit is defined by connecting an upper conductor layer including one terminal, a sub-group of via openings belonging to one group, a lower conductor layer, the other sub-group of via openings belonging to the same group, and an upper conductor layer including another terminal.
    Type: Grant
    Filed: November 10, 2000
    Date of Patent: February 25, 2003
    Assignee: NEC Corporation
    Inventor: Nobuya Nishio
  • Patent number: 6359145
    Abstract: Imidazole compounds having adenosine deaminase inhibitory activity represented by formula (I) wherein R1 is hydrogen, hydroxy, protected hydroxy, or aryl optionally substituted with suitable substituent(s); R2 is hydrogen or lower alkyl; R3 is hydroxy or protected hydroxy; R4 is cyano, (hydroxy)iminoamino(lower)alkyl, carboxy, protected carboxy, heterocyclic group optionally substituted with amino, or carbamoyl optionally substituted with suitable substituent(s); and —A— is —Q— or —O—Q—, wherein Q is single bond or lower alkylene, provided that when R2 is lower alkyl, then R1 is hydroxy, protected hydroxy, or aryl optionally substituted with suitable substituent(s), its prodrug, or their salt. The compounds are useful for treating and/or preventing diseases for which adenosine is effective.
    Type: Grant
    Filed: March 9, 2001
    Date of Patent: March 19, 2002
    Assignee: Fujisawa Pharmaceutical Co., Ltd.
    Inventors: Tadashi Terasaka, Katsuya Nakamura, Nobuo Seki, Masako Kuno, Susumu Tsujimoto, Akihiro Sato, Isao Nakanishi, Takayoshi Kinoshita, Nobuya Nishio, Hiroyuki Okumura, Kiyoshi Tsuji
  • Patent number: 5229317
    Abstract: According to this invention, an isolation trench is formed in a semiconductor substrate. A first insulating film is formed on a surface of the semiconductor substrate and an inner surface of the trench. A silicon oxide film containing phosphorus and boron is buried in the trench in which the first insulating film is formed. A second insulating film pattern having a width larger than that of the trench is formed on the trench and a peripheral portion of the trench. The second insulating film pattern prevents out-diffusion phosphorus and boron in the silicon oxide film. The first insulating film which is not covered with the second insulating film pattern is removed to form a first insulating film pattern. The surface of the semiconductor substrate which is not covered with the first and second insulating film patterns is thermally oxidized.
    Type: Grant
    Filed: September 9, 1992
    Date of Patent: July 20, 1993
    Assignee: NEC Corporation
    Inventor: Nobuya Nishio