Abstract: An imaging lens unit capable of more effectively suppressing positional deviation of a lens element and a simple manufacturing method thereof. In the imaging lens unit 1, adjacent lens elements of a first lens element 10, a second lens element 20, a third lens element 30, a fourth lens element 40 and a fifth lens element 50, a lens barrel 2 and the first lens element 10, and the lens barrel 2 and the fifth lens element 50 are bonded at a surface modification portion formed by irradiation with vacuum ultraviolet light.

Abstract: Disclosed is a gas purge filter used in a housing container provided with a container main body and a lid body. The gas purge filter has a filter housing having a ventilation space where gas outside the housing container and gas of a housing space can be ventilated, and a pad formed outside the housing space of the filter housing to cover an outer peripheral face of a nozzle portion that forms a part of the ventilation space. The pad is formed of an elastic body.

Abstract: A filtration device (1) includes a filter housing (10) having at least one axial direction stopper for restricting displacement of a filter cartridge (20) in a housing axial direction, and at least one rotational direction stopper for restricting displacement of the filter cartridge (20) in a rotational direction around a housing axis, wherein the filter cartridge (20) is removably secured to a bowl (11) within the filter housing (10) by the at least one axial direction stopper and the at least one rotational direction stopper.

Abstract: An imaging lens unit capable of more effectively suppressing positional deviation of a lens element and a simple manufacturing method thereof. In the imaging lens unit 1, adjacent lens elements of a first lens element 10, a second lens element 20, a third lens element 30, a fourth lens element 40 and a fifth lens element 50, a lens barrel 2 and the first lens element 10, and the lens barrel 2 and the fifth lens element 50 are bonded at a surface modification portion formed by irradiation with vacuum ultraviolet light.

Abstract: Disclosed is a gas purge filter used in a housing container provided with a container main body and a lid body. The gas purge filter has a filter housing having a ventilation space where gas outside the housing container and gas of a housing space can be ventilated, and a pad formed outside the housing space of the filter housing to cover an outer peripheral face of a nozzle portion that forms a part of the ventilation space. The pad is formed of an elastic body.

Abstract: A near-field optical head which can be manufactured using a silicon process and illuminate and detect sufficient light from a very small aperture at all times in a state of stably proximate to a media. The near-field optical head (3000) is structured by a very small aperture (3008) formed at an apex of a taper, a light introducing part (3002) for propagating light in a direction generally parallel with a media, and a light reflection layer (3001) for reflecting the light propagated through the light introducing part (3002) toward the very small aperture (3008). Furthermore, a focusing function is structurally provided for illuminating the light focused on the very small aperture (3008).

Abstract: A wafer-retaining unit has a plurality of vertically superimposed single-wafer retaining sections, each having a wafer-retaining frame abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer, a wafer-securing frame disposed vertically movably relative to the wafer-retaining frame to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer, and wafer lift members that lift the semiconductor wafer to a position where it is upwardly separate from the wafer-retaining frame and keeps the semiconductor wafer in this position. Consequently, a plurality of semiconductor wafers can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers. At the same time, the semiconductor wafers can be loaded and unloaded satisfactorily.

Abstract: A near-field optical head has a planar substrate having a first surface, a second surface disposed opposite to the first surface, and an inverted pyramidal hole extending through the first and second surfaces. The inverted pyramidal hole has at least one fine aperture formed at an apex thereof and disposed in the first surface and having at least one curved slant surface. An optical waveguide extends into the inverted pyramidal hole of the planar substrate for propagating light along an optical path. A mirror is disposed in the optical waveguide for bending in the direction of the fine aperture the optical path of the light propagated through the optical waveguide.

Abstract: An information reproducing apparatus has a medium with a linear tracking mark extending in a scanning direction and a linear data mark extending in a direction orthogonal to the scanning direction. A light control unit irradiates the data mark with a first near-field light polarized in the scanning direction and irradiates the tracking mark with a second near-field light polarized in the direction orthogonal to the scanning direction. A detector detects light scattered by the data mark and the tracking mark irradiated with the first near-field light and the second near-field light, respectively. A signal processing unit processes a first output signal from the detector corresponding to the detected light scattered by the data mark and processes a second output signal from the detector corresponding to the detected light scattered by the tracking mark.

Abstract: An elastic wafer-retaining cushion sheet is disposed at a wafer retaining position on the top of a wafer tray. The wafer-retaining cushion sheet has a releasably suction-adhering surface that releasably adheres by suction to the wafer tray. Consequently, there is no likelihood of the semiconductor wafer being damaged during transport or the like. In addition, the wafer-retaining cushion sheet can be readily attached to and detached from the wafer tray for washing or replacement according to need.

Abstract: An elastic wafer-retaining cushion sheet is disposed at a wafer retaining position on the top of a wafer tray. The wafer-retaining cushion sheet has a releasably suction-adhering surface that releasably adheres by suction to the wafer tray. Consequently, there is no likelihood of the semiconductor wafer being damaged during transport or the like. In addition, the wafer-retaining cushion sheet can be readily attached to and detached from the wafer tray for washing or replacement according to need.

Abstract: A wafer container with wafer-mounting cushion sheets prevents breaking and damage of semiconductor wafers due to impacts or repetitive warping by maintaining the semiconductor wafer in a flat state and enables the semiconductor wafer to be removed safely and easily without damage. The surface of each wafer-mounting cushion sheet includes a self-sucking portion for exerting a removable vacuum on the semiconductor wafer and a non-sucking portion for enabling separation of the semiconductor wafer.

Abstract: A near-field optical head has a planar substrate having a first surface, a second surface disposed opposite to the first surface, and an inverted conical or pyramidal hole extending through the first and second surfaces. The inverted conical or pyramidal hole has at least one fine aperture formed at an apex thereof and disposed in the first surface and having at least one curved slant surface. An optical waveguide extends into the inverted conical or pyramidal hole of the planar substrate for propagating light along an optical path. A mirror is disposed in the optical waveguide for bending in the direction of the fine aperture the optical path of the light propagated through the optical waveguide.

Abstract: An information reproducing apparatus has a medium with a linear tracking mark extending in a scanning direction and a linear data mark extending in a direction orthogonal to the scanning direction. A light control unit irradiates the data mark with a first near-field light polarized in the scanning direction and irradiates the tracking mark with a second near-field light polarized in the direction orthogonal to the scanning direction. A detector detects light scattered by the data mark and the tracking mark irradiated with the first near-field light and the second near-field light, respectively. A signal processing unit processes a first output signal from the detector corresponding to the detected light scattered by the data mark and processes a second output signal from the detector corresponding to the detected light scattered by the tracking mark.

Abstract: The object of the present invention is to provide an information recording/reproduction device for implementing high-density information recording and reading using mutual interaction of a recording medium with near field light, and particularly to a near field optical head with a high optical efficiency and a manufacturing method thereof. This is achieved by enabling an energy propagation mechanism via a plasmon by forming a layer dispersed with metal particulate at a microscopic opening generating near field light, and therefore increase optical efficiency.

Abstract: A wafer container with wafer-mounting cushion sheets prevents breaking and damage of semiconductor wafers due to impacts or repetitive warping by maintaining the semiconductor wafer in a flat state and enables the semiconductor wafer to be removed safely and easily without damage. The surface of each wafer-mounting cushion sheet includes a self-sucking portion for exerting a removable vacuum on the semiconductor wafer and a non-sucking portion for enabling separation of the semiconductor wafer.

Abstract: A near-field optical probe has a planar substrate formed with a through-hole and a phase shifter layer translucent to light having a wavelength of illumination light used to illuminate the substrate for producing near-field light. The phase shifter layer is effective to cause a shift of phase in the illumination light by 180 degrees and is provided on the substrate so as to cover one opening of the through-hole to form a microscopic aperture for producing near-field light.

Abstract: A wafer-retaining unit (20) has a plurality of vertically superimposed single-wafer retaining sections (21 to 23), each having a wafer-retaining frame (21) abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer (W), a wafer-securing frame (22) disposed vertically movably relative to the wafer-retaining frame (21) to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer (W), and wafer lift members (23) that lift up the semiconductor wafer (W) to a position where it is upwardly separate from the wafer-retaining frame (21) and keep the semiconductor wafer (W) in this position. Consequently, a plurality of semiconductor wafers (W) can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers (W). At the same time, the semiconductor wafers (W) can be loaded and unloaded satisfactorily.

Abstract: A near-field optical head has a planar substrate having a first surface, a second surface disposed opposite to the first surface, and an inverted conical or pyramidal hole extending through the first and second surfaces. The conical or pyramidal hole has at least one fine aperture formed at an apex thereof and is disposed on the first surface of the planar substrate. An optical waveguide is disposed on the second surface of the planar substrate for propagating light. A light reflection film is disposed in the optical waveguide for reflecting in the direction of the fine aperture light propagated through the optical waveguide.

Abstract: A wafer-retaining cushion sheet (5) has a wafer suction-adhering surface (5C) formed on a surface thereof, which adheres by suction to a semiconductor wafer (W). A wafer tray (1) is provided with a plurality of bottom openings (17) opening to the reverse side of the wafer-retaining cushion sheet (5), an air chamber (16) communicating with the bottom openings, and an air inlet (11) for supplying pressurized air into the air chamber (16) from the outside. Consequently, when pressurized air is supplied into the air chamber (16) through the air inlet (11) to increase the air pressure in the air chamber (16), the wafer-retaining cushion sheet (5) is elastically deformed into an inflated form at regions facing the bottom openings (17), thus causing separation between the semiconductor wafer (W) and at least a part of the wafer suction-adhering surface (5C) of the wafer-retaining cushion sheet (5).