Patents by Inventor Nobuyuki Kurashima

Nobuyuki Kurashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10524388
    Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
    Type: Grant
    Filed: August 28, 2018
    Date of Patent: December 31, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Patent number: 10495386
    Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 3, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Takahiko Kiso, Nobuyuki Kurashima
  • Patent number: 10497640
    Abstract: A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.
    Type: Grant
    Filed: June 12, 2018
    Date of Patent: December 3, 2019
    Assignee: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Publication number: 20190277574
    Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.
    Type: Application
    Filed: May 30, 2019
    Publication date: September 12, 2019
    Inventors: Nobuyuki KURASHIMA, Yoshihiro MACHIDA
  • Patent number: 10408546
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; and a vapor line that connects the evaporator and the condenser, wherein the evaporator, the vapor line, the liquid line and the condenser form a flow path that is a loop through which the working fluid or vapor of the working fluid flows, wherein in the condenser and the vapor line, a wall portion of the flow path is constituted by a metal layer, wherein a drain line formed to be separated and apart from the flow path is provided in the wall portion, and wherein a drawing line connecting the drain line and the flow path is provided in the wall portion.
    Type: Grant
    Filed: October 17, 2017
    Date of Patent: September 10, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Yoshihiro Machida
  • Publication number: 20190264989
    Abstract: A flat loop heat pipe includes an evaporator that vaporizes a working fluid, a condenser that liquefies the working fluid vaporized by the evaporator, a vapor pipe that connects the evaporator to the condenser, and a liquid pipe that connects the condenser to the evaporator. The liquid pipe includes a first wick. The condenser includes a flow passage and a second wick. The flow passage connects the vapor pipe and the liquid pipe. The second wick is connected to the first wick. The second wick is exposed in the flow passage and extends from the flow passage in a planar direction.
    Type: Application
    Filed: February 15, 2019
    Publication date: August 29, 2019
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Patent number: 10352626
    Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.
    Type: Grant
    Filed: November 9, 2017
    Date of Patent: July 16, 2019
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Yoshihiro Machida
  • Publication number: 20190204017
    Abstract: A loop heat pipe includes a stacked structure formed by metal layers that are stacked, including an outermost metal layer arranged at one outermost surface of the loop heat pipe. The stacked structure forms an evaporator configured to vaporize a working fluid and generate vapor, a condenser configured to liquefy the vapor of the working fluid, a vapor pipe configured to connect the evaporator and the condenser, and a liquid pipe configured to connect the evaporator and the condenser, to form a loop-shaped passage. The outermost metal layer has an outer surface formed with grooves.
    Type: Application
    Filed: November 28, 2018
    Publication date: July 4, 2019
    Inventors: Takahiko KISO, Nobuyuki KURASHIMA
  • Publication number: 20190090385
    Abstract: A loop heat pipe includes a first heat pipe portion and a second heat pipe portion. The first heat pipe portion includes a first evaporator, a first condenser, a first vapor tube, and a first liquid tube. The second heat pipe portion includes a second evaporator, a second condenser, a second vapor tube, and a second liquid tube. The loop heat pipe further includes a connecting portion that connects the first condenser and the second condenser.
    Type: Application
    Filed: August 28, 2018
    Publication date: March 21, 2019
    Applicant: Shinko Electric Industries Co., LTD.
    Inventors: Yoshihiro Machida, Nobuyuki Kurashima
  • Publication number: 20190017749
    Abstract: A loop heat pipe includes a first loop heat pipe including a first evaporator, a first condenser, a first liquid pipe, and a first vapor pipe forming a first loop together with the first liquid pipe, a second loop heat pipe including a second evaporator, a second condenser, a second liquid pipe, and a second vapor pipe forming a second loop together with the second liquid pipe, and a connecting part to connect the first condenser and the second evaporator. The first loop and the second loop are separate and independent from each other. The first loop heat pipe, the second loop heat pipe, and the connecting part are integrally formed by a metal.
    Type: Application
    Filed: June 29, 2018
    Publication date: January 17, 2019
    Inventor: Nobuyuki KURASHIMA
  • Publication number: 20190013257
    Abstract: A heat pipe containing a working fluid includes a first metal layer and a second metal layer. The first metal layer includes an upper surface and bottomed holes depressed from the upper surface. The second metal layer includes a lower surface that is joined with the upper surface of the first metal layer and a recess that is depressed from the lower surface. The recess forms a vapor layer in which vapor vaporized from the working fluid moves. Adjacent bottomed holes are in communication with each other so that the bottomed holes form a liquid layer in which the working fluid liquefied from the vapor moves.
    Type: Application
    Filed: June 12, 2018
    Publication date: January 10, 2019
    Applicant: Shinko Electric Industries Co., LTD.
    Inventor: Nobuyuki Kurashima
  • Publication number: 20180164043
    Abstract: A heat pipe includes a first metal layer forming a liquid layer configured to move a working fluid that is liquefied from vapor, and a second metal layer forming a vapor layer configured to move the vapor of the working fluid that is vaporized. The first metal layer includes first cavities that cave in from a first surface of the first metal layer and are arranged apart from each other, second cavities that cave in from a second surface of the first metal layer opposite to the first surface of the first metal layer, first pores partially communicating with the first cavities and the second cavities, respectively, and second pores partially communicating side surfaces of the second cavities that are adjacent to each other. The second metal layer is provided on the first surface of the first metal layer and includes an opening exposing the plurality of first cavities.
    Type: Application
    Filed: November 9, 2017
    Publication date: June 14, 2018
    Inventors: Nobuyuki KURASHIMA, Yoshihiro MACHIDA
  • Publication number: 20180142960
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; and a vapor line that connects the evaporator and the condenser, wherein the evaporator, the vapor line, the liquid line and the condenser form a flow path that is a loop through which the working fluid or vapor of the working fluid flows, wherein in the condenser and the vapor line, a wall portion of the flow path is constituted by a metal layer, wherein a drain line formed to be separated and apart from the flow path is provided in the wall portion, and wherein a drawing line connecting the drain line and the flow path is provided in the wall portion.
    Type: Application
    Filed: October 17, 2017
    Publication date: May 24, 2018
    Inventors: Nobuyuki KURASHIMA, Yoshihiro MACHIDA
  • Publication number: 20180058767
    Abstract: A loop heat pipe includes an evaporator that vaporizes working fluid; a condenser that condenses the working fluid; a liquid line that connects the evaporator and the condenser; a vapor line that connects the evaporator and the condenser to form a loop with the liquid line; and a porous body provided in the liquid line, and including a first metal layer that includes a first bottomed hole that is concaved from one surface of the first metal layer, and a second bottomed hole that is concaved from another surface of the first metal layer, the other surface being opposite of the one surface, the first bottomed hole and the second bottomed hole partially communicating with each other to form a pore.
    Type: Application
    Filed: August 16, 2017
    Publication date: March 1, 2018
    Inventors: Yoshihiro MACHIDA, Nobuyuki KURASHIMA
  • Patent number: 9137900
    Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. A first encapsulating resin is formed between the first substrate and the second substrate to encapsulate the electronic component. A second encapsulating resin is formed on a first surface of the first encapsulating resin to fill a space between the first encapsulating resin and the second substrate. The spacer unit includes a stacked structure of a first solder ball, a metal post, and a second solder ball stacked in a stacking direction of the first substrate and the second substrate.
    Type: Grant
    Filed: August 16, 2013
    Date of Patent: September 15, 2015
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka, Tetsuya Koyama
  • Patent number: 9059088
    Abstract: An electronic component built-in substrate, includes a lower wiring substrate, an electronic component mounted on the lower wiring substrate, an intermediate wiring substrate including an opening portion in which the electronic component is mounted, and arranged in a periphery of the electronic component, and connected to the lower wiring substrate via a first conductive ball, an upper wiring substrate arranged over the electronic component and the intermediate wiring substrate, and connected to the intermediate wiring substrate via a second conductive ball, and a resin filled into respective areas between the lower wiring substrate, the intermediate wiring substrate, and the upper wiring substrate, and sealing the electronic component, wherein the first conductive ball and the second conductive ball are arranged in displaced positions mutually.
    Type: Grant
    Filed: July 17, 2013
    Date of Patent: June 16, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Nobuyuki Kurashima, Tetsuya Koyama, Hajime Ilzuka, Koichi Tanaka
  • Patent number: 9036362
    Abstract: An electronic component incorporated substrate includes a first substrate and a second substrate that are electrically connected to each other by a spacer unit. An electronic component is mounted on the first substrate and arranged between the first substrate and the second substrate. An encapsulating resin fills a space between the first substrate and the second substrate to encapsulate the electronic component. The spacer unit includes a stacked structure of a metal post and a solder ball stacked in a stacking direction of the first substrate and the second substrate. The spacer unit further includes an insulation layer that is formed on the second substrate and covers a side wall of the metal post.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: May 19, 2015
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka, Satoshi Shiraki
  • Patent number: 8987919
    Abstract: A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: March 24, 2015
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka, Satoshi Shiraki
  • Publication number: 20140210109
    Abstract: A built-in electronic component substrate includes a first substrate, an electronic component including side surfaces and mounted on the first substrate, a first resin provided on the first substrate and covering the side surfaces of the electronic component, a second substrate provided above the electronic component and the first resin and layered on the first substrate, a substrate connection member provided between the first and the second substrates and electrically connecting the first and the second substrates, a second resin filling in between the electronic component and the second substrate and in between the first resin and the second substrate, and a third resin filling in between the first and the second substrates and encapsulating the substrate connection member, the electronic component, the first resin, and the second resin.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 31, 2014
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Koichi TANAKA, Nobuyuki KURASHIMA, Hajime IIZUKA, Satoshi SHIRAKI
  • Patent number: 8736053
    Abstract: A circuit substrate having a mounting surface on which a semiconductor chip is mounted and at least one connection pad formed on the mounting surface is connected to a support plate having at least one mounting portion with a diameter larger than a diameter of the connection pad, through a truncated-cone-shaped solder layer which is formed from at least one solder ball on the basis of a difference between the diameter of the mounting portion and the diameter of the connection pad.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: May 27, 2014
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Koichi Tanaka, Nobuyuki Kurashima, Hajime Iizuka, Tetsuya Koyama