Abstract: There is provided a double-face driving silent chain wherein the size of each inner link plate of an exterior driving link train to a back face thereof is set to be equal to or greater than the size of each link plate of an interior driving link train. Thereby, inner side planes of the back face of the inner link plate abut against the both side planes of an interior driving sprocket and guide and prevent the silent chain from engaging with the sprocket in twist. All the link plates, other than the inner link plates of the exterior driving link train, have the same shape when seen from the side and the outermost link plate of the interior driving link train is thin as compared to the other link plates.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: A socket fixed to a heat sink holds a card-type LED module formed by integrating LED elements. The socket (6) includes: a frame structure for holding the LED module (1000) with its light source unit exposed through the frame opening; and a pressing member positioned around the opening for pressing the back surface of the LED module against the heat sink (2122). The socket may include a structure including a lower member (61) placed on a heat sink and an upper frame member (62) holding the LED module with its light source unit (1002) exposed through the frame opening. The upper member supported by the lower member via a hinge can open/close, and includes a pressing unit pressing the LED module set in the open state, against the lower member (61). The lower member (61) includes, in its main part, a lock unit (63) directly or indirectly lock the upper member (62) when the upper member is closed.

Abstract: A method of constructing underground galleries using a pneumatic transfer system and a stratum disposal method are provided, wherein in constructing a disposal gallery of a stratum disposal site and tunnels such as mountain tunnels or in performing stratum disposal of waste matter, the carrying-out of excavation chips or the like, the carrying-in of materials and equipment or the like and the carrying-in and positioning of waste matter may be effected safely, quickly and reliably at low cost, and the buffer material quality for waste matter may be secured. In construction, an air carrying pipeline (10) is used while extending the air carrying pipeline (10) downward as desired during excavation of a vertical shaft (2) so as to carry out vertical shaft excavation chips (a) to the ground and carry in materials and equipment including vertical shaft spray concrete (b) to the underground site.

Abstract: A wiring board used for mounting an LED bare chip capable of firmly bonding the LED bare chip and improving yield. In a printed wiring board 2, a distance D between wiring patterns 81 and 85 disposed so as to oppose each other is the smallest at a position nearest to a center point (G) of an LED chip 14 disposed at a designed location, and increases with an increasing distance from the point G. In addition, pattern edges 83 and 87 of the wiring patterns 81 and 85 recede in the direction of widening the distance D as a distance from the center point G increases with respect to electrode edges 148 and 149 of the LED chip 14.

Abstract: An LED illumination source is disclosed. The illumination source includes a metal base substrate including a line pattern and an insulating layer including a composite material with an inorganic filler and a resin composition. LED bare chips are mounted on one surface of the metal base substrate An optical reflector with holes to surround the bare chips is provided on the surface of the metal base substrate on which the LED bare chips are mounted. Stress relaxing means is provided between the metal base substrate and the optical reflector.

Abstract: In a module socket, a connecter and a connector are connected by wiring, and three LED modules are connected in parallel with respect to a constant voltage circuit unit via the wiring. Each module has a constant current circuit unit and an LED mounting unit. The constant current circuit unit includes one resistor and two transistors mounted on a surface of a sub-substrate on which a conductive land is formed. The sub-substrate is bonded to a main substrate.

Abstract: An illumination light source includes four different types of LEDs, namely a blue light-emitting diode 11 emitting blue light, a blue-green light-emitting diode 12 emitting blue-green light, an orange light-emitting diode 13 emitting orange light and a red light-emitting diode 14 emitting red light.

Abstract: A metal base wiring board including: an insulation substrate composed of an upper insulation layer and a lower insulation layer; and a metal base attached to a rear surface of the insulation substrate. In front surfaces of the upper and lower insulation layers, wiring patterns are embedded and connected to each other. The insulation substrate has a plurality of recesses whose bottom faces are exposed areas of the front surface of the lower insulation layer. LED bare chips are mounted on the bottom faces of the recesses so as to be connected to the wiring pattern of the lower insulation layer.

Abstract: A number of red LEDs, green LEDs, and blue LEDs are mounted on one surface of a polygonal flexible multilayer substrate. The LEDs are connected in series according to color. A red feeder terminal, a green feeder terminal, a blue feeder terminal, and a common terminal are provided on each of at least three sides of the periphery of the flexible multilayer substrate. Circuit patterns for connecting LEDs at the high-potential end of the red, green, and blue series-connected LEDs respectively to the red feeder terminals, green feeder terminals, and blue feeder terminals are provided to the flexible multilayer substrate. Also, a circuit pattern for connecting LEDs at the low-potential end of the red, green, and blue series-connected LEDs all to the common terminals is provided to the flexible multilayer substrate.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: An LED lamp includes a substrate, an LED chip, and a resin portion. The LED chip is flip-chip bonded to the substrate. The resin portion covers the LED chip and includes at least one type of phosphor that transforms the emission of the LED chip into light having a longer wavelength than the emission. In this LED lamp, the resin portion has at least one side surface. The side surface is separated from another surface that can reflect the outgoing light of the resin portion, surrounds the side surfaces of the LED chip and is curved at least partially.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED illumination apparatus includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED illumination apparatus according to the present invention includes at least one connector and a lighting drive circuit. The connector is connected to an insertable and removable card-type LED illumination source, which includes multiple LEDs that have been mounted on one surface of a substrate. The lighting drive circuit is electrically connected to the card-type LED illumination source by way of the connector. The card-type LED illumination source preferably includes a metal base substrate and the multiple LEDs that have been mounted on one surface of the metal base substrate. The back surface of the metal base substrate, including no LEDs thereon, thermally contacts with a portion of the illumination apparatus. A feeder terminal to be electrically connected to the connector is provided on the surface of the metal base substrate on which the LEDs are provided.

Abstract: An LED lamp includes at least one LED chip and a wavelength converting portion including a phosphor for transforming the emission of the LED chip into light having a longer wavelength than that of the emission. The LED lamp further includes filtering member. The filtering member is designed such that the spectral transmittance thereof becomes lower in at least a portion of the wavelength range of 550 nm to 605 nm than in the remaining visible radiation range.