Patents by Inventor Nobuyuki Sata
Nobuyuki Sata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240385538Abstract: An information collection system is configured to acquire information on a substrate processing apparatus having a holder configured to hold a substrate and a functional member located on a rear surface side of the substrate when the substrate is held by the holder. The information collection system includes a main body having a bottom surface allowed to be held by the holder; a radiator fixed to the main body, and configured to radiate a measurement wave to the functional member from obliquely above; a detector fixed to the main body, and configured to detect a response resulting from a radiation of the measurement wave from the radiator; and a calculator configured to acquire information on a distance between the main body and the functional member based on the response detected by the detector.Type: ApplicationFiled: May 13, 2024Publication date: November 21, 2024Inventors: Junnosuke Maki, Masato Hayashi, Nobuyuki Sata, Ryo Konishi
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Patent number: 8874254Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.Type: GrantFiled: July 11, 2011Date of Patent: October 28, 2014Assignee: Tokyo Electron LimitedInventors: Shuji Iwanaga, Nobuyuki Sata
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Publication number: 20110270465Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.Type: ApplicationFiled: July 11, 2011Publication date: November 3, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Shuji Iwanaga, Nobuyuki Sata
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Patent number: 8014895Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.Type: GrantFiled: December 7, 2005Date of Patent: September 6, 2011Assignee: Tokyo Electron LimitedInventors: Shuji Iwanaga, Nobuyuki Sata
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Patent number: 7977609Abstract: This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring device using the sensor, a thermal processor having a temperature measurement function and a temperature measurement method. The wafer-type temperature sensor comprises a wafer and a plurality of temperature sensors arranged in regions which are formed by segmenting the upper surface of the wafer into a plurality of regions. Each of the temperature sensors includes an oscillation circuit for oscillating a frequency signal corresponding to the temperature of its own region within a frequency band that is different for every region in response to input of power supply voltage.Type: GrantFiled: December 21, 2006Date of Patent: July 12, 2011Assignee: Tokyo Electron LimitedInventors: Nobuyuki Sata, Takahiro Kitano, Tetsuo Fukuoka, Toshiyuki Matsumoto, Tomohide Minami
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Publication number: 20090254226Abstract: An object of the present invention is to perform temperature setting of a heating plate so that a wafer is uniformly heated in an actual heat processing time. The temperature of a wafer is measured during a heat processing period from immediately after a temperature measuring wafer is mounted on the heating plate to the time when the actual heat processing time elapses. Whether the uniformity in temperature within the wafer is allowable or not is determined from the temperature of the wafer in the heat processing period, and if the determination result is negative, a correction value for a temperature setting parameter of the heating plate is calculated using a correction value calculation model from the measurement result, and the temperature setting parameter is changed.Type: ApplicationFiled: December 7, 2005Publication date: October 8, 2009Applicant: Tokyo Electron LimitedInventors: Shuji Iwanaga, Nobuyuki Sata
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Patent number: 7316515Abstract: In a liquid processing apparatus a spin chuck holds a wafer having a surface supplied with a liquid to be applied through a nozzle receiving the liquid through a feed path and whether the liquid passing through the feed path has fluctuation is detected by a fluctuation detection device. Thus the liquid's condition in the feed path can be determined significantly accurately. Supplying the substrate with the liquid without fluctuation allows the substrate to receive the liquid in an optimal condition. A satisfactory liquid process can thus be performed.Type: GrantFiled: July 25, 2005Date of Patent: January 8, 2008Assignee: Tokyo Electron LimitedInventors: Shouichi Terada, Nobuyuki Sata
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Patent number: 7241633Abstract: A reference value, which defines electric power to be supplied to a heating element, is generated. Deviation ?T of temperature T1 measured by a radiation thermometer from target temperature T0 defined by a target temperature rising curve is determined. Compensation value is determined based on the deviation ?T and the temperature T1. The reference value is multiplied by the compensation value. The heating element is supplied with electric power according to the corrected reference value.Type: GrantFiled: June 16, 2004Date of Patent: July 10, 2007Assignee: Tokyo Electron LimitedInventor: Nobuyuki Sata
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Patent number: 7049553Abstract: Immediately after a cold substrate G is placed on a substrate table 3, a large electric power P1 is supplied to a heating element 32 embedded in the substrate table for a time period T1 so that temperature of the substrate table overshoots a target temperature, and thereafter zero or very small electric power P2 is supplied to the heating element for a time period T2 so that the temperature of the substrate table 3 is lowered to the target temperature while temperature of the substrate continues to rise up to the target temperature. When both the temperature of the substrate table and of the substrate reaches approximately to the target temperature after the time period T2 has elapsed, control of the electric power is entrusted to a PID controller.Type: GrantFiled: June 16, 2004Date of Patent: May 23, 2006Assignee: Tokyo Electron LimitedInventors: Kenichi Shigetomi, Nobuyuki Sata, Toshichika Takei, Masatoshi Kaneda
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Publication number: 20060029388Abstract: In a liquid processing apparatus a spin chuck holds a wafer having a surface supplied with a liquid to be applied through a nozzle receiving the liquid through a feed path and whether the liquid passing through the feed path has fluctuation is detected by a fluctuation detection device. Thus the liquid's condition in the feed path can be determined significantly accurately. Supplying the substrate with the liquid without fluctuation allows the substrate to receive the liquid in an optimal condition. A satisfactory liquid process can thus be performed.Type: ApplicationFiled: July 25, 2005Publication date: February 9, 2006Inventors: Shouichi Terada, Nobuyuki Sata
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Publication number: 20040266222Abstract: A reference value E0, which defines electric power to be supplied to a heating element 32, is generated. Deviation &Dgr;T of temperature T1 measured by a radiation thermometer 4 from target temperature T0 defined by a target temperature rising curve M is determined. Compensation value E1 is determined based on the deviation &Dgr;T and the temperature T1. The reference value E0 is multiplied by the compensation value E1. The heating element is supplied with electric power according to the corrected reference value E1E0.Type: ApplicationFiled: June 16, 2004Publication date: December 30, 2004Applicant: TOKYO ELECTRON LIMITEDInventor: Nobuyuki Sata
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Publication number: 20040250762Abstract: Immediately after a cold substrate G is placed on a substrate table 3, a large electric power P1 is supplied to a heating element 32 embedded in the substrate table for a time period T1 so that temperature of the substrate table overshoots a target temperature, and thereafter zero or very small electric power P2 is supplied to the heating element for a time period T2 so that the temperature of the substrate table 3 is lowered to the target temperature while temperature of the substrate continues to rise up to the target temperature. When both the temperature of the substrate table and of the substrate reaches approximately to the target temperature after the time period T2 has elapsed, control of the electric power is entrusted to a PID controller.Type: ApplicationFiled: June 16, 2004Publication date: December 16, 2004Applicant: TOKYO ELECTRON LIMITEDInventors: Kenichi Shigetomi, Nobuyuki Sata, Toshichika Takei, Masatoshi Kaneda
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Publication number: 20040007929Abstract: A motor in which an attracting magnet for attraction between a rotor and a stator is used in the present invention. The attracting magnet is formed into a hollow cylindrical shape such as to have two flat surfaces between which a predetermined thickness is defined. The attracting magnet is magnetized so as to have different polarities at the inner and outer circumference sides divided in the radial direction in each of its two flat surfaces, and to be reversed in polarity in an interchanging manner between its two flat surfaces. The attracting magnet is mounted on an inner surface of a rotor case while being opposed to a bearing housing. In this motor using the attracting magnet arrangement, the shaft is not magnetized even though the attracting magnet for attraction of the rotor toward the stator is used.Type: ApplicationFiled: May 21, 2003Publication date: January 15, 2004Inventors: Tadayuki Wakita, Nobuyuki Sata, Hisashi Ogino, Shinji Furukawa, Kazuo Kadooka, Hideki Itaya
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Patent number: 6450803Abstract: A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.Type: GrantFiled: February 13, 2001Date of Patent: September 17, 2002Assignee: Tokyo Electron LimitedInventors: Eiichi Shirakawa, Nobuyuki Sata
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Patent number: 6380518Abstract: The heat treatment apparatus of the present invention comprises a chamber, a hot plate for supporting and heating a substrate in a chamber, a gas supply mechanism having a single or a plurality of gas blow-out ports and arranged in an upper space above the hot plate in the chamber, for supplying a gas along the substrate so as to cover the substrate placed on the hot plate, and an exhaust mechanism having a single or a plurality of gas converge/exhaust ports which face the gas blow-out ports with the hot plate interposed therebetween, for converging and exhausting the gas blown out from the gas blow-out ports, from the chamber, the gas converge/exhaust ports having an effective exhaustion opening length L2 which is shorter than an effective blow-out opening length L1.Type: GrantFiled: August 3, 2001Date of Patent: April 30, 2002Assignee: Tokyo Electron LimitedInventors: Eiichi Shirakawa, Nobuyuki Sata
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Publication number: 20020000432Abstract: The heat treatment apparatus of the present invention comprises a chamber, a hot plate for supporting and heating a substrate in a chamber, a gas supply mechanism having a single or a plurality of gas blow-out ports and arranged in an upper space above the hot plate in the chamber, for supplying a gas along the substrate so as to cover the substrate placed on the hot plate, and an exhaust mechanism having a single or a plurality of gas converge/exhaust ports which face the gas blow-out ports with the hot plate interposed therebetween, for converging and exhausting the gas blown out from the gas blow-out ports, from the chamber, the gas converge/exhaust ports having an effective exhaustion opening length L2 which is shorter than an effective blow-out opening length L1.Type: ApplicationFiled: August 3, 2001Publication date: January 3, 2002Inventors: Eiichi Shirakawa, Nobuyuki Sata
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Patent number: 6291800Abstract: The heat treatment apparatus of the present invention comprises a chamber, a hot plate for supporting and heating a substrate in a chamber, a gas supply mechanism having a single or a plurality of gas blow-out ports and arranged in an upper space above the hot plate in the chamber, for supplying a gas along the substrate so as to cover the substrate placed on the hot plate, and an exhaust mechanism having a single or a plurality of gas converge/exhaust ports which face the gas blow-out ports with the hot plate interposed therebetween, for converging and exhausting the gas blown out from the gas blow-out ports, from the chamber, the gas converge/exhaust ports having an effective exhaustion opening length L2 which is shorter than an effective blow-out opening length L1.Type: GrantFiled: February 18, 1999Date of Patent: September 18, 2001Assignee: Tokyo Electron LimitedInventors: Eiichi Shirakawa, Nobuyuki Sata
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Publication number: 20010011653Abstract: A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.Type: ApplicationFiled: February 13, 2001Publication date: August 9, 2001Inventors: Eiichi Shirakawa, Nobuyuki Sata
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Patent number: 6229116Abstract: A heating treatment apparatus comprises a hot plate on which a substrate to be processed is to be mounted, a heater for heating the hot plate, a plurality of first sensors for detecting temperatures of a plurality of portions of the hot plate, respectively, a second sensor for detecting temperature of a representative portion of the hot plate, and a controller for controlling a heat generating operation of the heater on the basis of a plurality of first detection temperatures detected by the first sensors respectively and a second detection temperature detected by the second sensor, thereby controlling temperature of the hot plate.Type: GrantFiled: February 3, 1999Date of Patent: May 8, 2001Assignee: Tokyo Electron LimitedInventors: Eiichi Shirakawa, Nobuyuki Sata
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Patent number: RE40052Abstract: A heat treatment table is divided into two or more regions, a heater is disposed for each region. On a predetermined portion of the heat treatment table, a plurality of sensors are disposed separately each other. A relation between temperatures of the respective portions on the heat treatment table and temperatures detected by the sensors is grasped in advance, thereby enables to surmise a temperature of the respective portion of the heat treatment table from the temperature detected by the sensors. In the case of an wafer being actually treated by placing on the heat treatment table, the temperatures detected by the sensors are observed, from these detected temperatures, the temperatures of the respective portions on the heat treatment table, that is, temperatures affecting the wafer, are surmised.Type: GrantFiled: April 23, 2003Date of Patent: February 12, 2008Assignee: Tokyo Electron LimitedInventors: Eiichi Shirakawa, Nobuyuki Sata