Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. Then, these suitably trained machine learning agents can be used to generate a relevant portion of a virtual game world, such as a portion of the virtual game world that is proximate to a play's position. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. Then, these suitably trained machine learning agents can be used to generate a relevant portion of a virtual game world, such as a portion of the virtual game world that is proximate to a play's position. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. Then, these suitably trained machine learning agents can be used to generate a relevant portion of a virtual game world, such as a portion of the virtual game world that is proximate to a play's position. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. In doing so, ground coverage of the virtual game world can be determined. In one implementation, the ground coverage is determined using at least one ground coverage agent, which is a trained machine learning agent to provide appropriate ground coverage for the terrain of the virtual game world. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. Then, these suitably trained machine learning agents can be used to generate a relevant portion of a virtual game world, such as a portion of the virtual game world that is proximate to a play's position. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. In doing so, ground coverage of the virtual game world can be determined. In one implementation, the ground coverage is determined using at least one ground coverage agent, which is a trained machine learning agent to provide appropriate ground coverage for the terrain of the virtual game world. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: Virtual game worlds for computer games can be provided using machine learning. The use of machine learning enables the virtual game worlds to be generated at run time by standard consumer hardware devices. Machine learning agents are trained in advance to the characteristics of the particular game world. Then, these suitably trained machine learning agents can be used to generate a relevant portion of a virtual game world, such as a portion of the virtual game world that is proximate to a play's position. Advantageously, the virtual game world can be provided in high resolution and is able to cover a substantially larger region than conventional practical.

Abstract: A frequency synthesis system includes a memory to store first and second digital control word pairs that each include a first and second control word. A first DAC system generates an analog sampling signal having a first sampling frequency based on a fixed clock signal and the first control word of the first pair during a first time duration having a second sampling frequency based on the first control word of the second pair during a second time duration. A second DAC system generates an analog output signal based on the second control word of the first pair and the first sampling frequency at the first time duration and based on the second control word of the second pair and the second sampling frequency at the second time duration. The analog output signal has a same predetermined output frequency at both the first and second time durations.

Abstract: This device relates to devices that can be used to transport equipment, tools and goods and other items from one location to another. The device can haul equipment such as test or analysis equipment. The device has a pocket and compartment for holding a laptop securely during transport. Affixed to the pocket is a folding first shelf for taking notes or working surface. There is a folding second shelf having telescoping holders for securing equipment. The device has wheels that roll smoothly over uneven surfaces. There are collapsing legs that are used to keep the device stable on uneven surfaces. A collapsing base is used to haul equipment, boxes and other large bulky or heavy items. The device is adjustable in the vertical direction to allow the user to adjust the shelf surfaces to a height that is comfortable.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: A millimeter wave integrated waveguide interface package device may comprise: (1) a package comprising a printed wiring board (PWB) and a monolithic microwave integrate circuit (MMIC), wherein the MMIC is in communication with the PWB; and (2) a waveguide interface integrated with the package. The package may be adapted to operate at high frequency and high power, where high frequency includes frequencies greater than about 5 GHz, and high power includes power greater than about 0.5 W.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Abstract: A MMIC package is disclosed comprising: a leadframe based overmolded package, a die positioned within the overmolded package; and a partial waveguide interface, wherein the partial waveguide interface is integral with the overmolded package facilitating low cost and reliable assembly. Also disclosed is an overmolded package where the die sits on a metal portion exposed on the bottom of the package and the package is configured for attachment to a chassis of a transceiver such that heat from the die is easily dissipated to the chassis with a direct thermal path. The disclosure facilitates parallel assembly of MMIC packages and use of pick and place/surface mounting technology for attaching the MMIC packages to the chassis of transceivers. This facilitates reliable and low cost transceivers.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.

Abstract: In general, in accordance with an exemplary aspect of the present invention, an electrical system configured to use power combining of microwave signals, such as those from monolithic microwave integrated circuits or MMICs is provided. In one exemplary embodiment, the system of the present invention further comprises a low loss interface that the circuits are directly connected to. In another exemplary embodiment, the circuits are connected to a pin which is connected to the low loss interface. In yet another exemplary embodiment of the present invention, a multi-layer power amplifier is provided that comprises two or more chassis and circuits attached to impedance matching interfaces according to the present invention. This multi-layered power amplifier is configured to amplify an energy signal and have a significantly reduced volume compared to existing power combiners.