Abstract: A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

Abstract: A light emitting apparatus is fabricated by measuring light output of a semiconductor light emitting device, and selectively applying luminous material to the light emitting device based on the measured output of the light emitting device. An amount of luminous material, different compositions of luminous material and/or different doping levels of luminous material may be selectively applied based on the measured output of the light emitting device.

Abstract: A light emitting apparatus is provided that includes a light emitting device and luminous material thereon. Light output of the light emitting apparatus is measured. Some of the luminous material is selectively removed from the light emitting device based on the output of the light emitting apparatus that was measured, so that luminous material that remains on the light emitting device after the selective removing continues to be optically excited by light that is generated by the light emitting device. In measuring, a frequency spectrum of the light emitting apparatus may be measured, and the light emitting apparatus may emit white light after the selectively removing.

Abstract: A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

Abstract: Broad spectrum light emitting devices and methods and systems for fabricating such devices are provide. Such devices may include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies, and luminous material on the light emitting diode. The characteristics of the luminous material, such as the amount, composition and/or doping of the luminous material or materials may be based on measured light output of the light emitting device, such as the measured output frequency and/or power of the light emitting device.

Abstract: A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

Abstract: A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.

Abstract: A LCD system including multiple light sources optically coupled through different light entry regions to at least one waveguide element positioned to backlight a LCD panel. A LCD system including multiple light sources coupled to light entry regions of two or more waveguides comprising a waveguide system positioned to backlight a LCD panel. Waveguides of various configurations and promoting even lighting of associated LCD panels are provided. Resulting LCD systems enable uniformly lit panels having diagonal measurements in excess of 12 to 14 inches, but the invention is not limited to panels of any particular size.

Abstract: Some embodiments of the present invention provide a lighting system for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.

Abstract: Some embodiments of the present invention provide a lighting system for emitting light in multiple directions including one or more light emitting devices (LEDs) and a housing configured to receive the one or more LEDs. The one or more LEDs are configured to generate light in a first direction to illuminate a first area proximate to the lighting system. The housing is configured to reflect a portion of the generated light so as to allow a remaining portion of the generated light to pass through the housing in a second direction, different from the first direction, and illuminate a second area proximate to the lighting system. Related methods are also provided herein.

Abstract: A submount for a light emitting device package includes a rectangular substrate. A first bond pad and a second bond pad are on a first surface of the substrate. The first bond pad includes a die attach region offset toward a first end of the substrate and configured to receive a light emitting diode thereon. The second bond pad includes a bonding region between the first bond pad and the second end of the substrate and a second bond pad extension that extends from the bonding region along a side of the substrate toward a corner of the substrate at the first end of the substrate. First and second solder pads are a the second surface of the substrate. The first solder pad is adjacent the first end of the substrate and contacts the second bond pad. The second solder pad is adjacent the second end of the substrate and contacts the first bond pad. Related LED packages and methods of forming LED packages are disclosed.

Abstract: A display panel for a flat panel display includes a planar array of LCD devices and a planar array of LED devices that is closely spaced apart from the planar array of LCD devices, at least some of the LED devices being disposed within a periphery of the array of LCD devices such that, in operation, the planar array of LED devices provides backlighting for the planar array of LCD devices. The planar array of LED devices can include at least one solid metal block having first and second opposing metal faces. The first metal face includes therein an array of reflector cavities, and the second metal face includes therein heat sink fins that are exposed at the back face of the flat panel display.

Abstract: A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

Abstract: A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

Abstract: A display panel for a flat panel display includes a planar array of LCD devices and a planar array of LED devices that is closely spaced apart from the planar array of LCD devices, at least some of the LED devices being disposed within a periphery of the array of LCD devices such that, in operation, the planar array of LED devices provides backlighting for the planar array of LCD devices. The planar array of LED devices can include at least one solid metal block having first and second opposing metal faces. The first metal face includes therein an array of reflector cavities, and the second metal face includes therein heat sink fins that are exposed at the back face of the flat panel display.

Abstract: A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in the cavity to couple to a first node of a light emitting device received in the cavity. A second bond pad is positioned in the cavity to couple to a second node of a light emitting device positioned therein. Light emitting devices including a solid wavelength conversion member and methods for forming the same are also provided.

Abstract: A component assembly system is provided that includes a longitudinally elongated tape carrier, a longitudinally elongated submount carrier, and an assembly machine. A plurality of components may be attached to the tape carrier. The assembly machine is adapted to receiving the tape carrier, with the components attached thereto, and to receive the submount carrier. The assembly machine is further adapted to bring the tape carrier in close proximity to the submount carrier, and to attach the components to the submounts on the submount carrier.

Abstract: Broad spectrum light emitting devices and methods and systems for fabricating such devices are provide. Such devices may include a light emitting element, such as a diode or laser, which emits light in a predefined range of frequencies, and luminous material on the light emitting diode. The characteristics of the luminous material, such as the amount, composition and/or doping of the luminous material or materials may be based on measured light output of the light emitting device, such as the measured output frequency and/or power of the light emitting device.

Abstract: A machine tool has a spindle head pivotable through 180 degrees and having a spindle rotatably mounted in its housing. As a result of the pivoting movement, the spindle head can be shifted from a vertical to a horizontal working position. The spindle head has a toolholder and an axially displaceable tension rod. Through the tension rod runs a coolant bore extending into the working zone of the clamped tool. The coolant bore is connected to a line in a transfer piston displaceable in the spindle-head housing. The coolant bore and the transfer piston line are constantly in communication so that coolant flows uninterruptedly during displacement of the transfer piston. The line communicates with a coolant supply system. The coolant can be conveyed into the working zone of the tool in any position of the tool spindle and without any appreciable increase in size of the spindle head.

Abstract: The gripping device has two gripping arms which are directly connected to one another in a pivotable manner about a common axis. A stop member is positioned in front of the pivot axis. Both gripping arms are pivotally connected to a piston rod of a piston-cylinder unit via toggle levers. The piston rod is displaceable relative to the pivot axis so that the gripping arms can be extended in a single displacement movement and pivoted into their gripping position.