Abstract: Apparatus for environmental stress screening of electronic components includes a chamber having a wall defining an opening therein. A product carrier pallet has a portion dimensioned and configured to inserted in the opening. The portion of the product carrier pallet has a periphery and structure is provided to seal the periphery with respect to the opening. Structure is provided for conducting a plurality of electrical signals through the portion and for electrical coupling to the structure for conducting. The structure for electrical coupling is disposed outside of the product carrier pallet. The apparatus may include a zero insertion force connector. Other forms of the invention relate to a chamber having opposed aligned openings.