Abstract: A surface treating composition is shown and described herein. A surface treating composition comprises (i) a hybrid siloxane oligomer comprises organosilicon units wherein the oligomer comprises organosilicon units with fluoro-functional groups, and organosilicon units with other reactive functionality, and (ii) a perfluoro(poly)ether group containing silane compound. The surface treating composition can be employed to provide a hydrophobic and/or oleophobic surface coating on a surface of a substrate, which may impart other beneficial properties to the article.

Abstract: Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Abstract: There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.

Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.

Abstract: Provided is an epoxy resin composition that can achieve excellent low dielectric characteristics and high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising organic fine particles and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition that has excellent electric characteristics (particularly low dielectric tangent), and that can achieve high adhesive strength to metal. Specifically, provided is an epoxy resin composition comprising an active ester compound and an epoxy resin having a specific structure.

Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.

Abstract: There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent adhesion in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a copolymer nylon powder.

Abstract: There is provided an epoxy resin composition having excellent adhesion to copper and aluminum, and having excellent flexibility in a low-temperature environment. The epoxy resin composition comprises (A) an epoxy resin and (B) a polyamide-based rubber elastomer powder.

Abstract: Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

Abstract: Provided is an epoxy resin composition having excellent low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising a polyphenylene ether and an epoxy resin having a specific structure.

Abstract: Provided is an epoxy resin composition maintaining excellent adhesion and having low dielectric tangent. Specifically, provided is an epoxy resin composition comprising a specific epoxy resin and a phenol-based curing agent.

Abstract: Provided is an epoxy resin composition having excellent adhesion and low dielectric characteristics. Specifically, provided is an epoxy resin composition comprising an acid-modified polyolefin resin and an epoxy resin having a specific structure.

Abstract: The present invention provides an epoxy resin composition that can produce a cured product maintaining good dielectric characteristics (low dielectric constant and low dielectric loss tangent), and having high adhesion strength to metal; and also provides a process for producing the same, a cured product obtained by curing the epoxy resin composition, and use thereof. The present invention includes an epoxy resin composition comprising an epoxy resin, an acid anhydride-based curing agent, and a curing accelerator, the epoxy resin being represented by the formula (1): wherein X is a divalent group obtained by removing two hydrogen atoms from a hydrocarbon ring, or a divalent group represented by the formula (2): wherein Y is a bond, a C1-6 alkylene group, etc.; R1 is the same or different, and is a C1-18 alkyl group, etc., R2 is the same or different, and is a C1-18 alkylene group, etc., R3 is the same or different, and is a C1-18 alkyl group, etc.

Abstract: Provided are an epoxy resin composition that can achieve a sufficiently low viscosity without using a diluent (an organic solvent), and a method for producing the same. Also provided are an epoxy resin composition that can preferably achieve, when cured, good electrical characteristics (particularly low dielectric constant and low dielectric loss tangent), high adhesion strength to metal, and good water absorption characteristics; and a method for producing the same.

Abstract: The present invention aims to provide a condensation-curable silicone resin composition with excellent adhesion properties. The present invention also aims to provide a condensation-curable silicone resin cured product formed from the condensation-curable silicone resin composition and a sealed optical semiconductor element formed by using the condensation-curable silicone resin composition.

Abstract: The invention aims to provide an addition curable silicone resin composition with excellent interfacial adhesion properties, storage stability and transparency. The addition curable silicone resin mixtures has a refractive index of 1.35 to 1.