Abstract: A film forming apparatus includes a chamber for accommodating a wafer; a mounting table arranged in the chamber to mount the wafer thereon; a shower head arranged to face the mounting table for injecting a processing gas into the chamber; and a gas exhaust mechanism for evacuating the chamber. The shower head is provided with a center portion in which a plurality of gas injection holes are formed for injecting the processing gas; and an outer peripheral portion disposed at outside of the center portion without having the gas injection holes. The film forming apparatus further includes a heat dissipating mechanism for dissipating heat of the shower head from the entire circumference of the outer peripheral portion to the atmosphere.

Abstract: A single-substrate processing apparatus (20) has a worktable (40) disposed in a process chamber (24), which accommodates a target substrate (W). The worktable (40) has a thermally conductive mount surface (41) to place the target substrate (W) thereon. The worktable (40) is provided with a flow passage (50) formed therein, in which a thermal medium flows for adjusting temperature of the target substrate (W) through the mount surface (41). The flow passage (50) is connected to a thermal medium supply system (54), which selectively supplies a cooling medium and a heating medium.

Abstract: A single-substrate processing apparatus (20) has a worktable (40) disposed in a process chamber (24), which accommodates a target substrate (W). The worktable (40) has a thermally conductive mount surface (41) to place the target substrate (W) thereon. The worktable (40) is provided with a flow passage (50) formed therein, in which a thermal medium flows for adjusting temperature of the target substrate (W) through the mount surface (41). The flow passage (50) is connected to a thermal medium supply system (54), which selectively supplies a cooling medium and a heating medium.

Abstract: In an exhaust system for a processing apparatus wherein a processing gas is used to subject a semiconductor wafer W to be processed to a predetermined processing, a vacuum exhaust pathway 40 having a vacuum pump 42 is connected to the processing apparatus 20. A trap mechanism 52 for removing reaction products that flow into the vacuum exhaust pathway 40 is provided within the vacuum exhaust pathway 40, via disconnectable connection flanges 78 and 86 on the upstream side of the vacuum pump 42. An upstream-side inlet portion and an outlet portion of this trap mechanism 52 are provided with isolation valves 80 and 88 that can place the interior of the trap mechanism in a hermetically sealed state when necessary. A bypass pathway 54 is provided to allow a cleaning gas to bypass the trap mechanism 52 during the cleaning of the processing apparatus 20.

Abstract: A processing apparatus 51 includes a processing container 53 having a wafer W arranged therein, an activated-gas seeds induction port 79 for supplying activated N2-gas and H2-gas into the processing container 53 and nozzle orifices 105 for supplying NF3-gas activated by both N2-gas and H2-gas on activation. Thus, the processing apparatus allows N2-gas and H2-gas to activate NF3-gas, so that the wafer W is processed by the activated NF3-gas. The activated-gas seeds induction port 79 and the nozzle orifices 105 are together formed in a top plate 71 of the processing container 53, realizing an uniform distribution of NF3-gas on the object to be processed in the processing chamber.

Abstract: A magnetic disk drive device comprises a rotary magnetic disk, and a magnetic read/write head, supported by a flexure capable of swinging with respect to the magnetic disk, which floats on the magnetic disk as a result of the rotation of the magnetic disk and is driven to access the disk. In this magnetic disk drive device, the magnetic disk is driven in rotation, and a lifter is provided to support the flexure so that the magnetic read/write head and the magnetic disk are maintained in a non-contacting state at the inner peripheral side of a data region on the magnetic disk. In addition, a parking drive method for a magnetic read/write head for the above magnetic disk drive device is described.

Abstract: A resin coated sand for shell-molding processes is provided comprising the coating of foundry sand or aggregates with a phenolic resin and a carboxylic acid salt. The carboxylic acid salt is selected from a carboxylic acid salt of an element selected from groups Ia, Ib, IIa, IIb, IIIa, IVa, Va, VIb, VIIa, VIIb or VIII of the Periodic Table of Elements. The proportion of carboxylic acid salt to phenolic resin is from 0.5 to 40 parts carboxylic acid salt to 100 parts phenolic resin. This resin coated sand produces shell-molds having excellent properties for casting, and allows the molded article to be removed in an easy and efficient manner.

Abstract: A process for the preparation of a resin-coated sand for use in shell-molding operations wherein the molding operation is designed for metals such as aluminum, magnesium and their alloys which have a lower-melting temperature than iron. The process involves the coating of foundry sand with a phenolic resin incorporating a carbonate and/or bicarbonate of elements selected from groups Ia, IIa, IIIb, IVb, Vb, VIb, VIIb or VIII. This process produces a resin-coated sand with improved shake-out properties of the casting molds.

Abstract: Resin coated sand for foundry shell molding operations is provided which eliminates the cracking of the molds at the time of pouring. In conventional phenolic bonded sand molds, the abrupt thermal expansion caused by the pouring of the molten metal into the mold causes the mold to crack. The resin coated sand, in this invention, is composed of foundry sand or aggregates coated with a phenolic resin which has incorporated therein, a polyethylene glycol of high molecular weight. This improved coated sand eliminates cracking at pouring and does not impair the shake-out property of the molds.

Abstract: An improved resin binder for shell-molding operations having improved shake-out properties is disclosed. The resin binder utilizes a lubricant-containing phenolic resin of the novolac or resole type, or a mixture of novolac and resole types, incorporated therewith is an organic chloride. The organic chloride is characterized by having 20% by weight of the heating loss in the temperature range of 130.degree. to 550.degree. C. The organic chloride may be selected from chloride-containing polymers and cyclo-organic chlorides. Chlorinated polymeric material may be selected from polyvinyl chlorides, polyvinyldene chloride resins, chlorinated paraffins and chlorinated polyolefins.

Abstract: This invention relates to a method for the production of an improved resin coated lubricated sand for use in shell molding processes, wherein the resin coated sand is especially useful in casting operations using aluminum, magnesium and their alloys.The sand is coated with a phenolic type resin containing a lubricant and an additive to assist in the thermal decompositions of the binder to provide a more efficient removal of the sand grains. The additive is an organic bromide compound of the type: ##STR1## wherein: n and m are integers 0, 1 or 2, and n and m cannot be O at the same time.B.sub.r position is ortho to --oxx is selected from: --H, --C.sub.2 H.sub.4 OH, --CH.sub.2 -- CH.dbd.CH.sub.2 and --CH.sub.2 --CH BR--CH.sub.2 BR.

Abstract: A friction material useful in automobile brakes and the like, comprises as a reinforcing agent steel wool coated with a thermosetting resin such as a phenolic resole resin.

Abstract: A phenolic resin binder useful for hot coating foundry sand and comprising a mixture of a solid resol phenolic resin and a lubricant is provided in the form of beads or rods of diameter of about 0.5 to 7 mm and a length of about 0.5 to 30 mm. The beads or rods can be formed directly from a molten mixture of the components or the molten mixture can first be solidified and thereafter formed into such beads or rods. The process for the hot coating of foundry sand with the phenolic resin binder and the resulting foundry compositions, molds and cores are also disclosed.

Abstract: A lubricant-containing binder for the dry hot coat foundry method comprising a solid resol type phenolic resin and a lubricant in an amount of about 0.5 to 10 percent by weight with respect to said phenolic resin.

Abstract: This invention relates to a solid phenolic resin composition useful as a binder in the preparation of foundry sand cores and molds which comprises a solid novolac resin and a lubricant-containing solid resole resin wherein the lubricant is incorporated into the resole during the preparation of the solid resole. In a preferred binder composition, the resole component of the binder is prepared in the presence of an alkali metal catalyst and an amine catalyst. The invention also includes the process for preparing sand containing foundry cores and molds from the preferred binder composition and the sand foundry core and mold products of said process.

Abstract: A lubricant-containing binder for the dry hot coat foundry method comprising a solid resol type phenolic resin and a lubricant in an amount of about 0.5 to 10 percent by weight with respect to said phenolic resin.

Abstract: This invention relates to resin-coated sand compositions useful in the preparation of foundry sand cores and molds comprising sand, a solid novalac resin, a lubricant-containing solid resole resin, and optionally, hexamethylenetetramine in an amount of up to about 5 parts by weight based on 100 parts by weight of the total amount of resin.

Abstract: A cold-curing binder for foundry sand cores and molds comprises (a) an oil-modified alkyd resin, said resin characterized by an oil component which comprises a mixture of tall oil fatty acid and linseed oil in the ratio of from about 20:80 to about 80:20 parts by weight, (b) a polyisocyanate component, and (c) a curing accelerator. The novel binders of this invention generate less objectionable odor during the casting operation and cure more rapidly than conventional binders.