Patents by Inventor Noriaki Mukai

Noriaki Mukai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200171216
    Abstract: An objective of the present invention is to provide an adhesion prevention material having improved barrier performance. The objective is achieved by a solid or semi-solid adhesion prevention material comprising a bioabsorbable material, said adhesion prevention material containing, as an active ingredient, a cytostatic factor demonstrating cell proliferation inhibiting effect.
    Type: Application
    Filed: August 27, 2018
    Publication date: June 4, 2020
    Inventors: Tomokazu MUKAI, Noriaki SHIRAHAMA
  • Patent number: 8921157
    Abstract: Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.
    Type: Grant
    Filed: March 22, 2012
    Date of Patent: December 30, 2014
    Assignee: Hitachi, Ltd.
    Inventors: Noriaki Mukai, Masaru Mitsumoto, Makoto Homma
  • Publication number: 20140103098
    Abstract: Disclosed herein are a mask for bumping solder balls on a circuit board and a solder ball bumping method using the same. The mask includes: a plurality of openings providing spaces into which the solder balls are inserted to thereby be seated on solder pads; and trenches providing introduction spaces for spreading a flux to portions at which the solder balls are seated on the solder pads and extended from at least one side of circumferences of the openings.
    Type: Application
    Filed: October 8, 2013
    Publication date: April 17, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Won Choi, Yon Ho YOU, Seon Jae MUN, Noriaki MUKAI, Seung Wan KIM, KiJu LEE, Jung In CHOI
  • Patent number: 8651356
    Abstract: Disclosed herein is a solder bump forming apparatus performing a soldering process on a substrate, the solder bump forming apparatus including: a solder bath receiving a solder therein; an agitator agitating the solder in the solder bath; a driver driving the agitator; and a suction pressure provider providing suction pressure to the substrate.
    Type: Grant
    Filed: November 13, 2012
    Date of Patent: February 18, 2014
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Noriaki Mukai, Hueng Jae Oh, Dae Young Lee, Jin Won Choi
  • Patent number: 8302838
    Abstract: A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.
    Type: Grant
    Filed: May 19, 2011
    Date of Patent: November 6, 2012
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Noriaki Mukai, Isao Abe
  • Publication number: 20120244666
    Abstract: Solder bumps are formed on a plurality of electrode parts of a printed substrate and a semiconductor chip is loaded on the printed substrate via the plurality of solder bumps. In this case, a thermoplastic film is prepared as an underfill that covers a surface of the printed substrate on which the solder bumps are formed. In the film, parts corresponding to the solder bumps are removed and a peripheral edge of a part on which the semiconductor chip will be loaded has a protruded form. After the printed substrate has been covered with the film, the film is bonded onto the board and the semiconductor chip is loaded on the printed substrate and carried into a reflow furnace. In the reflow furnace, heat and pressure are applied to fuse the solder bumps.
    Type: Application
    Filed: March 22, 2012
    Publication date: September 27, 2012
    Inventors: Noriaki MUKAI, Masaru Mitsumoto, Makoto Homma
  • Publication number: 20110284618
    Abstract: A micro-bump forming apparatus includes: a film attachment mechanism that attaches a film on a surface of a substrate; exposure and developing mechanisms that provide openings in the film on electrodes formed on the substrate; a solder ball loading mechanism that loads solder balls into the openings, a flux printing mechanism that prints flux through the openings loaded with the solder balls; a reflow part that heats the solder balls to form solder bumps; and a film detachment mechanism that detaches the film from the surface of the substrate. After a loading head loads the solder balls into the openings of the film, a controller of the solder ball loading mechanism allows a line sensor to operate to check a loading state of the solder balls, and determines, based on the check result, whether to reload the solder balls.
    Type: Application
    Filed: May 19, 2011
    Publication date: November 24, 2011
    Inventors: Noriaki MUKAI, Isao Abe
  • Patent number: 8038050
    Abstract: The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: October 18, 2011
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Makoto Honma, Akio Igarashi, Naoaki Hashimoto, Noriaki Mukai
  • Patent number: 7896223
    Abstract: Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.
    Type: Grant
    Filed: August 19, 2009
    Date of Patent: March 1, 2011
    Assignee: Hitachi Plant Technologies, Ltd.
    Inventors: Makoto Honma, Noriaki Mukai, Shinichiro Kawabe, Akio Igarashi, Naoaki Hashimoto
  • Publication number: 20100272884
    Abstract: The present invention provides a solder ball printing apparatus and a solder ball printing method in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball feeding unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached so as to surround a solder ball shaking and discharging port of the solder ball feeding unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball loading members, each of which is arranged in the front and rear of the wire member in a convex shape to load the solder balls into an opening area of a mask.
    Type: Application
    Filed: April 22, 2010
    Publication date: October 28, 2010
    Inventors: Akio IGARASHI, Noriaki Mukai, Makoto Honma, Naoaki Hashimoto
  • Publication number: 20100270357
    Abstract: The present invention provides a solder ball printing apparatus in which solder balls are uniformly dispersed on a mask surface and are loaded into an opening area of the mask. A solder ball shaking and discharging unit includes a solder ball reception unit which receives solder balls from a solder ball reservoir unit, a wire member in a convex shape which is attached to surround a solder ball shaking and discharging port of the solder ball shaking and discharging unit and in which a plurality of wire members are arranged at predetermined intervals, and solder ball rotating and collecting mechanisms which sweep and collect the solder balls at the wire member in a convex shape.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 28, 2010
    Inventors: Makoto HONMA, Akio Igarashi, Naoaki Hashimoto, Noriaki Mukai
  • Publication number: 20100072259
    Abstract: Solder bumps formed on an electrode portion of a semiconductor chip are recently miniaturized, and when printing by using solder balls, the solder balls are also miniaturized. Therefore, it is required to print solder balls for printing with accuracy. Instead of a conventional squeegee, a solder ball loading member including a plurality of semi-spiral wire rods is provided at a print head portion for printing solder balls, and by pressing the solder ball loading member to a mask surface with a predetermined pressing force, turning forces of the solder balls are added by spaces formed by the wire rods. Accordingly, the solder balls are moderately dispersed, and are squeezed into an opening portion of the mask.
    Type: Application
    Filed: August 19, 2009
    Publication date: March 25, 2010
    Inventors: Makoto HONMA, Noriaki MUKAI, Shinichiro KAWABE, Akio IGARASHI, Naoaki HASHIMOTO
  • Patent number: 6237484
    Abstract: A screen printing apparatus 199, 169 has a roll paper vibrating device which vibrates roll paper in contact with the lower surface of a screen mask in a direction perpendicular to a moving direction of the roll paper while the roll paper is being moved in contact with the lower surface of the screen mask. Thereby, the roll paper in contact with the lower surface of the screen mask is moved in a waveform-shape pattern. Therefore, the cumulative contact area of the roll paper on the lower surface of the mask is increased, and it is possible to efficiently remove residue, such as paste attached onto the lower surface of the screen mask of the printing apparatus and paste attached inside pattern openings of the screen mask, to maintain a good printing performance.
    Type: Grant
    Filed: November 25, 1998
    Date of Patent: May 29, 2001
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Makoto Homma, Mitsuhiko Sato, Isao Abe, Noriaki Mukai
  • Patent number: 5176076
    Abstract: A screen printer effects a printing by moving a squeegee in contact with a screen to force a printing paste through a printing pattern formed on the screen. The squeegee is held by a squeegee head. The squeegee head includes a support member for supporting the squeegee in such a manner as to move the squeegee upward and downward, and at least one moving member which swingably supports the support member and is movable together with the support member. When the squeegee is to be exchanged, only the support member is angularly movable relative to the moving member so as to provide a sufficient space above the screen to facilitate the exchange of the squeegee.
    Type: Grant
    Filed: February 4, 1991
    Date of Patent: January 5, 1993
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Nobuyuki Azuma, Noriaki Mukai, Yasusuke Hayashi
  • Patent number: 4981074
    Abstract: A method and apparatus for printing an electronic circuit on a board by screen printing. A board to be printed is transported from a supply/discharge station to a positioning station and then to a printing station and is returned to the supply/discharge station. At the positioning station spaced from the printing station, positioning of the board is effected by an image processor and an XY.theta. table. The board thus positioned is transported to the printing station while the board is kept in the positioned state. At the printing station, a screen printing is effected on the thus correctly positioned board.
    Type: Grant
    Filed: May 31, 1989
    Date of Patent: January 1, 1991
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Tetuji Machita, Norio Murata, Toshihiko Takeda, Noriaki Mukai
  • Patent number: 4809443
    Abstract: An apparatus for fixing electronic parts to a printed circuit board is disclosed which comprises a vapor generating tank or boiling and generating a thermal medium and a returning tank for receiving the thermal medium containing flux. The vapor generating tank and the returning tank are separated from each other. By utilizing the level difference between the vapor generating tank and the returning tank, the thermal medium is charged into a flux separator and discharged therefrom. Thus, the mixture of the flux into the thermal medium may be reduced and its maintenance work may readily be carried out, thereby reducing a running cost of the apparatus.
    Type: Grant
    Filed: December 19, 1986
    Date of Patent: March 7, 1989
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Haruo Mishina, Yukio Yamada, Noriaki Mukai, Yushi Takahashi
  • Patent number: 4776105
    Abstract: An apparatus for fitting electronic parts to a printed circuit board is disclosed which comprises a collector for collecting thermal medium adhered to a conveyor that is travelling out of a vapor tank. Thus, it is possible to prevent generation of poisonous gas and to enhance a safety aspect of the apparatus. Also, since it is possible to collect the thermal medium, the running cost may be reduced.
    Type: Grant
    Filed: December 22, 1986
    Date of Patent: October 11, 1988
    Assignee: Hitachi Techno Engineering Co., Ltd.
    Inventors: Haruo Mishina, Yukio Yamada, Noriaki Mukai, Yushi Takahashi