Abstract: A device for manufacturing a fiber assembly includes: a rotating body that has a cylindrical shape, and winds and holds a plurality of support sheets around an outer peripheral surface around a rotation axis of the rotating body; a plurality of supply nozzles arranged along a direction parallel to the rotation axis, the supply nozzles supplying a polymer material to be a material of fibers to the plurality of support sheets; a supply nozzle moving unit that relatively moves the plurality of supply nozzles in the direction parallel to the rotation axis of the rotating body, in which the rotating body is rotatable about the rotation axis to wind, on main surfaces of the plurality of support sheets, fibers obtained by naturally cooling or naturally drying the polymer material supplied from the plurality of supply nozzles, and the rotating body includes a plurality of guide members in an annular shape circumscribing the outer peripheral surface of the rotating body concentrically to regulate positions of the plur

Abstract: An ion-sensitive substance containing a crown ether structure composed of a repeating unit represented by formula (a): —CR1R2—CR3X—O— . . . (a) (in the formula, X is an organic group having an alkoxysilyl group at a terminal, and R1, R2 and R3 are each a hydrogen atom or a hydrocarbon group), and a part or all of the alkoxysilyl groups in the crown ether structure may be hydrolyzed to form a silanol group.

Abstract: A device for manufacturing a fiber assembly includes: a rotating body that has a cylindrical shape, and winds and holds a plurality of support sheets around an outer peripheral surface around a rotation axis of the rotating body; a plurality of supply nozzles arranged along a direction parallel to the rotation axis, the supply nozzles supplying a polymer material to be a material of fibers to the plurality of support sheets; a supply nozzle moving unit that relatively moves the plurality of supply nozzles in the direction parallel to the rotation axis of the rotating body, in which the rotating body is rotatable about the rotation axis to wind, on main surfaces of the plurality of support sheets, fibers obtained by naturally cooling or naturally drying the polymer material supplied from the plurality of supply nozzles, and the rotating body includes a plurality of guide members in an annular shape circumscribing the outer peripheral surface of the rotating body concentrically to regulate positions of the plur

Abstract: A fiber assembly includes, on a main surface of a support sheet subjected to a release treatment, a warp yarn group in which a plurality of warp yarns including a polymer material are arranged, and a weft yarn group in which a plurality of weft yarns including a polymer material are arranged. The warp yarn group and the weft yarn group form a plurality of first contact portion regions and a plurality of non-contact portion regions. Each of the plurality of first contact portion regions is a region in which at least one of the plurality of warp yarns is integrated with at least one of the plurality of weft yarns. Each of the plurality of warp yarns has a line width of 1 ?m to 10 ?m, inclusive, and each of the plurality of weft yarns has a line width of 1 ?m to 10 ?m, inclusive. At least one of the plurality of first contact portion regions has a fiber density higher than that of at least one of the plurality of non-contact portion regions.

Abstract: A fiber sheet of the present disclosure includes: a first fiber layer including a plurality of first fibers, the plurality of first fibers comprising a thermoplastic polymer and arranged side by side in a first direction; a second fiber layer including a plurality of second fibers, the plurality of second fibers comprising a thermoplastic polymer and arranged side by side in a second direction intersecting the first direction, and disposed to face the first fiber layer; and a nanofiber layer including nanofibers, the nanofibers comprising any one of a thermoplastic polymer, a thermosetting polymer, a biodegradable polymer, and a biological polymer, the nanofiber layer disposed to be in contact with the first fiber layer and the second fiber layer, in which the nanofiber layer is heat-welded to the first fiber layer and the second fiber layer.

Abstract: An ion-sensitive substance containing a crown ether structure composed of a repeating unit represented by formula (a): —CR1R2—CR3X—O— . . . (a) (in the formula, X is an organic group having an alkoxysilyl group at a terminal, and R1, R2 and R3 are each a hydrogen atom or a hydrocarbon group), and a part or all of the alkoxysilyl groups in the crown ether structure may be hydrolyzed to form a silanol group.

Abstract: A cell culture chip has a stack structure formed by sequentially stacking: a first electrode provided on a main surface of a first board; a first partition wall layer including a first main flow path, and a first inlet flow path and a first outlet flow path connected to the first main flow path; a planar mesh structure sheet used as a scaffolding material for cells; a second partition wall layer including a second main flow path, and a second inlet flow path and a second outlet flow path connected to the second main flow path; and a second electrode provided on a main surface of a second board, in which the planar mesh structure sheet is sandwiched between the first partition wall layer and the second partition wall layer, and, among aperture ratios of a surface of the planar mesh structure sheet facing the first partition wall layer, an aperture ratio of a portion facing the first main flow path is greater than an aperture ratios of portions facing the first inlet flow path and the first outlet flow path, an

Abstract: A fiber mesh sheet is provided, in which the fiber mesh sheet has a mesh structure in which two or more layers of planar fiber arrangement groups are laminated, where, in each of the planar fiber arrangement groups, longitudinal directions of a plurality of fibers made of a polymer material are arranged in a plane along one direction, longitudinal directions of the fibers in one of the fiber arrangement groups intersect those of the fibers in the other fiber arrangement group in two adjacent layers of the fiber arrangement groups at an intersecting angle of 30° or more and 150° or less in a plan view seen from a direction perpendicular to the plane, an upper part of a cross section of the fiber in the fiber arrangement group at a lowermost layer is a substantially circular shape, and a lower part of a cross section of the fiber in the fiber arrangement group at the lowermost layer is a substantially flat shape, where the upper part is a side on which the adjacent fiber arrangement group is present, and the lo

Abstract: The present invention provides a field asymmetric ion mobility spectrometer for selectively separating at least one kind of material from a mixture containing two or more kinds of materials. A filter included in the spectrometry comprises first—four plate-like electrodes each having a principal plane parallel to a direction from an ionizer toward a filter. The second plate-like electrode is located between the first plate-like electrode and the third plate-like electrode. The third plate-like electrode is located between the second plate-like electrode and the fourth plate-like electrode. The third and fourth plate-like electrodes are electrically connected to the first and second plate-like electrodes, respectively. An interspace is formed between two adjacent plate-like electrodes. The present invention provides a field asymmetric ion mobility spectrometer having high separation ability.

Abstract: The present invention provides a field asymmetric ion mobility spectrometer for selectively separating at least one kind of material from a mixture containing two or more kinds of materials. A filter included in the spectrometry comprises first—four plate-like electrodes each having a principal plane parallel to a direction from an ionizer toward a filter. The second plate-like electrode is located between the first plate-like electrode and the third plate-like electrode. The third plate-like electrode is located between the second plate-like electrode and the fourth plate-like electrode. The third and fourth plate-like electrodes are electrically connected to the first and second plate-like electrodes, respectively. An interspace is formed between two adjacent plate-like electrodes. The present invention provides a field asymmetric ion mobility spectrometer having high separation ability.

Abstract: A pin (125) is moved down in a nozzle (121), the end of paste (101) protruded from the discharge opening (122) of the nozzle (121) to a target object (102) is brought into contact with the target object (102), and the pin (125) is moved away from the discharge opening (122) to divide the paste in contact with the target object.

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames.

Abstract: A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.

Abstract: A semiconductor device (1) includes: a semiconductor chip (2) having a first main surface and a second main surface opposite to the first main surface; a heat dissipating plate (3) opposed to the first main surface; a first electrode (5) disposed between the first main surface and the heat dissipating plate (3) so as to be electrically connected to the semiconductor chip (2); a pressure contact member (4) opposed to the second main surface; a second electrode (6) disposed between the second main surface and the pressure contact member (4) so as to be electrically connected to the semiconductor chip (2); and a pressure generating mechanism that generates a pressure for pressing the first electrode (5) into contact with the heat dissipating plate (3) and the semiconductor chip (2) and pressing the second electrode (6) into contact with the pressure contact member (4) and the semiconductor chip (2).

Abstract: A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a second electrode is formed, lead frames which face the first electrode and the second electrode of the power semiconductor element respectively, and a clip which applies a pressure to the lead frames while the power semiconductor element is sandwiched by the lead frames, wherein a metallic porous plating part is formed on a surface which faces the first electrode or the second electrode, the surface being a surface of at least one of the lead frames.

Abstract: A semiconductor device which can reduce a heat stress to a solder layer while suppressing an increase of thermal resistance is provided. A semiconductor device includes a semiconductor element, a solder layer which is arranged on at least one surface of the semiconductor element and a lead frame which is arranged on the solder layer so that a porous nickel plating part is sandwiched between the lead frame and the solder layer. Compared with a case that the semiconductor element and the lead frame are jointed by a solder directly, an increased part of a thermal resistance of the solder junction is held down only to a part of the porous nickel plating part and a thermal resistance applied to the solder layer can be reduced.

Abstract: A biosensor device which is possible to be downsized and potable, is free of the problem of solution outflow, and enables detection accurately and stably is realized.

Abstract: Dummy electrodes (15) are disposed on wiring connected to first electrodes (2) of the substrate (1), outside a junction region containing all of the first electrodes (2) and second electrodes (6) and in bonding resin (4), the dummy electrodes (15) not being involved in electrical connection between the substrate (1) and the component (5). When conductive particles (3) in the bonding resin (4) are melted by heating, molten solder self-assembles and solidifies between the first electrodes (2) and the second electrodes (6) and on the dummy electrodes (15). With this configuration, the solder self-assembles between the adjacent dummy electrodes (15) and causes a solder short circuit. Thus it is possible to eliminate excessive solder supply between the adjacent first electrodes (2) and the adjacent second electrodes (6), thereby preventing short circuits between the adjacent first electrodes (2) and the adjacent second electrodes (6).

Abstract: A wiring board is provided that suppresses spreading of liquid droplets when liquid droplets are discharged using an ink-jet method. The wiring board has a plurality of layers and includes an ink-jet wiring pattern that is formed in a soluble porous membrane member of any single layer and that includes electrically conductive nanoparticles as a principal material, and a transferred wiring pattern that does not include electrically conductive nanoparticles as a principal material. One layer among the plurality of layers is an electrically insulative substrate. Another layer among the plurality of layers is a porous membrane treated member layer including a porous membrane member at one part of a region of the other layer. The ink-jet wiring pattern is formed in the porous membrane treated member layer. The transferred wiring pattern is formed in the substrate.