Abstract: A wet-laid nonwoven fabric sheet includes at least three types of thermoplastic fibers having different fiber diameters, in which the wet-laid nonwoven fabric sheet has a fiber diameter ratio (R/r) of a fiber diameter R of a fiber having a maximum fiber diameter to a fiber diameter r of a fiber having a minimum fiber diameter of 30?R/r?150, an average pore size of 0.10 ?m to 15 ?m, and a maximum frequency of a pore size distribution of 70% or more.

Abstract: Provided is a method of culturing a human hepatic parenchymal cell, including culturing a human hepatic parenchymal cell in a medium containing: a culture supernatant of a human hepatic nonparenchymal cell; a Wnt signaling promoter; and a mitogenic growth factor.

Abstract: A production method for a proliferative liver organoid includes culturing liver stem cells or a tissue fragment including liver stem cells in a growth medium to obtain a proliferative liver organoid, in which the growth medium contains an interleukin-6 family cytokine. A production method for a metabolically activated liver organoid includes culturing the proliferative liver organoid produced by the production method for a proliferative liver organoid in a differentiation medium to obtain a metabolically activated liver organoid, in which the differentiation medium does not substantially contain an interleukin-6 family cytokine.

Abstract: To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.

Abstract: To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.

Abstract: To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.

Abstract: Provided are a slow wave circuit and a traveling wave tube suitable for an increase in fineness with regard to processing beam holes, and suitable for higher frequencies. A slow wave circuit (10) includes a meandering waveguide (1) and a beam hole (2) that pierces the meandering waveguide (1), and the cross-section of the beam hole (2) in the direction orthogonal to the long direction is in the shape of a polygon having a larger number of sides than a quadrilateral.

Abstract: Provided are a slow wave circuit and a traveling wave tube suitable for an increase in fineness with regard to processing beam holes, and suitable for higher frequencies. A slow wave circuit (10) includes a meandering waveguide (1) and a beam hole (2) that pierces the meandering waveguide (1), and the cross-section of the beam hole (2) in the direction orthogonal to the long direction is in the shape of a polygon having a larger number of sides than a quadrilateral.

Abstract: To provide an electronic component housing apparatus that is able to efficiently cool the heat of a first and second electronic component, a first electronic component housing chamber 5000 houses the high voltage power supply module 100 (the first electronic component). A second electronic component housing chamber 6000 houses the TWT 200 (the second electronic component). At least some of a first partition plate 2500 and a second partition plate 2600 are provided so as to face each other. A first gap part G1 is provided between the first partition plate 2500 and the second partition plate 2600.

Abstract: New platinum(IV) complexes which has a strong antitumor activity and has a feature that a side effect is relatively reduced is provided. The new complex is platinum(IV) complexes with cis,cis-spiro[4,4]nonane-1,6-diamine ligand and is platinum(IV) complexes with optically active cis,cis-spiro[4,4]nonane-1,6-diamine ligand. Especially, the new complex is dichloromalonato((1S,5S,6S)-spiro[4.4]nonane-1,6-diamine)platinum(IV).

Abstract: There is provided a shield-structured loop element which can suppress noise via a silicon substrate and can be manufactured by a semiconductor process. The loop element includes: a first well of a first polarity that is formed on a substrate; a deep well of a second polarity that is formed below the first well; a ring-shaped second well of a second polarity that is formed on the deep well along an outer periphery of the deep well; a third well of the first polarity that is formed in an island area surrounded by the deep well and the second well; a looped conductor that is formed in a layer above the third well and has smaller outer dimensions than those of the third well; and a first path that connects the second well to a bias power supply. The second well and the deep well are electrically connected to each other.

Abstract: A magnetic field sensor fabrication method of directly forming, with an aerosol deposition method, at a tip of an optical fiber, a magnetooptical layer having a refractive index that changes depending on a magnetic field, the method includes establishing a relationship of dc?d?dr among a diameter d of the magnetooptical layer, a diameter dc of a core of the optical fiber, and a diameter dr of a clad thereof.

Abstract: An electromagnetic field distribution measurement apparatus (10) according to the present invention includes: an electromagnetic field probe (20) for measuring an electromagnetic field distribution; a scan apparatus (30) for scanning the vicinity of a wiring (120) with the electromagnetic field probe (20); and a data processing apparatus (50) for calculating the offset value (?Xd) of the coordinate of the electromagnetic field probe (20) from the coordinate of the wiring (120). The data processing apparatus (50) extracts a characteristic point (E1 to E3) of the measured electromagnetic field distribution and calculates the offset value (?Xd) based on the coordinates of the extracted characteristic point (E1 to E3).

Abstract: A communication device comprises: a first transmitting and receiving element that generates and detects a magnetic field; and a second transmitting and receiving element that detects a magnetic field generated by the first transmitting and receiving element and generates a magnetic field detectable by the first transmitting and receiving element. The first and second transmitting and receiving elements transmit and receive signals through magnetic field coupling between ends of the first element second transmitting and receiving elements.

Abstract: An electric field sensor or a magnetic field sensor includes an optical fiber and an electro-optic layer or a magneto-optic layer. The electro-optic layer or a magneto-optic layer is provided on an end surface of an end portion of the optical fiber. The end surface of the optical fiber is a convex shape. The optical fiber may have the end portion with a shape of a substantial cone formed by extending the end portion, and the electro-optic layer or the magneto-optic layer may be formed on a side surface of a front end of the substantial cone. A dielectric layer may be further included between the optic layer and the end surface.

Abstract: An electric field sensor is obtained by directly forming an electrooptical film of Fabry-Perot resonator structure on a polished surface at a tip of an optical fiber by an aerosol deposition method.

Abstract: An IC package which can avoid electromagnetic waves leaked from a side surface of the IC package includes: an electric circuit board on which an IC chip is mounted; a first conductive board arranged at a position facing the electric circuit board while the IC chip on the electric circuit board is sandwiched therebetween; and a magnetic body which is arranged on a surface of the first conductive board on a side facing the IC chip and which is arranged at least partially on end portions of the first conductive board.

Abstract: An electric field sensor is obtained by directly forming an electrooptical film of Fabry-Perot resonator structure on a polished surface at a tip of an optical fiber by an aerosol deposition method.

Abstract: This invention provides a high-purity, high-concentrated silica sol with long-term stability and low viscosity by preventing viscosity-increase after production, and method for producing the same. In one embodiment, the silica sol produced by an alkoxide method comprises at least a dispersing agent and silica, wherein the concentration of said dispersing agent is 10-3000 ppm with respect to the silica, wherein said dispersing agent may be an inorganic acid, inorganic acid salt, organic acid or organic acid salt whose degradation temperature and boiling point are both 60° C. or higher, wherein said silica sol has a silica concentration of 20% weight or higher.

Abstract: There is provided a shield-structured loop element which can suppress noise via a silicon substrate and can be manufactured by a semiconductor process. The loop element includes: a first well of a first polarity that is formed on a substrate; a deep well of a second polarity that is formed below the first well; a ring-shaped second well of a second polarity that is formed on the deep well along an outer periphery of the deep well; a third well of the first polarity that is formed in an island area surrounded by the deep well and the second well; a looped conductor that is formed in a layer above the third well and has smaller outer dimensions than those of the third well; and a first path that connects the second well to a bias power supply. The second well and the deep well are electrically connected to each other.