Patents by Inventor Norio Okada

Norio Okada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11862930
    Abstract: An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.
    Type: Grant
    Filed: February 9, 2018
    Date of Patent: January 2, 2024
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akio Shirasaki, Tatsuki Otani, Norio Okada
  • Publication number: 20230223738
    Abstract: A lead pin (2a,2b) penetrates a metal stem (1). A support block (3) is mounted on the metal stem (1). A dielectric substrate (4) is mounted on a side surface of the support block (3). A signal line (5a,5b) is formed on the dielectric substrate (4). One end of the signal line (5a,5b) is connected to the lead pin (2a,2b). A semiconductor optical modulation device (6) is mounted on the dielectric substrate (4). A conductive wire (8a,8b) connects the other end of the signal line (5a,5b) and the semiconductor optical modulation device (6). The semiconductor optical modulation device (6) includes a plurality of optical modulators (6b,6c) separated from each other.
    Type: Application
    Filed: December 8, 2020
    Publication date: July 13, 2023
    Applicant: Mitsubishi Electric Corporation
    Inventors: Seiji NAKANO, Norio OKADA
  • Publication number: 20220344895
    Abstract: This optical transmission module includes: a plurality of semiconductor lasers provided on a sub-mount fixed to a side surface of a block fixed on a plate-shaped stem made of metal; and a cap with a lens fixed thereto, the cap covering all members placed above the stem. The same number of lead pins as the semiconductor lasers are provided so as to respectively penetrate through a plurality of holes formed in the stem. The lead pins and the semiconductor lasers are electrically connected to each other, respectively. Single-phase electrical signals with the stem as a ground potential are respectively applied to the semiconductor lasers from an external power supply, through the lead pins, respectively, so as to cause modulation and oscillation of the semiconductor lasers.
    Type: Application
    Filed: December 4, 2019
    Publication date: October 27, 2022
    Applicant: Mitsubishi Electric Corporation
    Inventors: Kazuki YAMAJI, Norio OKADA
  • Patent number: 11206087
    Abstract: Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.
    Type: Grant
    Filed: May 29, 2018
    Date of Patent: December 21, 2021
    Assignee: Mitsubishi Electric Corporation
    Inventors: Tatsuki Otani, Akio Shirasaki, Norio Okada
  • Publication number: 20210257808
    Abstract: The optical module which is disclosed in the present application comprises a plate-like metal stem in which a metallic lead pin is inserted in a through-hole so as to be coaxial with the through-hole and one sheet of a dielectric substrate which is equipped with a high-frequency signal line to be connected to the lead pin and a semiconductor optical integrated element, in which a semiconductor laser and an optical modulator are integrated, and which is connected to the high-frequency signal line with a bonding wire, wherein one side surface of the dielectric substrate extends in a direction perpendicular to the light axis direction of the semiconductor optical integrated element, and the side surface of the dielectric substrate is arranged in contact with a surface of the metal stem.
    Type: Application
    Filed: November 21, 2018
    Publication date: August 19, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tatsuki OTANI, Norio OKADA
  • Publication number: 20210218473
    Abstract: Provided is an optical module comprising a plate-like metal stem and a semiconductor optical modulation element mounted to a dielectric substrate provided on one side of the metal stem, wherein the metal stem has a metal stem penetration section in which a metal lead pin is inserted coaxially in a penetration hole which is formed in the metal stem and a dielectric member is provided to fill the penetration hole around the outer circumference of the lead pin, and a signal for modulation is supplied to the semiconductor optical modulation element connected in parallel with a terminal matching circuit, from the other side of the metal stem via the metal stem penetration section, wherein the terminal matching circuit is configured by a series connecting body which is comprised of a first resistor and a parallel body which is comprised of a second resistor and a capacitor.
    Type: Application
    Filed: May 29, 2018
    Publication date: July 15, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Tatsuki OTANI, Akio SHIRASAKI, Norio OKADA
  • Publication number: 20210184424
    Abstract: An optical module includes: a stem including a first surface and a second surface opposite to the first surface; a thermoelectric cooler including a heat-releasing substrate fixed to the first surface; a semiconductor laser element attached to the thermoelectric cooler; a cap fixed to the first surface and covering the thermoelectric cooler and the semiconductor laser element; a lens fixed to the cap; and a restriction body fixed to the second surface. The linear thermal expansion coefficients of the heat-releasing substrate and the restriction body are smaller than the linear thermal expansion coefficient of the stem.
    Type: Application
    Filed: February 9, 2018
    Publication date: June 17, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akio SHIRASAKI, Tatsuki OTANI, Norio OKADA
  • Publication number: 20210006036
    Abstract: An optical module includes a semiconductor laser element, a lens configured to collect emitted light that is emitted from the semiconductor laser element, a cap configured to hold the lens and hermetically seal the semiconductor laser element, a monitor light-receiving element configured to receive backlight of the semiconductor laser element, a transmission plate arranged between the semiconductor laser element and the monitor light-receiving element and configured to attenuate the backlight according to decrease in a temperature around the cap so as to cause the backlight to enter the monitor light-receiving element, and a control unit configured to control an injection current of the semiconductor laser element such that an output of the monitor light-receiving element is kept at a constant level.
    Type: Application
    Filed: April 16, 2018
    Publication date: January 7, 2021
    Applicant: Mitsubishi Electric Corporation
    Inventors: Akio SHIRASAKI, Tatsuki OTANI, Norio OKADA
  • Patent number: 10855052
    Abstract: A semiconductor laser (1) emits laser light. An electro-absorption optical modulator (2) modulates the laser light. The electro-absorption optical modulator (2) includes a plurality of electro-absorption regions (2a, 2b, 2c) having different extinction characteristics, whereby the extinction ratio curve of the optical device can be controlled to have a shape with multiple steps that is suited to driving conditions.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: December 1, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Yudai Imai, Norio Okada, Shinichi Kaneko
  • Publication number: 20200059065
    Abstract: A semiconductor laser (1) emits laser light. An electro-absorption optical modulator (2) modulates the laser light. The electro-absorption optical modulator (2) includes a plurality of electro-absorption regions (2a, 2b, 2c) having different extinction characteristics, whereby the extinction ratio curve of the optical device can be controlled to have a shape with multiple steps that is suited to driving conditions.
    Type: Application
    Filed: November 29, 2016
    Publication date: February 20, 2020
    Applicant: Mitsubishi Electric Corporation
    Inventors: Yudai IMAI, Norio OKADA, Shinichi KANEKO
  • Publication number: 20200042836
    Abstract: The information processing device includes: a storage unit that stores model definition information defining a statistical model for each estimation type and an acquisition condition of a feature amount required for estimation using the statistical model; a data acquisition unit that acquires a feature amount from a sensor signal in a first mode according to the acquisition condition and acquires data for generating a new statistical model from a sensor signal in a second mode according to a condition different from the acquisition condition; a determination unit that determines whether the feature amount acquired by the data acquisition unit in the first mode satisfies a requirement defined by the model definition information; and a mode change unit that changes a mode from the first mode to the second mode according to a determination result that the feature amount does not satisfy the requirement.
    Type: Application
    Filed: July 22, 2019
    Publication date: February 6, 2020
    Inventor: Norio OKADA
  • Patent number: 10477296
    Abstract: An electronic device according to various embodiments of the present disclosure may include a communication interface and a processor, wherein the processor may be configured to receive first battery level information of a first earpiece and second battery level information of a second earpiece, via the communication interface, to identify a charging method corresponding to the first battery level and the second battery level, among a plurality of charging methods for charging at least one of the first earpiece or the second earpiece, and to control to supply charging power to at least one of the first earpiece or the second earpiece, via a cable which connects the electronic device with at least one of the first earpiece or the second earpiece, using the charging method.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: November 12, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Eunhye Kim, Norio Okada, Masato Suzuki, Jonghyuk Cho, Donghun Heo
  • Publication number: 20190200113
    Abstract: An electronic device according to various embodiments of the present disclosure may include a communication interface and a processor, wherein the processor may be configured to receive first battery level information of a first earpiece and second battery level information of a second earpiece, via the communication interface, to identify a charging method corresponding to the first battery level and the second battery level, among a plurality of charging methods for charging at least one of the first earpiece or the second earpiece, and to control to supply charging power to at least one of the first earpiece or the second earpiece, via a cable which connects the electronic device with at least one of the first earpiece or the second earpiece, using the charging method.
    Type: Application
    Filed: December 17, 2018
    Publication date: June 27, 2019
    Inventors: Eunhye KIM, Norio OKADA, Masato SUZUKI, Jonghyuk CHO, Donghun HEO
  • Patent number: 10168493
    Abstract: An optical module includes: a stem; a temperature control module; a carrier; a light emitting element fixed on a light emitting element fixing surface of the carrier, having a front surface and a rear surface opposite to each other, emitting signal light from a first emission point in the front surface, and emitting back light from a second emission point in the rear surface; a light receiving element fixed on the carrier by a light receiving element fixing surface; a lens cap; and a lens, wherein a reflecting surface is provided on the carrier, the light receiving element receives the back light reflected by the reflecting surface, and a center of a light receiving surface of the light receiving element is positioned between the front surface and the rear surface in an optical axis direction of the signal light.
    Type: Grant
    Filed: October 3, 2016
    Date of Patent: January 1, 2019
    Assignee: Mitsubishi Electric Corporation
    Inventors: Akio Shirasaki, Norio Okada, Nobuo Ohata
  • Publication number: 20180340803
    Abstract: The present disclosure is aimed at correcting a frequency of a clock signal of a sensor based on a clock signal input from a microcomputer. A detection system includes a sensor and a microcomputer. The sensor is configured to be able to output sampling data generated by performing analog/digital conversion on an analog signal sampled based on a clock signal. The microcomputer generates a clock signal and outputs the clock signal to the sensor, and reads out the sampling data from the sensor. The sensor corrects the frequency of the clock signal based on the clock signal.
    Type: Application
    Filed: April 30, 2018
    Publication date: November 29, 2018
    Inventors: Tadashi IMOKAWA, Norio Okada
  • Patent number: 10098179
    Abstract: A compact electronic device as a constituent element of a wireless communication system using a sensor. A first feature of the device is that a first semiconductor chip is bare-chip-mounted over a front surface of a first wiring board in the form of a chip and a second semiconductor chip is bare-chip-mounted over a second wiring board in the form of a chip. A second feature is that a wireless communication unit and a data processing unit which configure a module are separately mounted. A third feature is that the first and second wiring boards are stacked in the board thickness direction to make up the module (electronic device).
    Type: Grant
    Filed: April 22, 2014
    Date of Patent: October 9, 2018
    Assignee: Renesas Electronics Corporation
    Inventors: Shintaro Yamamichi, Hirokazu Honda, Masaki Watanabe, Junichi Arita, Norio Okada, Jun Ueno, Masashi Nishimoto, Michitaka Kimura, Tomohiro Nishiyama
  • Patent number: D832343
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: October 30, 2018
    Assignee: S-PRINTING SOLUTION CO., LTD.
    Inventors: Kyong-Hwan Kim, Seungwook Jeong, Minchul Kim, Taekung Park, Yoshitaka Isogai, Jong-Kyu Kim, Norio Okada, Hakyung Kim
  • Patent number: D835693
    Type: Grant
    Filed: December 6, 2017
    Date of Patent: December 11, 2018
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hongkue Lee, Norio Okada, Masato Suzuki
  • Patent number: D909495
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: February 2, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hongkue Lee, Norio Okada, Masato Suzuki
  • Patent number: D910122
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: February 9, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hongkue Lee, Norio Okada, Masato Suzuki