Abstract: The present invention provides a bearing material coated slide member manufactured by coating a bearing material on a sliding surface of a slide member, and a method for manufacturing the same, in which the bearing material is composed of an Sn containing alloy powder, and is forced to impact on the sliding surface while being maintained in a solid phase, to thereby form a bearing material coated layer.

Abstract: A method for thermally spraying a film on an inner face of a bore of a cylinder block. A pair of suction pipes generates a spiraling air current in the bore, creating an air flow toward the center of the bore. A spraying device sprays molten metal partaicles including fumes toward the inner face of the bore. The fumes are captured by the spiraling air current and removed from molten metal particles directing toward the inner face of the bore. Molten metal particles from which the fumes are removed form the thermally sprayed film on the inner face of the bore. High-quality thermally sprayed film scarcely containing fumes can be formed on the inner face of the bore.

Abstract: In a flat pin to be used in a circuit board made of resin with pins comprising a rod portion having a diameter of not greater than 0.35 mm and a concentric tabular large diameter portion having a larger diameter than that of the rod portion formed on one end of the rod portion, the ratio (W/S) of the diameter of the large diameter portion to the rod portion is from not smaller than 2.16 to not greater than 2.67 and the ratio (T/S) of the thickness of the large diameter portion to the diameter of the rod portion is from not smaller than 0.40 to not greater than 0.67 supposing that the diameter of the rod portion and the large diameter portion of the flat pin are S and W, respectively, and the thickness of the large diameter portion is T.

Abstract: A forming method is provided that has surface pits, and the formed product thereof including a member adjust step for obtaining a member having a surface layer portion constructed by weak portions and high strength portion of relatively higher strength than the weak portions; and an inject step for injecting high pressure fluid to a surface of the member to remove at least a part of the weak portions for forming pits. That is, the weak portions are presented on the surface layer portion of the member on which the surface pits are to be formed. The high pressure fluid is injected to the surface layer portion to remove the weak portions from the member surface layer portion. The removed portion in the weak portions form the pits.

Abstract: An upright-pin-joined resin substrate 11 includes a resin substrate 13 formed from a resin or a similar material and having a main plane 13A and a pin pad 17AP exposed on the main plane; and a number of pins 1 joined to the pin pads 17AP by means of a solder HD. The pins 1 are obtained by shaping a wire material MT which is formed of 194 Alloy and has been heat-treated in advance at 450° C. to 900° C. The pin 1 includes a shaft portion 1A and an enlarged-diameter portion 1B having a round surface projecting in a direction opposite the shaft portion 1A. The enlarged-diameter portion 1B and another portion are joined to the pin pad 17AP through soldering. Also disclosed is a method of producing the upright-pin-joined resin substrate; a pin to be employed in the upright-pin-joined resin substrate; and a method of producing the pin.

Abstract: A thermal spraying device is provided with a first blowing mechanism for lengthening droplet formed near the tips of the thermal spraying materials by arc, and a second blowing mechanism for blowing tip portion of the lengthened droplet to atomize the droplet and to scatter atomized droplets towards a face to be thermally sprayed. The first blowing mechanism lengthens the droplet so that the second blowing mechanism propels air to the tip portion of the lengthened droplet that is separated from a location where the tips of thermal spraying materials are adjacent and the arc is generated, therefore arcing between the tips of the thermal spraying materials continues stably. Satisfactory thermal spraying is possible.

Abstract: A thermal spraying method includes the steps of: (1) preparing a speed-increasing means for adding energy to the heated material or the heating material to increase a flying speed of the material; and (2) adding energy to the heated material or the heating material by the speed-increasing means in such a manner that a flying speed of the heated material or the heating material increases until the material reaches a surface of an object.

Abstract: A thermal spraying method includes the steps of: (1) preparing a speed-increasing means for adding energy to the heated material or the heating material to increase a flying speed of the material; and (2) adding energy to the heated material or the heating material by the speed-increasing means in such a manner that a flying speed of the heated material or the heating material increases until the material reaches a surface of an object.

Abstract: A cylinder block production method is characterized by having, as a step prior to a cast-enclosing step of cast-enclosing a cast iron-made cylinder liner within a cylinder block body, an erosion-wash step of washing an outer peripheral wall surface of the cylinder liner and eroding a portion of a base structure of the cast iron forming the outer peripheral wall surface of the cylinder liner so as to form many small protrusions on the outer peripheral wall surface by jetting a high-pressure fluid onto the outer peripheral wall surface of the cylinder liner, in order to improve strength of adhesion between the cylinder liner and the cylinder block body. Since the base structure is partially eroded, complicated-shape small protrusions can be formed. Furthermore, sand and a mold release agent adhering to the outer peripheral wall surface of the cylinder liner can be removed. Therefore, the adhesion strength will improve.

Abstract: A thermal spraying method includes the steps of: (1) preparing a speed-increasing means for adding energy to the heated material or the heating material to increase a flying speed of the material; and (2) adding energy to the heated material or the heating material by the speed-increasing means in such a manner that a flying speed of the heated material or the heating material increases until the material reaches a surface of an object.

Abstract: In a flat pin to be used in a circuit board made of resin with pins comprising a rod portion having a diameter of not greater than 0.35 mm and a concentric tabular large diameter portion having a larger diameter than that of the rod portion formed on one end of the rod portion, the ratio (W/S) of the diameter of the large diameter portion to the rod portion is from not smaller than 2.16 to not greater than 2.67 and the ratio (T/S) of the thickness of the large diameter portion to the diameter of the rod portion is from not smaller than 0.40 to not greater than 0.67 supposing that the diameter of the rod portion and the large diameter portion of the flat pin are S and W, respectively, and the thickness of the large diameter portion is T.

Abstract: A technique is presented for preventing the peeling of a thermally sprayed film formed on an inner face of a bore of a cylinder block. A thermal spraying device 20 is provided with: a thermal spraying gun 22 that is inserted into a bore 14 passing through a cylinder block 12; and a pair of sucking pipes 24a, 24b 24 for generating a spiraling air current 28 that spirals around an axis of the bore 14 while approaching an opening of this bore 14.

Abstract: A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed to the pin-pad, wherein the pin has been subjected to thermal treatment so as to soften the pin, and comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.

Abstract: A thermal spraying method includes the steps of: (1) preparing a speed-increasing means for adding energy to the heated material or the heating material to increase a flying speed of the material; and (2) adding energy to the heated material or the heating material by the speed-increasing means in such a manner that a flying speed of the heated material or the heating material increases until the material reaches a surface of an object.

Abstract: A cylinder block production method is characterized by having, as a step prior to a cast-enclosing step of cast-enclosing a cast iron-made cylinder liner within a cylinder block body, an erosion-wash step of washing an outer peripheral wall surface of the cylinder liner and eroding a portion of a base structure of the cast iron forming the outer peripheral wall surface of the cylinder liner so as to form many small protrusions on the outer peripheral wall surface by jetting a high-pressure fluid onto the outer peripheral wall surface of the cylinder liner, in order to improve strength of adhesion between the cylinder liner and the cylinder block body. Since the base structure is partially eroded, complicated-shape small protrusions can be formed. Furthermore, sand and a mold release agent adhering to the outer peripheral wall surface of the cylinder liner can be removed. Therefore, the adhesion strength will improve.

Abstract: A pin standing resin substrate 311 comprises a resin substrate 313 and many pins 301 soldered (HD) to a pin-pad 317A, the resin substrate comprising such as a resin and having a pin-pad 317AP whose diameter of a portion exposed in a main surface 313A is 0.9 to 1.1 mm. The kovar-made pin 301 is previously heat-treated at 700° C., whereby Vickers hardness is made Hv=around 150, and the pin has a rod-like portion 301A of a diameter being 0.3 mm and an enlarged diameter portion 301B shaped in disk being 0.60 to 0.70 mm and thickness being 0.15 to 0.20 mm, the enlarged diameter portion being formed at one end of the rod-like portion 301A. This enlarged diameter portion 301B is soldered to the pin-pad.

Abstract: An upright-pin-joined resin substrate 11 includes a resin substrate 13 formed from a resin or a similar material and having a main plane 13A and a pin pad 17AP exposed on the main plane; and a number of pins 1 joined to the pin pads 17AP by means of a solder HD. The pins 1 are obtained by shaping a wire material MT which is formed of 194 Alloy and has been heat-treated in advance at 450° C. to 900° C. The pin 1 includes a shaft portion 1A and an enlarged-diameter portion 1B having a round surface projecting in a direction opposite the shaft portion 1A. The enlarged-diameter portion 1B and another portion are joined to the pin pad 17AP through soldering. Also disclosed is a method of producing the upright-pin-joined resin substrate; a pin to be employed in the upright-pin-joined resin substrate; and a method of producing the pin.

Abstract: A pin standing resin substrate comprises: a resin substrate having a substantially plate-shaped main surface and comprising one of a resin and a composite material containing a resin, with a pin-pad exposed from the main surface; and a pin solder-jointed to the pin-pad, wherein the pin has been subjected to thermal treatment so as to soften the pin, and comprises a rod-like portion and an enlarged diameter portion having the same material as the rod-like portion, the enlarged diameter portion having a larger diameter than the rod-like portion and being formed at one end of the rod-like portion, and at least the enlarged diameter portion is soldered to the pin-pad.

Abstract: A pin standing resin substrate including a resin substrate having a substantially plate-shaped main surface and composed of one of a resin and a composite material containing a resin, and having a pin-pad exposed from the main surface; and a pin soldered to the pin-pad, wherein the pin has been thermally treated by heating so as to soften the pin. The pin has a rod-like portion composed of a copper base metal and an enlarged diameter portion made of the same material as the rod-like portion. The enlarged diameter portion has a larger diameter than the rod-like portion and is formed at one end of the rod-like portion. At least the enlarged diameter portion is soldered to the pin-pad. Also disclosed is a method of making the pin standing resin substrate, a pin for bonding with the resin substrate, and a method of making the pin.