Patents by Inventor Noritaka Niino
Noritaka Niino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11928540Abstract: An RFID tag includes a circuit board, an RFID IC and a functional module. The circuit board has an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is connected to the circuit board through a lead wire. An electrical length of a connection wiring that electrically connects the functional module to an element on the circuit board is within ±10% of an integral multiple of a half wavelength of a radio signal that the RFID IC transmits or receives.Type: GrantFiled: April 17, 2020Date of Patent: March 12, 2024Assignee: KYOCERA CorporationInventors: Ko Chishiki, Noritaka Niino
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Patent number: 11880729Abstract: An RFID tag includes an IC for RFID to which information for presentation can be written by wireless communication, a display, and a control circuit configured to output presentation data to the display. The control circuit includes a font repository storing font data and a data processor configured to create the presentation data by using one or more character codes and the font data, the one or more character codes being included in the information for presentation.Type: GrantFiled: August 13, 2020Date of Patent: January 23, 2024Assignee: KYOCERA CORPORATIONInventors: Katsuhiko Fukumoto, Noritaka Niino
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Patent number: 11875213Abstract: An RFID tag includes a circuit board, an RFID IC and a functional module. The circuit board has an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is connected to the circuit board through a lead wire. An electrical length of a connection wiring that electrically connects the functional module to an element on the circuit board is within ±10% of an integral multiple of a half wavelength of a radio signal that the RFID IC transmits or receives.Type: GrantFiled: April 17, 2020Date of Patent: January 16, 2024Assignee: KYOCERA CorporationInventors: Ko Chishiki, Noritaka Niino
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Publication number: 20230393321Abstract: A wavelength converter emits light in response to laser light emitted from a light emitter. The wavelength converter includes a surface including a first area to directly receive the laser light from the light emitter, and a second area located on a member. The light emitted from the wavelength converter includes a first component emitted directly from the wavelength converter and input directly into the light receiver, and a second component emitted from the second area, reflected from the member, and input into the light receiver. The member includes a surface including a third area to receive the second component. The third area has a reflectance for the light greater than a reflectance of the wavelength converter for the light in the second area.Type: ApplicationFiled: October 29, 2021Publication date: December 7, 2023Applicant: KYOCERA CorporationInventors: Noritaka NIINO, Eri TAKEUCHI, Tomoyoshi AKASHI
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Patent number: 11835225Abstract: A photoconversion device includes a holder, a wavelength converter, and an optical element. The holder holds an output portion that outputs excitation light. The wavelength converter includes an incident surface section including a protruding surface to receive the excitation light from the output portion and emits fluorescence in response to the excitation light incident on the incident surface section. The optical element includes a focal point surrounded by the incident surface to direct the fluorescence emitted by the wavelength converter in a predetermined direction.Type: GrantFiled: March 31, 2021Date of Patent: December 5, 2023Assignee: KYOCERA CorporationInventors: Eri Takeuchi, Noritaka Niino
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Publication number: 20230313974Abstract: A photoconversion device includes a first wavelength converter and a long-pass filter. The first wavelength converter receives excitation light from an output portion and emits fluorescence having a longer wavelength than the excitation light. The long-pass filter transmits the fluorescence emitted by the first wavelength converter and reflects the excitation light transmitted through or reflected from the first wavelength converter to enter the first wavelength converter.Type: ApplicationFiled: March 31, 2021Publication date: October 5, 2023Applicant: KYOCERA CorporationInventors: Noritaka NIINO, Ryuji YAMADA
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Patent number: 11734543Abstract: An RFID tag includes a circuit board, an RFID IC, a functional module, a case and a lid. The circuit board has a main part and an extended part. The extended part extends along an edge of the main part and includes an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is disposed so as to overlap the circuit board. The case accommodates the circuit board and the functional module. The lid closes an opening of the case. The main part of the circuit board is held at a position away from an inner bottom surface of the case with the functional module as an obstacle in a direction toward the lid.Type: GrantFiled: April 17, 2020Date of Patent: August 22, 2023Assignee: Kyocera CorporationInventors: Yoshimasa Sugimoto, Noritaka Niino
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Patent number: 11717178Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.Type: GrantFiled: November 10, 2016Date of Patent: August 8, 2023Assignee: KYOCERA CorporationInventors: Yasushi Oode, Hiroki Ito, Yoshimasa Sugimoto, Noritaka Niino, Shogo Matsunaga, Takuya Hayashi
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Publication number: 20230231086Abstract: A photoconversion device includes a wavelength converter including a plurality of phosphor areas, a drive, and a controller. The plurality of phosphor areas includes a first phosphor area to emit fluorescence with a first wavelength spectrum in response to excitation light and a second phosphor area to emit fluorescence with a second wavelength spectrum different from the first wavelength spectrum in response to the excitation light. The drive changes an illuminating area to receive the excitation light in the plurality of phosphor areas. The controller drives the drive to change the illuminating area in the plurality of phosphor areas and stop driving the drive to define the illuminating area in the plurality of phosphor areas.Type: ApplicationFiled: March 31, 2021Publication date: July 20, 2023Applicant: KYOCERA CorporationInventors: Noritaka NIINO, Tomoyoshi AKASHI
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Publication number: 20230159367Abstract: A wavelength conversion element converts excitation light to light with a different wavelength. The wavelength conversion element includes a substrate including an upper surface, and a wavelength converter on the upper surface of the substrate. The wavelength converter includes a phosphor including a plurality of phosphor particles, molten glass in contact with the plurality of phosphor particles and binding the plurality of phosphor particles to one another, and voids at least between the plurality of phosphor particles, in the molten glass, or between the plurality of phosphor particles and the molten glass. A maximum area of areas of the voids is less than a maximum area of areas of the plurality of phosphor particles in a cross-sectional view of the wavelength converter.Type: ApplicationFiled: April 27, 2021Publication date: May 25, 2023Applicant: KYOCERA CorporationInventor: Noritaka NIINO
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Publication number: 20230147353Abstract: A photoconversion device includes a holder, a wavelength converter, and an optical element. The holder holds an output portion that outputs excitation light. The wavelength converter includes an incident surface section including a protruding surface to receive the excitation light from the output portion and emits fluorescence in response to the excitation light incident on the incident surface section. The optical element includes a focal point surrounded by the incident surface to direct the fluorescence emitted by the wavelength converter in a predetermined direction.Type: ApplicationFiled: March 31, 2021Publication date: May 11, 2023Applicant: KYOCERA CorporationInventors: Eri TAKEUCHI, Noritaka NIINO
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Publication number: 20220284201Abstract: An RFID tag includes an IC for RFID to which information for presentation can be written by wireless communication, a display, and a control circuit configured to output presentation data to the display. The control circuit includes a font repository storing font data and a data processor configured to create the presentation data by using one or more character codes and the font data, the one or more character codes being included in the information for presentation.Type: ApplicationFiled: August 13, 2020Publication date: September 8, 2022Applicant: KYOCERA CorporationInventors: Katsuhiko FUKUMOTO, Noritaka NIINO
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Publication number: 20220253662Abstract: An RFID tag includes an RFID IC, a functional module, a case and a window member. The case has a recess and accommodates the RFID IC and the functional module in the recess. The window member is disposed in an opening of the recess. The case has a rib located between the functional module and a side wall of the recess so as to be spaced from the side wall.Type: ApplicationFiled: May 20, 2020Publication date: August 11, 2022Applicant: KYOCERA CorporationInventors: Noritaka NIINO, Yuichi TANAKA
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Publication number: 20220198238Abstract: An RFID tag includes a circuit board, an RFID IC and a functional module. The circuit board has an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is connected to the circuit board through a lead wire. An electrical length of a connection wiring that electrically connects the functional module to an element on the circuit board is within ±10% of an integral multiple of a half wavelength of a radio signal that the RFID IC transmits or receives.Type: ApplicationFiled: April 17, 2020Publication date: June 23, 2022Applicant: KYOCERA CorporationInventors: Ko CHISHIKI, Noritaka NIINO
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Publication number: 20220188592Abstract: An RFID tag includes a circuit board, an RFID IC, a functional module, a case and a lid. The circuit board has a main part and an extended part. The extended part extends along an edge of the main part and includes an antenna conductor. The RFID IC is mounted on the circuit board. The functional module is disposed so as to overlap the circuit board. The case accommodates the circuit board and the functional module. The lid closes an opening of the case. The main part of the circuit board is held at a position away from an inner bottom surface of the case with the functional module as an obstacle in a direction toward the lid.Type: ApplicationFiled: April 17, 2020Publication date: June 16, 2022Applicant: KYOCERA CorporationInventors: Yoshimasa SUGIMOTO, Noritaka NIINO
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Patent number: 11166642Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package (1) includes a substrate (2), a lid (3), and a ground conductor layer (4). The substrate (2) contains a light emitter and a light receiver, and includes a substrate body (20), a plurality of ground via conductors (21), an frame-shaped ground conductor layer (22), signal wiring conductors (23), and an external connection terminal (24). The ground via conductors (21) are connectable to a ground potential, and are located outward from a first recess (20a) and a second recess (20b) included in the substrate body (20) in a plan view.Type: GrantFiled: November 10, 2016Date of Patent: November 9, 2021Assignee: KYOCERA CORPORATIONInventors: Yasushi Oode, Hiroki Ito, Yoshimasa Sugimoto, Noritaka Niino, Shogo Matsunaga, Takuya Hayashi
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Patent number: 10645824Abstract: There are provided an electronic component housing package and the like which have high efficiency of heating by infrared rays. An electronic component housing package includes an insulating substrate including a plurality of insulating layers stacked on top of each other, an upper surface of the insulating substrate being provided with an electronic component mounting section. The plurality of insulating layers each contain a first material as a major constituent. The electronic component housing package comprises one or more infrared-ray absorbing layers disposed between the plurality of insulating layers and/or disposed on an upper surface of uppermost one of the plurality of insulating layers. The one or more absorbing layers contain a second material which is higher in infrared absorptivity than the first material.Type: GrantFiled: August 22, 2014Date of Patent: May 5, 2020Assignee: KYOCERA CORPORATIONInventor: Noritaka Niino
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Patent number: 10582864Abstract: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.Type: GrantFiled: February 22, 2017Date of Patent: March 10, 2020Assignee: KYOCERA CORPORATIONInventors: Yasushi Oode, Hiroki Ito, Yoshimasa Sugimoto, Noritaka Niino, Shogo Matsunaga, Takuya Hayashi
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Publication number: 20190110697Abstract: A measurement sensor package and a measurement sensor improve reliability in strength and other aspects. A measurement sensor package includes a substrate, a lid, a ground conductor layer, a metallic thin layer, and a bond. The ground conductor layer and the metallic thin layer are arranged inside the bond that extends continuously as viewed through from above. The bond directly bonds a first main surface of a substrate body and a facing surface of the lid together along the entire periphery. This improves the reliability in strength.Type: ApplicationFiled: February 22, 2017Publication date: April 18, 2019Applicant: KYOCERA CorporationInventors: Yasushi OODE, Hiroki ITO, Yoshimasa SUGIMOTO, Noritaka NIINO, Shogo MATSUNAGA, Takuya HAYASHI
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Publication number: 20180353087Abstract: A measurement sensor package and a measurement sensor reduce susceptibility to noise and enable highly accurate measurement. A measurement sensor package includes a substrate. The substrate includes a first recess including a first bottom surface on which a light emitter is mountable, and a first step surface having a first connection pad thereon, a second recess including a second bottom surface on which a light receiver is mountable, and a second step surface having a second connection pad thereon. In a direction connecting a center of the first bottom surface and a center of the second bottom surface in a plan view, the first step surface is located outward from the first bottom surface and the second step surface is located outward from the second bottom surface.Type: ApplicationFiled: November 10, 2016Publication date: December 13, 2018Applicant: KYOCERA CorporationInventors: Yasushi OODE, Hiroki ITO, Yoshimasa SUGIMOTO, Noritaka NIINO, Shogo MATSUNAGA, Takuya HAYASHI