Patents by Inventor Noriyoshi Uchida

Noriyoshi Uchida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux and Solder Material
    Publication number: 20230103270
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Application
    Filed: April 27, 2019
    Publication date: March 30, 2023
    Applicant: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Solder composition
    Patent number: 11517985
    Abstract: Provided is a solder composition including a flux, a solder alloy, and a silicone oil. The solder composition can have a kinematic viscosity at 25° C. of 5000 mm2/s or more and 200,000 mm2/s or less. The silicone oil can be at least one member selected from the group consisting of dimethyl silicone oil, methylphenyl silicone oil, methylhydrogen silicone oil, reactive silicone oil, and non-reactive silicone oil.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: December 6, 2022
    Assignee: KOKI COMPANY LIMITED
    Inventors: Noriyoshi Uchida, Duck-Soo Jang, Ju-Heung Kim, Ho-Won Seok
  • FLUX AND SOLDER PASTE
    Publication number: 20220009042
    Abstract: A flux according to the present invention is a flux used for soldering that includes: a thixotropic agent including a polyamide compound that has UV absorption at the wavelength range of 240 to 500 nm in UV-visible absorption spectra; and a solvent including a glycol ether-based solvent.
    Type: Application
    Filed: January 23, 2020
    Publication date: January 13, 2022
    Inventors: Kazuhiro YUKIKATA, Noriyoshi UCHIDA
  • FLUX AND SOLDER PASTE
    Publication number: 20210291304
    Abstract: A flux includes a solvent and a thixotropic agent, the solvent including a carboxylic acid that is liquid at ordinary temperature.
    Type: Application
    Filed: July 24, 2019
    Publication date: September 23, 2021
    Inventors: Takeshi YAHAGI, Noriyoshi UCHIDA, Yuri MISUMI
  • Flux and Solder Material
    Publication number: 20210086317
    Abstract: An iodine-containing cyclic compound including no carboxy group and including one ring skeleton or a plurality of ring skeletons forming a fused ring in one molecule, is provided. The ring of the ring skeleton includes only a carbon atom, or a carbon atom, and a nitrogen atom and/or an oxygen atom, and an iodine atom is bonded to at least one of the atoms constituting the ring of the ring skeleton.
    Type: Application
    Filed: April 27, 2019
    Publication date: March 25, 2021
    Applicant: KOKI COMPANY LIMITED
    Inventors: Kazuhiro Yukikata, Noriyoshi Uchida
  • Solder paste containing solder powder and flux
    Patent number: 10933495
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Grant
    Filed: October 25, 2016
    Date of Patent: March 2, 2021
    Assignee: KOKI COMPANY LIMITED
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida
  • Flux and solder material
    Patent number: 10864606
    Abstract: It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.
    Type: Grant
    Filed: June 22, 2018
    Date of Patent: December 15, 2020
    Assignee: KOKI COMPANY LIMITED
    Inventor: Noriyoshi Uchida
  • Flux and Solder Material
    Publication number: 20200269362
    Abstract: It is an object of the present invention to provide flux and a solder material of which the activity hardly decreases even at a high temperature and which can also suppress the occurrence of migration. Flux containing an isocyanuric acid derivative containing two or more carboxyl groups and the like are provided.
    Type: Application
    Filed: June 22, 2018
    Publication date: August 27, 2020
    Inventor: Noriyoshi Uchida
  • Solder paste for reduction gas, and method for producing soldered product
    Patent number: 10610981
    Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: April 7, 2020
    Assignees: ORIGIN COMPANY, LIMITED, KOKI COMPANY LIMITED
    Inventors: Yukiko Hayashi, Arisa Shiraishi, Naoto Ozawa, Takayuki Suzuki, Takeshi Shirai, Noriyoshi Uchida, Mitsuyasu Furusawa
  • Solder Composition
    Publication number: 20190308284
    Abstract: Provided is a solder composition including a flux, a solder alloy, and a silicone oil.
    Type: Application
    Filed: July 11, 2017
    Publication date: October 10, 2019
    Inventors: Noriyoshi Uchida, Duck-soo Jang, Ju-Heung Kim, Ho-won Seok
  • SOLDER PASTE FOR REDUCTION GAS, AND METHOD FOR PRODUCING SOLDERED PRODUCT
    Publication number: 20190009375
    Abstract: The present invention provides a solder paste free of reducing agents and activators, and a method for producing a soldered product in which the solder paste is used to achieve solder bonding. The solder paste for reducing gas of the present invention is a solder paste for reducing gas used together a reducing gas. The solder paste contains a solder powder; a thixotropic agent that is solid at normal temperature; and a solvent, and is free of reducing agents for removal of oxide films and free of activators for improvement of reducibility.
    Type: Application
    Filed: September 29, 2016
    Publication date: January 10, 2019
    Inventors: Yukiko HAYASHI, Arisa SHIRAISHI, Naoto OZAWA, Takayuki SUZUKI, Takeshi SHIRAI, Noriyoshi UCHIDA, Mitsuyasu FURUSAWA
  • Flux and Solder Composition
    Publication number: 20180147675
    Abstract: Provided is a flux that contains at least one of an amine compound containing at least one acetylated amino group and an amino acid compound containing at least one acetylated amino group, as an activator.
    Type: Application
    Filed: October 25, 2016
    Publication date: May 31, 2018
    Inventors: Motohide Sasaki, Takeshi Yahagi, Noriyoshi Uchida
  • Isolated cultures of Pestalotiopsis funerea IFO 5427 and Pestalotiopsis negleta FERM BP-3501
    Patent number: 5604128
    Abstract: Isolated cultures of Pestalotiopsis funerea IFO 5427 and Pestalotiopsis neglecta FERM BP-3501 are provided. The cultures produce a glucoamylase which digests starch.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: February 18, 1997
    Assignee: Sankyo Company, Limited
    Inventors: Atsushi Hattori, Masami Miura, Mitsuyo Takahashi, Noriyoshi Uchida, Kouhei Furuya, Tsuyoshi Hosoya
  • Phospholipase A1, process for its preparation and the use thereof
    Patent number: 5538874
    Abstract: A Phospholipase A1 which is capable of hydrolyzing a phospholipid to produce a 2-acyl lysophospholipid and is obtainable from species of the fungus Aspergillus.
    Type: Grant
    Filed: October 5, 1994
    Date of Patent: July 23, 1996
    Assignee: Sankyo Company, Limited
    Inventors: Atsushi Hattori, Noriyoshi Uchida, Masahiro Kitaoka
  • Phospholipase A1, process for its preparation
    Patent number: 5521080
    Abstract: A method is provided for preparing a Phospholipase A1 which comprises (a) culturing a Phospholipase A1 producing strain of Aspergillus under conditions which allow for the production of the Phospholipase A1; (b) after the culturing, diluting the culture with water or an appropriate buffer solution; (c) filtering the resulting solution under pressure to remove any insoluble matter; and optionally (d) purifying the enzyme.
    Type: Grant
    Filed: March 23, 1995
    Date of Patent: May 28, 1996
    Assignee: Sankyo Company, Limited
    Inventors: Atsushi Hattori, Noriyoshi Uchida, Masahiro Kitaoka
  • Phospholipase A1, process for its preparation and the use thereof
    Patent number: 5378623
    Abstract: A Phospholipase A1 which is capable of hydrolyzing a phospholipid to produce a 2-acyl lysophospholipid and is obtainable from species of the fungus Aspergillus.
    Type: Grant
    Filed: June 15, 1993
    Date of Patent: January 3, 1995
    Assignee: Sankyo Company, Limited
    Inventors: Atsushi Hattori, Noriyoshi Uchida, Masahiro Kitaoka