Patents by Inventor Noriyuki Ichinose

Noriyuki Ichinose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition, two-pack type adhesive for laminates, multilayer film, and back sheet for solar cells
    Patent number: 8734943
    Abstract: Provided are a resin composition with high adhesion to substrates under hot and humid conditions, a two-part laminate adhesive containing the resin composition, and a laminated film and backsheet for solar cells including a layer of the adhesive. The resin composition contains, as essential components, a polyester polyurethane polyol (A) having a branched structure in a molecule thereof and having a weight average molecular weight (Mw) of 25,000 to 200,000 and a molecular weight distribution (Mw/Mn) of 2.5 to 25; a hydroxyl-containing epoxy resin (B) having a number average molecular weight (Mn) of 300 to 5,000; a hydroxyl-containing polycarbonate resin (C) having a number average molecular weight (Mn) of 300 to 3,000; and a polyisocyanate (D).
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: May 27, 2014
    Assignee: DIC Corporation
    Inventors: Akio Umino, Seiichi Uno, Noriyuki Ichinose, Kouji Akita, Masami Hozumi
  • RESIN COMPOSITION, TWO-PACK TYPE ADHESIVE FOR LAMINATES, MULTILAYER FILM, AND BACK SHEET FOR SOLAR CELLS
    Publication number: 20140050919
    Abstract: Provided are a resin composition with high adhesion to substrates under hot and humid conditions, a two-part laminate adhesive containing the resin composition, and a laminated film and backsheet for solar cells including a layer of the adhesive. The resin composition contains, as essential components, a polyester polyurethane polyol (A) having a branched structure in a molecule thereof and having a weight average molecular weight (Mw) of 25,000 to 200,000 and a molecular weight distribution (Mw/Mn) of 2.5 to 25; a hydroxyl-containing epoxy resin (B) having a number average molecular weight (Mn) of 300 to 5,000; a hydroxyl-containing polycarbonate resin (C) having a number average molecular weight (Mn) of 300 to 3,000; and a polyisocyanate (D).
    Type: Application
    Filed: April 5, 2012
    Publication date: February 20, 2014
    Applicant: DIC CORPORATION
    Inventors: Akio Umino, Seiichi Uno, Noriyuki Ichinose, Kouji Akita, Masami Hozumi