Patents by Inventor Noriyuki Isobe

Noriyuki Isobe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11001923
    Abstract: A method of manufacturing a semiconductor device includes (a) under a first process condition, supplying a purge gas containing hydrogen and oxygen to a process chamber from which an oxide film adhering to an internal member is removed by a cleaning gas containing a halogen element and exhausting the purge gas from the process chamber; and (b) under a second process condition differing from the first process condition, supplying the purge gas to the process chamber and exhausting the purge gas from the process chamber after performing (a), wherein the first process condition is a process condition under which reactivity of the halogen element, which remains within the process chamber when the cleaning gas is supplied to the process chamber, with the purge gas is higher than reactivity of the halogen element with the purge gas under the second process condition.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: May 11, 2021
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Noriyuki Isobe, Kenji Kameda, Koichi Oikawa
  • Patent number: 10876207
    Abstract: There is provided a technique that includes: a process chamber accommodating substrate; a storage tank including bottom portion having recess and wall portion and storing liquid precursor; a vaporizing part vaporizing the stored liquid precursor to generate precursor gas; a supply part supplying the generated precursor gas to the process chamber; a sensor disposed in the recess and detecting liquid level of the stored liquid precursor; a replenishment part replenishing the liquid precursor in the storage tank; and a controller controlling the supply part to supply the precursor gas to the process chamber to perform a substrate processing process for processing the substrate, and controlling, each time when the substrate processing process is performed a predetermined number of times, the replenishment part, based on the detected liquid level, to replenish the liquid precursor in the storage tank so that the liquid level becomes a predetermined level.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: December 29, 2020
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Noriyuki Isobe, Kenichi Suzaki, Takeshi Kasai, Yoshitaka Kawahara, Masakazu Shimada
  • Publication number: 20200095676
    Abstract: Described herein is a technique capable of suppressing deposits. According to one aspect of the technique, there is provided a method including: (a) supplying a source gas into a process chamber through a source gas nozzle while heating the process chamber; and (b) supplying a reactive gas into the process chamber, wherein (a) and (b) are alternately performed one by one to form a film on the plurality of the substrates while satisfying conditions including: (i) a supply time of the source gas in (a) in each cycle is 20 seconds or less; (ii) a pressure of the source gas in the source gas nozzle in (a) is 50 Pa or less; (iii) an inner temperature of the process chamber in (a) is 500° C. or less; and (iv) number of cycles performed continuously to form the film on the plurality of the substrates is 100 cycles or less.
    Type: Application
    Filed: August 28, 2019
    Publication date: March 26, 2020
    Inventors: Yuji TAKEBAYASHI, Kosuke TAKAGI, Atsushi HIRANO, Ryuichi NAKAGAWA, Noriyuki ISOBE
  • Publication number: 20190304771
    Abstract: According to one aspect of the technique described herein, there is provided a technique including: forming a film on a substrate by performing a cycle a predetermined number of times, wherein the cycle includes sequentially performing: (a) supplying source gas to a substrate accommodated in a reaction tube; (b) exhausting the source gas remaining in the reaction tube through an exhaust pipe connected to the reaction tube; (c) supplying a reactive gas reacting with the source gas to the substrate; and (d) exhausting the reactive gas remaining in the reaction tube through the exhaust pipe, wherein at least in (a) and (c), a temperature of the reaction tube is set to a first temperature lower than a thermal decomposition temperature of the source gas and higher than a condensation temperature of the source gas and a temperature of the exhaust pipe is set to a second temperature equal to or higher than the first temperature.
    Type: Application
    Filed: March 6, 2019
    Publication date: October 3, 2019
    Applicant: KOKUSAI ELECTRIC CORPORATION
    Inventor: Noriyuki ISOBE
  • Publication number: 20190211449
    Abstract: There is provided a technique that includes: a process chamber accommodating substrate; a storage tank including bottom portion having recess and wall portion and storing liquid precursor; a vaporizing part vaporizing the stored liquid precursor to generate precursor gas; a supply part supplying the generated precursor gas to the process chamber; a sensor disposed in the recess and detecting liquid level of the stored liquid precursor; a replenishment part replenishing the liquid precursor in the storage tank; and a controller controlling the supply part to supply the precursor gas to the process chamber to perform a substrate processing process for processing the substrate, and controlling, each time when the substrate processing process is performed a predetermined number of times, the replenishment part, based on the detected liquid level, to replenish the liquid precursor in the storage tank so that the liquid level becomes a predetermined level.
    Type: Application
    Filed: March 15, 2019
    Publication date: July 11, 2019
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Noriyuki ISOBE, Kenichi SUZAKI, Takeshi KASAI, Yoshitaka KAWAHARA, Masakazu SHIMADA
  • Patent number: 10297440
    Abstract: Provided is a technique for forming a film having a desired stress on a substrate. A method of manufacturing a semiconductor device includes: forming a film having a predetermined stress on a substrate by controlling a ratio of a thickness of a first film having compressive stress to a thickness of a second film having tensile stress by performing: (a) supplying an organic source gas containing a first element and a reactive gas containing a second element to the substrate to form the first film containing the first element and the second element; and (b) supplying an inorganic source gas containing the first element and the reactive gas to the substrate to form the second film containing the first element and the second element.
    Type: Grant
    Filed: September 26, 2016
    Date of Patent: May 21, 2019
    Assignee: KOKUSAI ELECTRIC CORPORATION
    Inventors: Hirohisa Yamazaki, Noriyuki Isobe, Hiroshi Ashihara
  • Patent number: 9708708
    Abstract: A film is efficiently formed by sufficiently supplying a source gas to substrates accommodated in a process chamber, and the uniformity of a film formed on the substrates is improved. A method of a semiconductor device manufacturing includes (a) supplying a source gas to an upper region of a process chamber through a first gas supply hole disposed at a front end of a first nozzle disposed in a lower region of the process chamber where the source gas is not pyrolyzed; (b) supplying the source gas to substrates disposed in the lower region and a middle region of the process chamber through a plurality of second gas supply holes of a second nozzle; and (c) supplying a reactive gas to substrates disposed in the lower region, the middle region and the upper region of the process chamber through a plurality of third gas supply holes of a third nozzle.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: July 18, 2017
    Assignee: Hitachi Kokusai Electric, Inc.
    Inventors: Noriyuki Isobe, Yuji Takebayashi, Kenichi Suzaki, Takeshi Kasai, Atsushi Hirano, Koichi Oikawa
  • Publication number: 20170092490
    Abstract: Provided is a technique for forming a film having a desired stress on a substrate. A method of manufacturing a semiconductor device includes: forming a film having a predetermined stress on a substrate by controlling a ratio of a thickness of a first film having compressive stress to a thickness of a second film having tensile stress by performing: (a) supplying an organic source gas containing a first element and a reactive gas containing a second element to the substrate to form the first film containing the first element and the second element; and (b) supplying an inorganic source gas containing the first element and the reactive gas to the substrate to form the second film containing the first element and the second element.
    Type: Application
    Filed: September 26, 2016
    Publication date: March 30, 2017
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Hirohisa YAMAZAKI, Noriyuki ISOBE, Hiroshi ASHIHARA
  • Publication number: 20170067159
    Abstract: A film is efficiently formed by sufficiently supplying a source gas to substrates accommodated in a process chamber, and the uniformity of a film formed on the substrates is improved. A method of a semiconductor device manufacturing includes (a) supplying a source gas to an upper region of a process chamber through a first gas supply hole disposed at a front end of a first nozzle disposed in a lower region of the process chamber where the source gas is not pyrolyzed; (b) supplying the source gas to substrates disposed in the lower region and a middle region of the process chamber through a plurality of second gas supply holes of a second nozzle; and (c) supplying a reactive gas to substrates disposed in the lower region, the middle region and the upper region of the process chamber through a plurality of third gas supply holes of a third nozzle.
    Type: Application
    Filed: September 8, 2016
    Publication date: March 9, 2017
    Inventors: Noriyuki ISOBE, Yuji TAKEBAYASHI, Kenichi SUZAKI, Takeshi KASAI, Atsushi HIRANO, Koichi OIKAWA
  • Publication number: 20160362784
    Abstract: A method of manufacturing a semiconductor device includes (a) under a first process condition, supplying a purge gas containing hydrogen and oxygen to a process chamber from which an oxide film adhering to an internal member is removed by a cleaning gas containing a halogen element and exhausting the purge gas from the process chamber; and (b) under a second process condition differing from the first process condition, supplying the purge gas to the process chamber and exhausting the purge gas from the process chamber after performing (a), wherein the first process condition is a process condition under which reactivity of the halogen element, which remains within the process chamber when the cleaning gas is supplied to the process chamber, with the purge gas is higher than reactivity of the halogen element with the purge gas under the second process condition.
    Type: Application
    Filed: June 7, 2016
    Publication date: December 15, 2016
    Applicant: HITACHI KOKUSAI ELECTRIC INC.
    Inventors: Noriyuki ISOBE, Kenji KAMEDA, Koichi OIKAWA
  • Patent number: 6855787
    Abstract: A multi-layer hose having a multi-layer structure comprising an inner layer (I) made of a fluorocopolymer and an outer layer (II) made of a polyamide resin, wherein the fluorocopolymer constituting the inner layer (I) is a fluorocopolymer which comprises polymerized units (a) based on tetrafluoroethylene, polymerized units (b) based on ethylene and polymerized units (c) based on itaconic anhydride and/or citraconic anhydride, wherein the molar ratio of (a)/(b) is from 20/80 to 80/20 and the molar ratio of (c)/((a)+(b)) is from 1/10,000 to 5/100 and which has a volume flow rate of from 1 to 1,000 mm3/sec., and the polyamide resin constituting the outer layer (II) is polyamide 11 and/or polyamide 12, which satisfies a condition of (terminal amino group concentration)/(terminal carboxyl group concentration)>1.
    Type: Grant
    Filed: July 14, 2003
    Date of Patent: February 15, 2005
    Assignee: Asahi Glass Company, Limited
    Inventors: Atsushi Funaki, Naoko Sumi, Eiichi Nishi, Noriyuki Isobe, Tomoharu Nishioka, Koji Nakamura
  • Publication number: 20040206412
    Abstract: A nylon resin multi-layer pipe, excellent in adhesivity to a nylon resin joint, includes at least (A) a layer containing a copolymerized nylon and (B) a layer containing a nylon resin other than the copolymerized nylon of the layer (A). The surface in contact with the joint is the layer (A) containing a copolymerized nylon. An adhesion method is provided for adhering a nylon resin joint to the aforementioned nylon resin multi-layer pipe using a solvent adhesive.
    Type: Application
    Filed: March 4, 2004
    Publication date: October 21, 2004
    Applicants: UBE Industries, Ltd., Osaka Gas Co., Ltd.
    Inventors: Noriyuki Isobe, Hideki Fujimura, Shinya Matsuda, Yuji Higuchi
  • Publication number: 20040191440
    Abstract: A multi-layer hose having a multi-layer structure comprising an inner layer (I) made of a fluorocopolymer and an outer layer (II) made of a polyamide resin, wherein the fluorocopolymer constituting the inner layer (I) is a fluorocopolymer which comprises polymerized units (a) based on tetrafluoroethylene, polymerized units (b) based on ethylene and polymerized units (c) based on itaconic anhydride and/or citraconic anhydride, wherein the molar ratio of (a)/(b) is from 20/80 to 80/20 and the molar ratio of (c)/((a)+(b)) is from 1/10,000 to 5/100 and which has a volume flow rate of from 1 to 1,000 mm3/sec., and the polyamide resin constituting the outer layer (II) is polyamide 11 and/or polyamide 12, which satisfies a condition of (terminal amino group concentration)/(terminal carboxyl group concentration)>1.
    Type: Application
    Filed: July 14, 2003
    Publication date: September 30, 2004
    Applicant: ASAHI GLASS COMPANY LIMITED
    Inventors: Atsushi Funaki, Naoko Sumi, Eiichi Nishi, Noriyuki Isobe, Tomoharu Nishioka, Koji Nakamura
  • Publication number: 20040171764
    Abstract: A joint to be adhered to nylon resin moldings includes a copolymerized nylon or a composition comprising a copolymerized nylon or a copolymerized nylon blend and at least one of a nucleating agent and a lubricant. A method for adhering nylon resin moldings includes, adhering nylon resin moldings to the joint using a solvent adhesive. The joint and the solvent adhesive enable formation of an effective adhesive layer.
    Type: Application
    Filed: December 22, 2003
    Publication date: September 2, 2004
    Applicants: Ube Industries, Ltd., Osaka Gas Co., Ltd.
    Inventors: Noriyuki Isobe, Hideki Fujimura, Shinya Matsuda, Yuji Higuchi
  • Publication number: 20040135371
    Abstract: A fuel pipe joint having excellent fuel permeation resistance, particularly a fuel pipe joint for use in automobiles, which can greatly reduce the amount of fuel permeated through the wall and exhibits excellent rigidity and fuel barrier property even at high temperatures, the fuel pipe joint using a joint material comprising a polyamide (nylon 9T) consisting of a dicarboxylic acid component and a diamine component, with 60 to 100 mol % of the dicarboxylic acid component being a terephthalic acid and 60 to 100 mol % of the diamine component being a diamine component selected from 1,9-nonanediamine and 2-methyl-1,8-octanediamine. The joint material preferably further comprises a reinforcement and/or an electrically conducting filler. The electrically conducting filler preferably has an aspect ratio of 50 or more and a short diameter of 0.5 nm to 10 &mgr;m.
    Type: Application
    Filed: October 14, 2003
    Publication date: July 15, 2004
    Applicants: Kuraray Co., Ltd., a Japanese corporation, Ube Industries, Ltd., a Japanese corporation
    Inventors: Haruhisa Masuda, Yuji Munesawa, Koichi Warino, Noriyuki Isobe, Hideki Fujimura, Yoshiro Iwata, Koji Nakamura, Kozo Tamura
  • Patent number: 6656553
    Abstract: A hose for fuel having a laminated structure comprising an inner layer (A) made of a ethylene/tetrafluoroethylene copolymer adhesive to a polyamide resin and an outer layer (B) made of a polyamide resin, is formed. Such a hose for fuel is excellent in interlaminar adhesive strength and also excellent in antistatic properties and fuel permeation-preventing properties, and particularly, the dependency of the interlaminar adhesive strength on the take-up speed during the co-extrusion molding, is small.
    Type: Grant
    Filed: October 7, 2002
    Date of Patent: December 2, 2003
    Assignees: Asahi Glass Company, Limited, Ube Industries, Ltd.
    Inventors: Eiichi Nishi, Masako Nagashima, Noriyuki Isobe, Tomoharu Nishioka, Yoshiro Iwata
  • Publication number: 20030131936
    Abstract: A nylon resin multi-layer pipe excellent in adhesivity to a nylon resin joint including at least (A) a layer containing a copolymerized nylon and (B) a layer containing a nylon resin other than the copolymerized nylon of the layer (A) wherein the surface in contact with the joint is the layer (A) containing a copolymerized nylon and an adhesion method for adhering a nylon resin joint to the aforementioned nylon resin multi-layer pipe using a solvent adhesive are described.
    Type: Application
    Filed: January 8, 2003
    Publication date: July 17, 2003
    Applicant: UBE Industries, Ltd.
    Inventors: Noriyuki Isobe, Hideki Fujimura, Shinya Matsuda
  • Patent number: 6541085
    Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C. under a load of 2,160 g, wherein said relative viscosity and said melt flow rate have a relationship of the following formula (I): 2.87×103 exp (−3.48 &eegr;r)≦MFR≦3.25×104 exp (−3.48 &eegr;r)  (I) wherein &eegr;r is relative viscosity and MFR is melt flow rate. The nylon 12 has excellent extrusion moldability and creep characteristics, fatigue characteristics and the like mechanical properties and is suited for tubular molds. A nylon 12 composition comprising the nylon 12 having the above-described specific relationship between &eegr;r and MFR and a plasticizer is also disclosed.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: April 1, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
  • Patent number: 6538099
    Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C. under a load of 2,160 g, wherein said relative viscosity and said melt flow rate have a relationship of the following formula (I): 2.87×103 exp(−3.48 &eegr;r)≦MFR≦3.25×104 exp(−3.48 &eegr;r)  (I) wherein &eegr;r is relative viscosity and MFR is melt flow rate. The nylon 12 has excellent extrusion moldability and creep characteristics, fatigue characteristics and the like mechanical properties and is suited for tubular molds. A nylon 12 composition comprising the nylon 12 having the above-described specific relationship between &eegr;r and MFR and a plasticizer is also disclosed.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: March 25, 2003
    Assignee: Ube Industries, Ltd.
    Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
  • Publication number: 20030035914
    Abstract: A hose for fuel having a laminated structure comprising an inner layer (A) made of a ethylene/tetrafluoroethylene copolymer adhesive to a polyamide resin and an outer layer (B) made of a polyamide resin, is formed. such a hose for fuel is excellent in the interlaminar adhesive strength and also excellent in the antistatic properties and fuel permeation-preventing properties, and particularly, the dependency of the interlaminar adhesive strength on the take-up speed during the co-extrusion molding, is small.
    Type: Application
    Filed: October 7, 2002
    Publication date: February 20, 2003
    Applicant: ASAHI GLASS COMPANY LIMITED
    Inventors: Eiichi Nishi, Masako Nagashima, Noriyuki Isobe, Tomoharu Nishioka, Yoshiro Iwata