Patents by Inventor Noriyuki Iwabuchi

Noriyuki Iwabuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10460949
    Abstract: There is provided a substrate processing apparatus of performing a predetermined substrate process on a plurality of target substrates under a vacuum atmosphere, including: a plurality of processing parts each configured to perform the substrate process on each of the plurality of target substrates; a gas supply mechanism configured to supply a processing gas to each of the plurality of processing parts; a single exhaust mechanism configured to exhaust the processing gas within the plurality of processing parts; and a control part configured to control the single exhaust mechanism to collectively exhaust the processing gas within the plurality of processing parts, and control the gas supply mechanism to separately supply the processing gas into each of the plurality of processing parts such that a difference between internal pressures of the plurality of processing parts is prevented.
    Type: Grant
    Filed: October 19, 2015
    Date of Patent: October 29, 2019
    Assignee: TOKYO ELECTRON LIMITED
    Inventors: Hiroyuki Takahashi, Kazunori Kazama, Noriyuki Iwabuchi, Satoshi Toda, Tetsuro Takahashi
  • Publication number: 20180353557
    Abstract: A method for prophylaxis or treatment of a disease includes administering an an effective amount of an agent that contains cells of Lactobacillus paracasei MCC1849 (NITE BP-01633) to a subject in need of such prophylaxis or treatment. The disease can be one or more of an inflammatory disease, ulcer, food allergies, bronchial asthma, urticaria, pollinosis, anaphylactic shock or an opportunistic infection.
    Type: Application
    Filed: August 20, 2018
    Publication date: December 13, 2018
    Inventors: Tomohiro TANAKA, Noriyuki IWABUCHI, Yohei SATO, Kanetada SHIMIZU, Toshitaka ODAMAKI
  • Patent number: 10064903
    Abstract: The Lactobacillus paracasei MCC1849 (NITE BP-01633) strain, which has a high IL-12 production-promoting action, is used as an ingredient of a drug, food or drink, or feed used for promotion of IL-12 production, immunostimulation, antivirus, or the like.
    Type: Grant
    Filed: September 9, 2016
    Date of Patent: September 4, 2018
    Assignee: Morinaga Milk Industry Co., Ltd.
    Inventors: Tomohiro Tanaka, Noriyuki Iwabuchi, Yohei Sato, Kanetada Shimizu, Toshitaka Odamaki
  • Publication number: 20170007650
    Abstract: The Lactobacillus paracasei MCC1849 (NITE BP-01633) strain, which has a high IL-12 production-promoting action, is used as an ingredient of a drug, food or drink, or feed used for promotion of IL-12 production, immunostimulation, antivirus, or the like.
    Type: Application
    Filed: September 9, 2016
    Publication date: January 12, 2017
    Inventors: Tomohiro Tanaka, Noriyuki Iwabuchi, Yohei Sato, Kanetada Shimizu, Toshitaka Odamaki
  • Publication number: 20160114024
    Abstract: The Lactobacillus paracasei MCC1849 (NITE BP-01633) strain, which has a high IL-12 production-promoting action, is used as an ingredient of a drug, food or drink, or feed used for promotion of IL-12 production, immunostimulation, antivirus, or the like.
    Type: Application
    Filed: March 18, 2014
    Publication date: April 28, 2016
    Applicant: MORINAGA MILK INDUSTRY CO., LTD.
    Inventors: Tomohiro Tanaka, Noriyuki Iwabuchi, Yohei Sato, Kanetada Shimizu, Toshitaka Odamaki
  • Publication number: 20160111304
    Abstract: There is provided a substrate processing apparatus of performing a predetermined substrate process on a plurality of target substrates under a vacuum atmosphere, including: a plurality of processing parts each configured to perform the substrate process on each of the plurality of target substrates; a gas supply mechanism configured to supply a processing gas to each of the plurality of processing parts; a single exhaust mechanism configured to exhaust the processing gas within the plurality of processing parts; and a control part configured to control the single exhaust mechanism to collectively exhaust the processing gas within the plurality of processing parts, and control the gas supply mechanism to separately supply the processing gas into each of the plurality of processing parts such that a difference between internal pressures of the plurality of processing parts is prevented.
    Type: Application
    Filed: October 19, 2015
    Publication date: April 21, 2016
    Inventors: Hiroyuki TAKAHASHI, Kazunori KAZAMA, Noriyuki IWABUCHI, Satoshi TODA, Tetsuro TAKAHASHI
  • Patent number: 8475623
    Abstract: A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
    Type: Grant
    Filed: August 2, 2012
    Date of Patent: July 2, 2013
    Assignee: Tokyo Electron Limited
    Inventors: Seiichi Kaise, Noriyuki Iwabuchi, Shigeaki Kato, Hiroshi Nakamura, Takeshi Yokouchi, Mariko Shibata, Akira Obi
  • Publication number: 20120292290
    Abstract: A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
    Type: Application
    Filed: August 2, 2012
    Publication date: November 22, 2012
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Seiichi Kaise, Noriyuki Iwabuchi, Shigeaki Kato, Hiroshi Nakamura, Takeshi Yokouchi, Mariko Shibata, Akira Obi
  • Patent number: 8257601
    Abstract: A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: September 4, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Seiichi Kaise, Noriyuki Iwabuchi, Shigeaki Kato, Hiroshi Nakamura, Takeshi Yokouchi, Mariko Shibata, Akira Obi
  • Patent number: 8124539
    Abstract: A plasma processing apparatus having a focus ring, enables the efficiency of cooling of the focus ring to be greatly improved, while preventing an increase in cost thereof. The plasma processing apparatus is comprised of a susceptor which has an electrostatic chuck and the focus ring. A wafer W to be subjected to plasma processing is mounted on the electrostatic chuck. The focus ring has a dielectric material portion and a conductive material portion. The dielectric material portion forms a contact portion disposed in contact with the electrostatic chuck. The conductive material portion faces the electrostatic chuck with the dielectric material portion therebetween.
    Type: Grant
    Filed: August 4, 2010
    Date of Patent: February 28, 2012
    Assignee: Tokyo Electron Limited
    Inventors: Shosuke Endoh, Noriyuki Iwabuchi, Shigeaki Kato, Tomoya Okubo, Jun Hirose, Koichi Nagakura, Chishio Koshimizu, Kazuki Denpoh
  • Publication number: 20110171830
    Abstract: A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
    Type: Application
    Filed: March 28, 2011
    Publication date: July 14, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: SEIICHI KAISE, NORIYUKI IWABUCHI, SHIGEAKI KATO, HIROSHI NAKAMURA, TAKESHI YOKOUCHI, MARIKO SHIBATA, AKIRA OBI
  • Publication number: 20110000883
    Abstract: A plasma processing apparatus having a focus ring, enables the efficiency of cooling of the focus ring to be greatly improved, while preventing an increase in cost thereof. The plasma processing apparatus is comprised of a susceptor which has an electrostatic chuck and the focus ring. A wafer W to be subjected to plasma processing is mounted on the electrostatic chuck. The focus ring has a dielectric material portion and a conductive material portion. The dielectric material portion forms a contact portion disposed in contact with the electrostatic chuck. The conductive material portion faces the electrostatic chuck with the dielectric material portion therebetween.
    Type: Application
    Filed: August 4, 2010
    Publication date: January 6, 2011
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shosuke Endoh, Noriyuki Iwabuchi, Shigeaki Kato, Tomoya Okubo, Jun Hirose, Koichi Nagakura, Chishio Koshimizu, Kazuki Denpoh
  • Publication number: 20090170772
    Abstract: An object is to provide an interleukin production regulator which can be used for prevention, treatment or recurrence prevention of a gastrointestinal disease or an autoimmune disease accompanied by an inflammation as the main symptom, which is highly safe, and which can be administered over a long period. Another object is to provide a method for production of the interleukin production regulator. Further object is to provide a pharmaceutical composition and a food, each of which comprises the interleukin production regulator. Disclosed are: a method for producing an interleukin production regulator having both an effect of maintaining or promoting the production of interleukin-10 and an effect of maintaining or inhibiting the production of interleukin-12, comprising the step of disrupting a cell of a microorganism belonging to the genus Bifidobacterium; an interleukin production regulator produced by the method; and a pharmaceutical and a food, each comprising the interleukin production regulator.
    Type: Application
    Filed: March 8, 2007
    Publication date: July 2, 2009
    Applicant: MORINAGA MILK INDUSTRY CO., LTD.
    Inventors: Noriyuki Iwabuchi, Kanetada Shimizu, Noritoshi Takahashi
  • Patent number: 7553773
    Abstract: First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
    Type: Grant
    Filed: April 11, 2005
    Date of Patent: June 30, 2009
    Assignee: Tokyo Electron Limited
    Inventors: Eiji Hirose, Noriyuki Iwabuchi, Takeshi Yokouchi, Shingo Suzuki
  • Publication number: 20060263870
    Abstract: A hydrocarbon treatment process of the present invention comprises the steps of: adding Rhodococcus erythropolis PR-4 to an aqueous medium containing culture medium ingredients; adding an organic solvent containing a hydrocarbon with 14 or more carbon atoms; and enabling the Rhodococcus erythropolis PR-4 to migrate into the organic solvent and metabolize the hydrocarbon with 14 or more carbon atoms.
    Type: Application
    Filed: November 17, 2005
    Publication date: November 23, 2006
    Inventors: Mutsuyasu Nakajima, Michio Sunairi, Noriyuki Iwabuchi, Emi Kishi
  • Publication number: 20060090703
    Abstract: A substrate processing method is used for a substrate processing system having a substrate processing device and a substrate transfer device. The substrate processing method includes a substrate transfer step of transferring a substrate and a substrate processing step of performing a predetermined process on the substrate. The substrate transfer step and the substrate processing step include a plurality of operations, and at least two operations among the plurality of the operations are performed simultaneously. Preferably, the substrate processing device includes an accommodating chamber, a mounting table placed in the accommodating chamber to be mounted thereon the substrate, and a heat transfer gas supply line for supplying a heat transfer gas to a space between the substrate mounted on the mounting table and the mounting table.
    Type: Application
    Filed: November 1, 2005
    Publication date: May 4, 2006
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Seiichi Kaise, Noriyuki Iwabuchi, Shigeaki Kato, Hiroshi Nakamura, Takeshi Yokouchi, Mariko Shibata, Akira Obi
  • Publication number: 20050176258
    Abstract: First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
    Type: Application
    Filed: April 11, 2005
    Publication date: August 11, 2005
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Eiji Hirose, Noriyuki Iwabuchi, Takeshi Yokouchi, Shingo Suzuki
  • Patent number: 6908864
    Abstract: First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: June 21, 2005
    Assignee: Tokyo Electron Limited
    Inventors: Eiji Hirose, Noriyuki Iwabuchi, Takeshi Yokouchi, Shingo Suzuki
  • Publication number: 20040261946
    Abstract: A plasma processing apparatus having a focus ring, enables the efficiency of cooling of the focus ring to be greatly improved, while preventing an increase in cost thereof. The plasma processing apparatus is comprised of a susceptor which has an electrostatic chuck and the focus ring. A wafer W to be subjected to plasma processing is mounted on the electrostatic chuck. The focus ring has a dielectric material portion and a conductive material portion. The dielectric material portion forms a contact portion disposed in contact with the electrostatic chuck. The conductive material portion faces the electrostatic chuck with the dielectric material portion therebetween.
    Type: Application
    Filed: April 21, 2004
    Publication date: December 30, 2004
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Shosuke Endoh, Noriyuki Iwabuchi, Shigeaki Kato, Tomoya Okubo, Jun Hirose, Koichi Nagakura, Chishio Koshimizu, Kazuki Denpoh
  • Publication number: 20020182878
    Abstract: First and second pressure sensors 132 and 134 that perform pressure detection over different pressure detection ranges from each other detect the pressure within a process chamber 102 of an etching device 100. A pressure controller 144 selects optimal pressure data in correspondence to the pressure inside the process chamber from the pressure data provided by the first and second pressure sensors 132 and 134. It also analyzes the selected pressure data at a resolution selected in correspondence to the pressure inside the process chamber 102 and thus obtains pressure data achieving a predetermined data density. The pressure controller 134 controls a pressure control valve 130 so as to ensure that the pressure data match preset pressure data.
    Type: Application
    Filed: June 13, 2002
    Publication date: December 5, 2002
    Inventors: Eiji Hirose, Noriyuki Iwabuchi, Takeshi Yokouchi, Shingo Suzuki