Patents by Inventor Noriyuki Kimura

Noriyuki Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11411130
    Abstract: A photodetector includes: a photoreceptor provided with a SPAD that is configured to respond to incidence of a photon, and as the response of the SPAD, configured to output a pulse signal; and a pulse rate control circuit configured to control sensitivity of the photoreceptor to have a pulse rate as the number of pulse signals outputted per unit time from the photoreceptor to be a set value set in advance, (i) in a set range including the set value, (ii) in a set range of the set value or more, or (iii) in a set range of the set value or less.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: August 9, 2022
    Assignee: DENSO CORPORATION
    Inventors: Kenta Azuma, Noriyuki Ozaki, Shinji Kashiwada, Teiyu Kimura, Isamu Takai, Hiroyuki Matsubara, Mitsuhiko Ohta, Shigeyoshi Hiratsuka
  • Patent number: 11314185
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: April 26, 2022
    Assignee: RICOH COMPANY, LTD.
    Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
  • Publication number: 20210200120
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Application
    Filed: March 17, 2021
    Publication date: July 1, 2021
    Applicant: Ricoh Company, Ltd.
    Inventors: Nobuo TAKAMI, Noriyuki KIMURA, Eisuke HORI, Hideki KIMURA, Kenji KIKUCHI, Yuji SUZUKI
  • Patent number: 11011439
    Abstract: A hollow type semiconductor device has a pre-molded substrate (15) in which an element mounting portion, top surfaces of inner leads (2), and a top surface of frame-shaped wiring (7) are exposed on a first surface of a resin sealing body (6), and back surfaces of outer leads (3) and a back surface of a first frame-shaped wall (8) are exposed on a back surface of the resin sealing body (6). A hollow sealing body (14) including a second frame-shaped wall (9) and a sealing plate (4) is provided on the pre-molded substrate (15). The second frame-shaped wall (9) and the sealing plate (4) enclose a hollow portion (13) in which a semiconductor element (1) is kept.
    Type: Grant
    Filed: May 17, 2019
    Date of Patent: May 18, 2021
    Assignee: ABLIC INC.
    Inventor: Noriyuki Kimura
  • Patent number: 10976686
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Grant
    Filed: October 3, 2019
    Date of Patent: April 13, 2021
    Assignee: RICOH COMPANY, LTD.
    Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
  • Publication number: 20200150133
    Abstract: An object of the present invention is to provide a marker useful for early diagnosis and differentiation of Alzheimer's disease, and use thereof. An Alzheimer's disease biomarker composed of blood flotillin is provided.
    Type: Application
    Filed: May 16, 2018
    Publication date: May 14, 2020
    Inventors: Makoto Michikawa, Hiroyasu Akatsu, Mohammad Abdullah, Etsuro Matsubara, Noriyuki Kimura
  • Patent number: 10600752
    Abstract: A resin-encapsulated semiconductor device includes a bump electrode formed on an element surface side of a semiconductor chip, a conductive layer electrically connected to the bump electrode, and a resin encapsulation body covering the semiconductor chip, the bump electrode, and the conductive layer. On a back surface of the semiconductor chip that is flush with a back surface of the resin encapsulation body, a metal layer and a laminated film are formed. The laminated film is formed on a front surface of the conductive layer, and an external terminal is arranged on an inner side of an outer edge of the semiconductor chip.
    Type: Grant
    Filed: July 10, 2019
    Date of Patent: March 24, 2020
    Assignee: ABLIC Inc.
    Inventor: Noriyuki Kimura
  • Publication number: 20200033755
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Application
    Filed: October 3, 2019
    Publication date: January 30, 2020
    Applicant: Ricoh Company, Ltd.
    Inventors: Nobuo TAKAMI, Noriyuki KIMURA, Eisuke HORI, Hideki KIMURA, Kenji KIKUCHI, Yuji SUZUKI
  • Publication number: 20190355635
    Abstract: A hollow type semiconductor device has a pre-molded substrate (15) in which an element mounting portion, top surfaces of inner leads (2), and a top surface of frame-shaped wiring (7) are exposed on a first surface of a resin sealing body (6), and back surfaces of outer leads (3) and a back surface of a first frame-shaped wall (8) are exposed on a back surface of the resin sealing body (6). A hollow sealing body (14) including a second frame-shaped wall (9) and a sealing plate (4) is provided on the pre-molded substrate (15). The second frame-shaped wall (9) and the sealing plate (4) enclose a hollow portion (13) in which a semiconductor element (1) is kept.
    Type: Application
    Filed: May 17, 2019
    Publication date: November 21, 2019
    Inventor: Noriyuki KIMURA
  • Publication number: 20190333888
    Abstract: A resin-encapsulated semiconductor device includes a bump electrode formed on an element surface side of a semiconductor chip, a conductive layer electrically connected to the bump electrode, and a resin encapsulation body covering the semiconductor chip, the bump electrode, and the conductive layer. On a back surface of the semiconductor chip that is flush with a back surface of the resin encapsulation body, a metal layer and a laminated film are formed. The laminated film is formed on a front surface of the conductive layer, and an external terminal is arranged on an inner side of an outer edge of the semiconductor chip.
    Type: Application
    Filed: July 10, 2019
    Publication date: October 31, 2019
    Inventor: Noriyuki KIMURA
  • Patent number: 10459370
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: October 29, 2019
    Assignee: RICOH COMPANY, LTD.
    Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
  • Patent number: 10354968
    Abstract: The resin-encapsulated semiconductor device includes a bump electrode (2) formed on an element surface side of a semiconductor chip (1), a conductive layer (3) electrically connected to the bump electrode (2), and a resin encapsulation body (6) covering the semiconductor chip (1), the bump electrode (2), and the conductive layer (3). On a back surface of the semiconductor chip (1) that is flush with a back surface of the resin encapsulation body (6), a metal layer (4) and a laminated film (5) are formed. The laminated film (5) is formed on a front surface of the conductive layer (3). The external terminal (9) is arranged on an inner side of an outer edge of the semiconductor chip (1).
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: July 16, 2019
    Assignee: ABLIC Inc.
    Inventor: Noriyuki Kimura
  • Publication number: 20180335719
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Application
    Filed: July 30, 2018
    Publication date: November 22, 2018
    Inventors: Nobuo TAKAMI, Noriyuki KIMURA, Eisuke HORI, Hideki KIMURA, Kenji KIKUCHI, Yuji SUZUKI
  • Publication number: 20180286827
    Abstract: The resin-encapsulated semiconductor device includes a bump electrode (2) formed on an element surface side of a semiconductor chip (1), a conductive layer (3) electrically connected to the bump electrode (2), and a resin encapsulation body (6) covering the semiconductor chip (1), the bump electrode (2), and the conductive layer (3). On a back surface of the semiconductor chip (1) that is flush with a back surface of the resin encapsulation body (6), a metal layer (4) and a laminated film (5) are formed. The laminated film (5) is formed on a front surface of the conductive layer (3). The external terminal (9) is arranged on an inner side of an outer edge of the semiconductor chip (1).
    Type: Application
    Filed: March 20, 2018
    Publication date: October 4, 2018
    Inventor: Noriyuki KIMURA
  • Patent number: 10054873
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Grant
    Filed: September 19, 2017
    Date of Patent: August 21, 2018
    Assignee: RICOH COMPANY, LTD.
    Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
  • Patent number: 9935030
    Abstract: A first resin encapsulated body and a second resin encapsulated body are stacked to form a resin-encapsulated semiconductor device. The first resin encapsulated body includes: a first semiconductor element; an external terminal; inner wiring; and a first resin for covering those components, at least a rear surface of the external terminal, a rear surface of the semiconductor element, and a surface of the inner wiring are exposed from the first resin. The second resin encapsulated body includes: a second semiconductor element having an electrode pad formed on a surface thereof; a second resin for covering the second semiconductor element; and a metal body connected to the electrode pad, and is partly exposed from the second resin. The inner wiring and the metal body are electrically connected to each other.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: April 3, 2018
    Assignee: SII Semiconductor Corporation
    Inventor: Noriyuki Kimura
  • Publication number: 20180024466
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Application
    Filed: September 19, 2017
    Publication date: January 25, 2018
    Inventors: NOBUO TAKAMI, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
  • Patent number: 9824687
    Abstract: [Object] An object is to provide an easy-to-use speech processing system attaining higher accuracy of speech recognition. [Solution] Receiving a speech utterance, the speech processing system performs speech recognition and displays a text of the recognition result. Further, the speech processing system translates the recognition result in accordance with settings to a text of another language and displays and synthesizes speech of the translated result. Further, the speech processing system selects utterance candidates having high possibility to be uttered as the next utterance and having high translation and speech recognitions scores, using outputs of various sensors at the time of utterance, a pre-trained utterance sequence model and translation and speech recognition scores of utterance candidates, and recommends utterance candidates in the form of an utterance candidate recommendation list. A user can think of what to say next using the utterances in utterance candidate recommendation list as hints.
    Type: Grant
    Filed: July 1, 2013
    Date of Patent: November 21, 2017
    Assignee: National Institute of Information and Communications Technology
    Inventors: Komei Sugiura, Hideo Okuma, Noriyuki Kimura, Yoshinori Shiga, Teruaki Hayashi, Etsuo Mizukami
  • Patent number: 9778596
    Abstract: A system with a container including a protrusion, and a receiver to receive the container. The receiver includes a slide block that is movable relative to a body of the receiver, the slide block including two surfaces, a first surface, initially contacted by the protrusion of the container during insertion of the container into the receiver, having a first slope to resist movement of the container towards the receiver, and a second surface, subsequently contacted by the protrusion of the container during the insertion of the container into the receiver, having a second slope to interact with the protrusion of the container to assist movement of the container towards the receiver. This construction provides the user with a changing insertion force to indicate proper mounting of the container.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: October 3, 2017
    Assignee: RICOH COMPANY, LTD.
    Inventors: Nobuo Takami, Noriyuki Kimura, Eisuke Hori, Hideki Kimura, Kenji Kikuchi, Yuji Suzuki
  • Patent number: 9772579
    Abstract: A developing device includes a developer bearer disposed facing a latent image bearer in a developing range to transport developer by rotation, a support to support the developer bearer and including a holder mount, a rod-shaped developer regulator disposed facing a surface of the developer bearer across a gap, and a holder secured to the holder mount of the support to hold the rod-shaped developer regulator. The rod-shaped developer regulator extends in an axial direction of the developer bearer.
    Type: Grant
    Filed: December 30, 2016
    Date of Patent: September 26, 2017
    Assignee: Ricoh Company, Ltd.
    Inventors: Yuki Oshikawa, Akira Azami, Yoshiko Ogawa, Masaaki Yamada, Yoshihiro Fujiwara, Noriyuki Kimura, Yoshiharu Kishi, Yasunobu Shimizu, Junichi Matsumoto, Yoshiyuki Fukuda, Yuuji Ishikura, Kei Saito