Patents by Inventor Noyan Kinayman

Noyan Kinayman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20030174032
    Abstract: A surface-mountable millimeter-wave waveguide filter is constructed using irises in a rectangular waveguide formed in a dielectric material such as glass. The filter structure is surface-mountable, has a single dielectric layer, and can be manufactured using a suitable monolithic microwave integrated circuit (MMIC) process. The filter has potential applications in millimeter-wave systems such as Local Multipoint Distribution System (LMDS) and Autonomous Cruise Control (ACC) radar for automobiles.
    Type: Application
    Filed: March 14, 2002
    Publication date: September 18, 2003
    Inventors: Noyan Kinayman, Eswarappa Channabasappa, Allan Buckle, Nitin Jain
  • Publication number: 20030150641
    Abstract: An integrated circuit package assembly includes an integrated circuit, and a plurality of layers sealably connectable to each other to form a package having a cavity sized and shaped to receive the integrated circuit. Each layer is formed of a respective material. Each respective material is suitable for use as a printed circuit board substrate. At least one of the plurality of layers is a substrate having contacts that are connectable to electrical contacts of the integrated circuit. A bottom one of the layers has a plurality of ball attach pads, electrically connected to the contacts of the substrate.
    Type: Application
    Filed: February 14, 2002
    Publication date: August 14, 2003
    Inventors: Noyan Kinayman, Richard Anderson, Bernard A. Ziegner, Jean-Pierre Lanteri
  • Publication number: 20030151133
    Abstract: A laminate multilayer ball-grid-array package is suitable for millimeter-wave circuits. The frequency bandwidth of the package is DC to 40 GHz. The package is made using laminate circuit board materials to match the temperature expansion coefficients of the package to the host PCB. Electrical connection between the package and the host PCB on which the package is mounted is achieved using ball-grid-array technology. The package can be sealed, covered, or encapsulated, and is suitable for high-volume production.
    Type: Application
    Filed: February 14, 2002
    Publication date: August 14, 2003
    Inventors: Noyan Kinayman, Bernard A. Ziegner, Richard Anderson, Jean-Pierre Lanteri, M. Tekamul Buber
  • Patent number: 6573803
    Abstract: A surface-mountable mm-wave signal source is provided. The surface-mountable mm-wave signal source comprises: a conductive metal base; a mm-wave signal source disposed over an upper portion of the metal base; a first radio frequency transmission line carrying a quasi-TEM signal from the mm-wave signal source, which is disposed over an upper portion of the metal base and proximate the signal source; a first mode transformer at least partially integrated into the upper portion of the metal base to convert the quasi-TEM signal carried by the planar transmission line into a rectangular waveguide mode signal; a waveguide well having upper and lower ends disposed within the base for carrying the rectangular waveguide mode signal from an upper portion of the base to a lower portion of the base; and a second mode transformer at least partially integrated into the lower portion of the base to convert the rectangular waveguide mode signal to a quasi-TEM signal within a second radio frequency transmission line.
    Type: Grant
    Filed: October 12, 2000
    Date of Patent: June 3, 2003
    Assignee: Tyco Electronics Corp.
    Inventors: Bernhard Alphonso Ziegner, Robert John Sletten, Stephen R. Brown, May Kyi Cho, Noyan Kinayman
  • Publication number: 20030075743
    Abstract: A method and apparatus are disclosed for reducing crosstalk and dispersion in a crosspoint monolithic microwave integrated circuit (MMIC) switch array operating in a range between DC and microwave frequencies. In accordance with an exemplary embodiment, the crosspoint MMIC switch array includes a dielectric stack, a substrate, a first ground plane, a plurality of thyristor switches, a plurality of signal transmission lines arranged in rows; and a plurality of signal transmission lines arranged in columns. The plurality of signal transmission lines arranged in columns intersect the plurality of signal transmission lines arranged in rows at a plurality of intersection points. Each of the plurality of thyristor switches is associated with one of the plurality of intersection points. Each of the plurality of thyristor switches is in electrical contact with the signal transmission lines that intersect at the associated intersection point.
    Type: Application
    Filed: October 15, 2002
    Publication date: April 24, 2003
    Inventors: Jules D. Levine, Ross A. La Rue, Daniel Curcio, Timothy Boles, Joel Goodrich, David Hoag, Noyan Kinayman
  • Patent number: 6201454
    Abstract: An improved frequency response for a bond wire (1) at high frequency operation is realized by using a matching element (13) including a meander line (9) structure. The frequency response is improved at an operating frequency by design.
    Type: Grant
    Filed: March 30, 1999
    Date of Patent: March 13, 2001
    Assignee: The Whitaker Corporation
    Inventors: Noyan Kinayman, Nitin Jain