Patents by Inventor Nozomi YATSUMONJI

Nozomi YATSUMONJI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230079532
    Abstract: To provide an airflow amount measuring device capable of accurately measuring a flow amount of air without occurrence of warpage in a thin film portion when an airflow measuring element is mounted on a lead frame to form a resin-sealed package in which the airflow amount measuring element and the lead frame are sealed. A chip package includes a lead frame, an element mounted on the lead frame and having a detection portion, and a structure for sealing the lead frame and the element such that at least the detection portion is exposed. Then, the curvature radius ? of the exposed portion of the element exposed from the sealing resin member is 2.13 or less.
    Type: Application
    Filed: December 25, 2020
    Publication date: March 16, 2023
    Applicant: Hitachi Astemo, Ltd.
    Inventors: Binti Haridan FATIN FARHANAH, Hiroyuki ABE, Takayuki YOGO, Nozomi YATSUMONJI, Mizuki IJUIN
  • Patent number: 11346695
    Abstract: Provided is a physical quantity detection device capable of achieving both rigidity improvement and sealability improvement. A physical quantity detection device (20) of the invention includes a housing (100), a cover (200), a chip package (310), and a flow rate sensor (311) supported by the chip package and arranged in a sub-passage. The housing includes: a first adhesive groove 160A which is an adhesive groove to which an adhesive for bonding the cover is applied, extends along a proximal end of the housing, extends in the protruding direction of the housing from the proximal end of the housing to a position on a more distal end side of the housing than the chip package, and is applied with the first adhesive 401; and a second adhesive groove 160B which extends along the sub-passage 134 and is applied with the second adhesive 402. The first adhesive has a higher Young's modulus, and the second adhesive has a higher thixotropy.
    Type: Grant
    Filed: January 23, 2020
    Date of Patent: May 31, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Shigeto Hirohata, Akira Uenodan, Nobuaki Gorai, Takahiro Miki, Nozomi Yatsumonji
  • Publication number: 20220099469
    Abstract: Provided is a physical quantity detection device capable of electrically connecting with a neutralization region arranged at a place through which a measurement target gas passes in a simple process. A physical quantity detection device 300 of the invention includes a housing 301 having a terminal 303 and a passage portion 100 through which a measurement target gas passes, and a support body 600 that supports a flow rate detection element 601. A neutralization region 500 is formed on the bottom surface of the passage portion of the housing, and the support body is supported by the housing such that the detection unit of the flow rate detection element faces the neutralization region.
    Type: Application
    Filed: January 21, 2020
    Publication date: March 31, 2022
    Inventors: Nozomi YATSUMONJI, Akira UENODAN, Takahiro MIKI, Hiroyuki ABE
  • Publication number: 20220074774
    Abstract: Provided is a physical quantity detection device capable of achieving both rigidity improvement and sealability improvement. A physical quantity detection device (20) of the invention includes a housing (100), a cover (200), a chip package (310), and a flow rate sensor (311) supported by the chip package and arranged in a sub-passage. The housing includes: a first adhesive groove 160A which is an adhesive groove to which an adhesive for bonding the cover is applied, extends along a proximal end of the housing, extends in the protruding direction of the housing from the proximal end of the housing to a position on a more distal end side of the housing than the chip package, and is applied with the first adhesive 401; and a second adhesive groove 160B which extends along the sub-passage 134 and is applied with the second adhesive 402. The first adhesive has a higher Young's modulus, and the second adhesive has a higher thixotropy.
    Type: Application
    Filed: January 23, 2020
    Publication date: March 10, 2022
    Inventors: Shigeto HIROHATA, Akira UENODAN, Nobuaki GORAI, Takahiro MIKI, Nozomi YATSUMONJI
  • Patent number: 11137292
    Abstract: A physical quantity detecting device includes a circuit board having a first support portion with a physical quantity detecting element, a second support portion with a temperature detecting element, and a housing molded by injection molding, the housing supporting the circuit board. The physical quantity detecting element is configured to detect a physical quantity of fluid and the temperature detecting element is configured to detect a temperature of the fluid. The second support portion protrudes from an edge of the circuit and has a third support portion supporting the second support portion in connection with the housing. The third support portion is located on a same side as the leading end portion, with respect to a base end portion, and located on a same side as the base end portion, with respect to an implementation portion on which the temperature detecting element is implemented.
    Type: Grant
    Filed: June 30, 2017
    Date of Patent: October 5, 2021
    Assignee: HITACHI AUTOMOTIVE SYSTEMS, LTD.
    Inventors: Nozomi Yatsumonji, Hiroaki Hoshika, Takayuki Yogo, Takahiro Miki, Hiroyuki Abe
  • Publication number: 20190170589
    Abstract: An object of the present invention is to provide a physical quantity detecting device capable of inhibiting a cantilever-shaped portion of a circuit board from resonating.
    Type: Application
    Filed: June 30, 2017
    Publication date: June 6, 2019
    Applicant: Hitachi Automotive Systems, Ltd.
    Inventors: Nozomi YATSUMONJI, Hiroaki HOSHIKA, Takayuki YOGO, Takahiro MIKI, Hiroyuki ABE