Patents by Inventor Ofer Rosenzweig
Ofer Rosenzweig has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220409909Abstract: A feedthrough assembly for an implantable medical device includes a housing, a solid insert, one or more conductive elements, a metal filler, and a non-corrosive sealant. The housing defines a central cavity through a height of the housing. The solid insert is disposed within the central cavity of the housing. The one or more conductive elements extend through one or more apertures defined within the solid insert and extend through the central cavity of the housing. The metal filler is disposed within a joint defined by an outer surface of the solid insert and an inner surface of the housing that defines the central cavity. The non-corrosive sealant coats a top surface of the metal filler to inhibit corrosion of the metal filler.Type: ApplicationFiled: June 23, 2021Publication date: December 29, 2022Inventors: Haytham Hussein, John Szymanski, Kavous Sahabi, Ofer Rosenzweig, Stella Nichols
-
Patent number: 11478651Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.Type: GrantFiled: July 29, 2020Date of Patent: October 25, 2022Assignee: PACESETTER, INC.Inventors: Dino Bortolin, Ofer Rosenzweig
-
Patent number: 11464988Abstract: A header-less implantable medical device, system and method are provided. The device includes an electronics module including circuitry, a battery, a receptacle assembly having an interior chamber and a receptable inlet configured to receive a lead connector assembly. A device housing has a case body that includes side walls and a peripheral edge that defines a single common chamber. The electronics module, battery and receptacle assembly are provided within the single common chamber. A connector opening is provided in the case body and joined to the receptacle inlet to form a passage through the case body into the interior chamber of the receptacle assembly.Type: GrantFiled: July 2, 2020Date of Patent: October 11, 2022Assignee: PACESETTER, INC.Inventors: Wisit Lim, Ofer Rosenzweig, Reza Shahandeh, Alex Soriano
-
Publication number: 20220087708Abstract: A blade for a cutting instrument includes a handle, a body, and at least three cutting edges along the body. The body has first and second sides extending along a longitudinal center axis. The body has a proximal end at the handle and a distal tip remote from the handle. The at least three cutting edges are oriented at corresponding angles with respect to the longitudinal center axis and are asymmetrically distributed with respect to the longitudinal center axis.Type: ApplicationFiled: June 18, 2021Publication date: March 24, 2022Inventors: Xiangqun Chen, Rodney Hawkins, Adam Evard, Alex Soriano, Ofer Rosenzweig
-
Publication number: 20220001186Abstract: A header-less implantable medical device, system and method are provided. The device includes an electronics module including circuitry, a battery, a receptacle assembly having an interior chamber and a receptable inlet configured to receive a lead connector assembly. A device housing has a case body that includes side walls and a peripheral edge that defines a single common chamber. The electronics module, battery and receptacle assembly are provided within the single common chamber. A connector opening is provided in the case body and joined to the receptacle inlet to form a passage through the case body into the interior chamber of the receptacle assembly.Type: ApplicationFiled: July 2, 2020Publication date: January 6, 2022Inventors: Wisit Lim, Ofer Rosenzweig, Reza Shahandeh, Alex Soriano
-
Patent number: 10869634Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.Type: GrantFiled: December 5, 2018Date of Patent: December 22, 2020Assignee: PACESETTER, INC.Inventors: Wisit Lim, Reza Imani, Brett Villacencio, Mitch Goodman, Ofer Rosenzweig
-
Publication number: 20200353267Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.Type: ApplicationFiled: July 29, 2020Publication date: November 12, 2020Inventors: Dino BORTOLIN, Ofer ROSENZWEIG
-
Patent number: 10765874Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.Type: GrantFiled: April 18, 2018Date of Patent: September 8, 2020Assignee: PACESETTER, INC.Inventors: Dino Bortolin, Ofer Rosenzweig
-
Patent number: 10682519Abstract: A pulse generator comprises a header connector assembly coupled with a housing. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The connector assembly includes an electrically insulative segment, a first electrically conductive segment, and a second electrically conductive segment axially spaced apart from the first electrically conductive segment by the electrically insulative segment. Each electrically conductive segment includes a connector ring, a spring housing and a spring supported by the spring housing. The connector ring and spring housing are in electrical communication with each other. The electrically insulative segment includes an insulator ring that is positioned between the first and second electrically conductive segments. The insulator ring includes a first end and a second end axially opposite the first end.Type: GrantFiled: June 8, 2016Date of Patent: June 16, 2020Assignee: PACESETTER, INC.Inventors: Asghar Dadashian, Kavous Sahabi, Avi Bilu, Ofer Rosenzweig, Arees Garabed, Armando M. Cappa, Evan Sheldon, Xiangqun Chen, Alexander Robertson
-
Publication number: 20190104990Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Inventors: Wisit Lim, Reza Imani, Brett Villacencio, Mitch Goodman, Ofer Rosenzweig
-
Patent number: 10172559Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.Type: GrantFiled: May 13, 2016Date of Patent: January 8, 2019Assignee: Pacesetter, Inc.Inventors: Wisit Lim, Reza Imani, Brett Villacencio, Mitch Goodman, Ofer Rosenzweig
-
Patent number: 10105544Abstract: The present disclosure provides medical devices and methods of manufacturing medical devices wherein the medical device includes at least one bonding surface that has been roughed by laser etching to increase its surface area and improve its bonding characteristics. In many embodiments, the medical device is an implantable medical device that includes a hermetically sealed metallic housing that is bonded to a prefabricated non-metallic header. The hermetically sealed metallic housing includes at least one surface that has been subjected to a laser etching and roughening process to increase its surface area and improve its bonding characteristics. The laser etched surface may include spots created in a non-overlapping honeycomb-type pattern that may additionally include a series of spikes protruding therefrom to further improve bonding characteristics.Type: GrantFiled: August 30, 2016Date of Patent: October 23, 2018Assignee: PACESETTER, INC.Inventors: Asghar Dadashian, Avi Bilu, Ofer Rosenzweig, Sean Portune
-
Publication number: 20180236243Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.Type: ApplicationFiled: April 18, 2018Publication date: August 23, 2018Inventors: Dino Bortolin, Ofer Rosenzweig
-
Patent number: 9974966Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.Type: GrantFiled: December 15, 2015Date of Patent: May 22, 2018Assignee: PACESETTER, INC.Inventors: Dino Bortolin, Ofer Rosenzweig
-
Publication number: 20180056077Abstract: The present disclosure provides medical devices and methods of manufacturing medical devices wherein the medical device includes at least one bonding surface that has been roughed by laser etching to increase its surface area and improve its bonding characteristics. In many embodiments, the medical device is an implantable medical device that includes a hermetically sealed metallic housing that is bonded to a prefabricated non-metailic header. The hermetically sealed metallic housing includes at least one surface that has been subjected to a laser etching and roughening process to increase its surface area and improve its bonding characteristics. The laser etched surface may include spots created in a non-overlapping honeycomb-type pattern that may additionally include a series of spikes protruding therefrom to further improve bonding characteristics.Type: ApplicationFiled: August 30, 2016Publication date: March 1, 2018Inventors: Asghar Dadashian, Avi Bilu, Ofer Rosenzweig, Sean Portune
-
Publication number: 20170354825Abstract: A pulse generator comprises a header connector assembly coupled with a housing. The header connector assembly includes a connector assembly and a header enclosing the connector assembly. The connector assembly includes an electrically insulative segment, a first electrically conductive segment, and a second electrically conductive segment axially spaced apart from the first electrically conductive segment by the electrically insulative segment. Each electrically conductive segment includes a connector ring, a spring housing and a spring supported by the spring housing. The connector ring and spring housing are in electrical communication with each other. The electrically insulative segment includes an insulator ring that is positioned between the first and second electrically conductive segments. The insulator ring includes a first end and a second end axially opposite the first end.Type: ApplicationFiled: June 8, 2016Publication date: December 14, 2017Inventors: Asghar Dadashian, Kavous Sahabi, Avi Bilu, Ofer Rosenzweig, Arees Garabed, Armando M. Cappa, Evan Sheldon, Xiangqun Chen, Alexander Robertson
-
Publication number: 20170325741Abstract: A device and method for manufacturing an implantable cardiac monitor device are provided. The method joins a feed-through assembly to a device housing having electronic components therein. The feed-through assembly includes conductors having distal ends connected to the electronic components and has proximal ends projecting from the feed-through assembly. The method assembles a header having a sensing electrode and an antenna embedded within a non-conductive header body. The electrode and antenna includes corresponding interconnection plates. The header body includes a housing mounting surface that includes at least one passage aligned with an interconnect cavity that includes the interconnection plates. The header body further includes a window exposing the interconnect cavity and interconnect regions.Type: ApplicationFiled: May 13, 2016Publication date: November 16, 2017Inventors: Wisit Lim, Reza Imani, Brett Villacencio, Mitch Goodman, Ofer Rosenzweig
-
Patent number: 9795796Abstract: Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.Type: GrantFiled: March 21, 2016Date of Patent: October 24, 2017Assignee: PACESETTER, INC.Inventors: Dino Bortolin, Ofer Rosenzweig, Christopher R. Jenney, Avi Bilu
-
Publication number: 20170165493Abstract: The present disclosure provides systems and methods for assembling a subassembly for use in manufacturing an implantable device header. A method includes placing a first split web into a top platen, placing a second split web into a bottom platen, placing a conductor assembly and an antenna assembly in the bottom platen on top of the second split web, compressing the top and bottom platens together, heating the top and bottom platens until a predetermined temperature and a predetermined pressure are reached, such that first split web is fused to the second split web to form the subassembly, separating the top and bottom platens, and removing the formed subassembly.Type: ApplicationFiled: December 15, 2015Publication date: June 15, 2017Inventors: Dino Bortolin, Ofer Rosenzweig
-
Publication number: 20170056675Abstract: Disclosed herein is an implantable electronic device. The device has a housing and a header connector assembly coupled to the housing. The header connector assembly has a connector assembly and a header enclosing the connector assembly. The connector assembly has a subassembly including an electrically conductive component at least partially residing within a first material that is provided about the electrically conductive component. The header has a second material that is provided about the connector assembly and the subassembly subsequent to the first material setting up about the electrically conductive component.Type: ApplicationFiled: March 21, 2016Publication date: March 2, 2017Inventors: Dino Bortolin, Ofer Rosenzweig, Christopher R. Jenney, Avi Bilu