Abstract: The resection apparatus includes a cutting instrument, e.g., a laser beam, and a unit for suturing the organ being resected, incorporating an oblong die with depressions for staples to bend, an oblong detachable staple body with a staple magazine and a staple ejector. A holder of the staple body has two members and, of which the first member is arranged parallel to the die and is rigidly coupled thereto, whereas the second member is arranged square with the former one, is offset transversely with respect to it and carries a retainer, to lock the staple body in position. Provision is also made in the apparatus for a hold-down frame set on the second member transversely in the plane of movement of the staple body so as encompass, while in one of its positions, the die along the external perimeter thereof for clamping the organ being resected. The first member has guideways for the cutting instrument to set and traverse.

Abstract: A method whereby a hollow organ is compressed from two sides along an intended line of section after which simultaneous dissection and welding of the edges of the cavities formed is carried out by moving a focused laser beam along said line.The degree of compressing the organ's walls is within the range from 1/5 to 1/2 of the initial thickness of said walls.A device for accomplishing said method has a pair of clamping jaws drawn together or apart by means of clamps. One of the jaws serves as a guide path for a carriage, mounted on which is the exit portion of a light guide with a focusing lens. The light guide is connected with a laser. A through slot is made in one of the jaws along the line of intended section and a groove is provided on the other jaw opposite said slot. The walls of the slot and the groove have a surface reflecting the laser beam.