Patents by Inventor Oliver Nagler
Oliver Nagler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220050083Abstract: A system and method for the acoustic detection of cracks in a semiconductor substrate is disclosed. In one example, the system includes a force generating unit configured to apply a force onto the semiconductor substrate, a detector unit comprising a resonating indenter and an acoustic emission sensor coupled to the resonating indenter, and an evaluation unit configured to evaluate acoustic signals detected by the detector unit and configured to determine whether a crack has occurred based on the detected signals. The resonating indenter is configured to contact the semiconductor substrate at a lateral distance from the force generating unit, and wherein the force generating unit and the resonating indenter are configured to contact the semiconductor substrate on the same side.Type: ApplicationFiled: August 13, 2021Publication date: February 17, 2022Applicant: Infineon Technologies AGInventors: Oliver NAGLER, Marianne UNTERREITMEIER
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Patent number: 10859534Abstract: A system for examining semiconductor substrates may comprise an indenter configured to exercise a force onto the semiconductor substrate such that a crack in the semiconductor substrate occurs, a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack, and attaching means configured to fasten the indenter to a first surface of the piezoelectric acoustic emission sensor. The indenter and the attaching means are configured to transmit the acoustic signal to the piezoelectric acoustic emission sensor. The resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another.Type: GrantFiled: December 6, 2018Date of Patent: December 8, 2020Assignee: Infineon Technologies AGInventors: Oliver Nagler, Sebastian Bernrieder, Marianne Unterreitmeier
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Patent number: 10598480Abstract: A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.Type: GrantFiled: March 28, 2017Date of Patent: March 24, 2020Assignee: Infineon Technologies AGInventors: Ivan Penjovic, Oliver Nagler
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Publication number: 20190178848Abstract: A system for examining semiconductor substrates may comprise an indenter configured to exercise a force onto the semiconductor substrate such that a crack in the semiconductor substrate occurs, a piezoelectric acoustic emission sensor configured to detect an acoustic signal emitted by the crack, and attaching means configured to fasten the indenter to a first surface of the piezoelectric acoustic emission sensor. The indenter and the attaching means are configured to transmit the acoustic signal to the piezoelectric acoustic emission sensor. The resonance frequencies of the indenter and the piezoelectric acoustic emission sensor are attuned to one another.Type: ApplicationFiled: December 6, 2018Publication date: June 13, 2019Applicant: Infineon Technologies AGInventors: Oliver Nagler, Sebastian Bernrieder, Marianne Unterreitmeier
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Patent number: 9885749Abstract: A method in accordance with various embodiments may include: measuring a contact force between at least one probe and at least one contact pad for a plurality of probe overdrive positions, and determining a relationship between contact force and probe overdrive position from the measured contact forces; determining a first region in the relationship exhibiting a non-linear dependence of the contact force from the probe overdrive position, and a second region exhibiting a linear dependence of the contact force from the probe overdrive position; and determining a process window for a pad probing process based on the determined first region and second region.Type: GrantFiled: June 8, 2016Date of Patent: February 6, 2018Assignee: INFINEON TECHNOLOGIES AGInventors: Ivan Penjovic, Josef Martin Paul Hennig, Oliver Nagler
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Publication number: 20170292832Abstract: A method of determining a minimum permissible tip diameter of probing needles of a probe card for wafer probing is described. The method includes performing a plurality of contact procedures of at least one probing needle to a plurality of bonding pads on a wafer. The plurality of contact procedures is performed at different stress applied by the at least one probing needle to the bonding pads. A chart of indentation depths of the plurality of bonding pads caused by the contact procedures at different stress is determined. A set of calibration coefficients based on the chart is determined, wherein the set of calibration coefficients allows to compute a predicted indentation depth as a function of stress. The minimum permissible probing needle tip diameter is determined based on an evaluation of the function.Type: ApplicationFiled: March 28, 2017Publication date: October 12, 2017Applicant: Infineon Technologies AGInventors: Ivan Penjovic, Oliver Nagler
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Publication number: 20160356844Abstract: A method in accordance with various embodiments may include: measuring a contact force between at least one probe and at least one contact pad for a plurality of probe overdrive positions, and determining a relationship between contact force and probe overdrive position from the measured contact forces; determining a first region in the relationship exhibiting a non-linear dependence of the contact force from the probe overdrive position, and a second region exhibiting a linear dependence of the contact force from the probe overdrive position; and determining a process window for a pad probing process based on the determined first region and second region.Type: ApplicationFiled: June 8, 2016Publication date: December 8, 2016Inventors: Ivan PENJOVIC, Josef Martin Paul HENNIG, Oliver NAGLER
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Patent number: 7190077Abstract: An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least—part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.Type: GrantFiled: June 12, 2003Date of Patent: March 13, 2007Assignee: Infineon Technologies AGInventors: Robert Bauer, Werner Ertle, Till Frohnmüller, Bernd Goller, Reinhard Greiderer, Oliver Nagler, Olaf Schmeckebier, Wolfgang Stadler
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Publication number: 20050242374Abstract: An integrated semiconductor structure has a substrate, a semiconductor element located on the substrate, a pad metal, metal layers located between the pad metal and the substrate, and insulation layers that separate the metal layers from one another. The pad metal extends over at least -part of the semiconductor element. Below the surface of the pad metal, at least the top two metal layers include two or more adjacent interconnects.Type: ApplicationFiled: June 12, 2003Publication date: November 3, 2005Inventors: Robert Bauer, Werner Ertle, Till Frohnmuller, Bernd Goller, Reinhard Greiderer, Oliver Nagler, Olaf Schmeckebier, Wolfgang Stadler
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Patent number: 6389898Abstract: A microsensor with a resonator structure, which is excited by first electrical signals to oscillate and emits second electrical signals in dependence on the measuring variable, wherein a heating element, supplied with at least one of the first electrical signals, is arranged on the resonator structure for the thermal excitations of oscillations. For the thermal excitation of lateral oscillations in a microsensor with a resonator structure, the microsensor is provided at one oscillating part of the resonator structure with at least two regions that are thermally separated by a zone with reduced heat conductance, and the heating element is arranged on one of the regions. This type of arrangements permits the excitation of the resonator structure to lateral oscillations if the heating element is supplied with corresponding current pulses. It is advantageous if a receiving element is arranged on at least one of the other regions to detect the oscillation amplitude.Type: GrantFiled: February 22, 2000Date of Patent: May 21, 2002Assignee: DaimlerChrysler AGInventors: Helmut Seidel, Matthias Aikele, Ulrich Prechtel, Oliver Nagler, Karl Kühl