Patents by Inventor Omer Wolkovitz

Omer Wolkovitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11190191
    Abstract: A Multi-Chip-Module (MCM) includes an MCM substrate, and at least a data producing IC (DPIC) and a data-consuming IC (DCIC), both mounted on the MCM substrate and connected to one another through a high-speed bus including at least first and second embedded-clock data lanes. The DCIC includes a clock-data recovery circuit (CDR) and a data sampler. The CDR is configured to restore a data and a clock from the first data lane, and to output phase correction signaling. The data sampler is configured to restore the data from the second data lane by sampling the second data lane at a phase responsive to the phase correction signaling derived from the first data lane.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: November 30, 2021
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Omer Wolkovitz, Eilon Yanai
  • Publication number: 20210297082
    Abstract: A Multi-Chip-Module (MCM) includes an MCM substrate, and at least a data producing IC (DPIC) and a data-consuming IC (DCIC), both mounted on the MCM substrate and connected to one another through a high-speed bus including at least first and second embedded-clock data lanes. The DCIC includes a clock-data recovery circuit (CDR) and a data sampler. The CDR is configured to restore a data and a clock from the first data lane, and to output phase correction signaling. The data sampler is configured to restore the data from the second data lane by sampling the second data lane at a phase responsive to the phase correction signaling derived from the first data lane.
    Type: Application
    Filed: May 3, 2021
    Publication date: September 23, 2021
    Inventors: Omer Wolkovitz, Eilon Yanai
  • Patent number: 11031939
    Abstract: A Multi-Chip-Module (MCM) includes an MCM substrate, and at least a data producing IC (DPIC) and a data-consuming IC (DCIC), both mounted on the MCM substrate and connected to one another through a high-speed bus including at least first and second embedded-clock data lanes. The DCIC includes a clock-data recovery circuit (CDR) and a data sampler. The CDR is configured to restore a data and a clock from the first data lane, and to output phase correction signaling. The data sampler is configured to restore the data from the second data lane by sampling the second data lane at a phase responsive to the phase correction signaling derived from the first data lane.
    Type: Grant
    Filed: March 19, 2020
    Date of Patent: June 8, 2021
    Assignee: MELLANOX TECHNOLOGIES, LTD.
    Inventors: Omer Wolkovitz, Eilon Yanai