Patents by Inventor Ono Takatoshi

Ono Takatoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Apparatus for cutting a sheet-like member applied to a surface of a semiconductor wafer
    Patent number: 4603609
    Abstract: The invention provides an apparatus for cutting a sheet-like member such as an adhesive tape applied to a surface of a semiconductor wafer at the periphery of said semiconductor wafer.The apparatus comprises a heating rod to be brought into contact with the periphery of the semiconductor wafer, heating means for heating the heating rod, urging means for relatively urging the heating rod against the periphery of the semiconductor wafer, and a moving mechanism for relatively moving the heating rod along the periphery of the semiconductor wafer. The heating rod is moved relative to the periphery of the semiconductor wafer as the heating rod is urged against the periphery of the semiconductor wafer, and thereby the sheet-like member applied to the semiconductor wafer is melted and cut at the periphery of the semiconductor wafer.
    Type: Grant
    Filed: October 17, 1984
    Date of Patent: August 5, 1986
    Assignee: Disco Abrasive Systems, Ltd.
    Inventor: Ono Takatoshi