Patents by Inventor Osamu Kagaya

Osamu Kagaya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7420517
    Abstract: A plurality of heating wires 2 have a plurality of detours 1 formed therein, the heating wires 2 have inlets 10 formed therein for connection with the detours 1, and both ends of each of the inlets 10 and both ends of each of the detours 1 are connected by a pair of connection lines 9. When a shorter one of the shortest spacing between the paired connection lines 9 and the shortest spacing between both ends of the inlets 10 is called We, when the maximum width of the detours 1 in a horizontal direction is called Wr, when a received frequency has a wavelength of ?0 in the air, and when the formula of {(Wr?We)/2}=L1 is established, the formula of L1?0.0053·?0 is satisfied.
    Type: Grant
    Filed: April 17, 2007
    Date of Patent: September 2, 2008
    Assignee: Asahi Glass Company, Limited
    Inventors: Kiyoshi Oshima, Osamu Kagaya, Koji Ikawa, Toshifumi Funatsu
  • Publication number: 20080196929
    Abstract: An optical transmitter module is described. The optical transmitter module includes a lead pin for electrically connecting the inside and outside of a housing, and a flexible printed circuit board connected to the lead pin. The flexible printed circuit board has a signal pattern and two ground conductor patterns to be connected to an optical modulation element, a laser terminal pattern to be connected to a semiconductor laser, a Peltier terminal pattern to be connected to a Peltier element, and two covering conductive layers in addition to a layer on which such patterns are formed. The covering conductive layers cover all the patterns except for the signal pattern.
    Type: Application
    Filed: December 20, 2007
    Publication date: August 21, 2008
    Inventors: Hisashi Takamatsu, Takeshi Yamashita, Hideyuki Kuwano, Osamu Kagaya, Hiroyuki Arima
  • Patent number: 7411179
    Abstract: A photodetector module that can achieve impedance matching and power saving. A photodetector (11) and an amplifier (12) for amplifying an electric signal from the photodetector (11) are mounted on a stem (14). A dielectric plate (18) is arranged between the stem (14) and a flexible substrate (20). To transfer an electric signal from the amplifier (12) to the substrate (20), a lead pin (15d) is provided to pass through the stem (14) and the dielectric plate (18). The output of the amplifier (12) includes a capacitance component, and the output impedance of the amplifier (12) is higher than the impedance that matches with the substrate (20). Further, the thickness d of the dielectric plate (18) is such that the inductance component of the lead pin (15d) includes an inductance component that is inductive, which cancels the capacitance component of the amplifier, and impedance matching with the substrate (20) can be achieved.
    Type: Grant
    Filed: February 8, 2007
    Date of Patent: August 12, 2008
    Assignee: Opnext Japan, Inc.
    Inventors: Michihide Sasada, Osamu Kagaya, Yukitoshi Okamura
  • Patent number: 7400791
    Abstract: An optical transmission module of the invention uses a semiconductor chip forming an optical modulator integrated laser on a semi-insulating semiconductor board. An input transfer line and an anode electrode of an optical modulator element are connected by a first bonding wire. The anode electrode of the optical modulator element and one of the ends of a terminal resistor element are connected by a second bonding wire. A cathode electrode of the optical modulator element and the other end of the terminal resistor element are connected by a third bonding wire. The cathode electrode of the optical modulator element and a ground electrode are connected by a fourth bonding wire. A joint portion between the first bonding wire and the input transfer line is arranged on an opposite side to a joint portion between the fourth bonding wire and the ground electrode while interposing the semiconductor chip between them.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: July 15, 2008
    Assignee: Opnext Japan, Inc.
    Inventor: Osamu Kagaya
  • Patent number: 7391099
    Abstract: A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted while being inclined with respect to a package, so that each distance between the transmission lines can be reduced. Thereby, the lengths of wires for connecting the transmission lines can be reduced so as to improve frequency characteristics of an optical modulator module.
    Type: Grant
    Filed: January 31, 2006
    Date of Patent: June 24, 2008
    Assignee: Opnext Japan, Inc.
    Inventors: Hiroyuki Arima, Masanobu Okayasu, Osamu Kagaya, Kazuhiko Naoe, Tetsuya Kato
  • Publication number: 20080048777
    Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.
    Type: Application
    Filed: October 1, 2007
    Publication date: February 28, 2008
    Inventors: Iwamichi Kohjiro, Yasuhiro Nunogawa, Sakae Kikuchi, Shizuo Kondo, Tetsuaki Adachi, Osamu Kagaya, Kenji Sekine, Eiichi Hase, Kiichi Yamashita
  • Publication number: 20080011938
    Abstract: A photodetector module that can achieve impedance matching and power saving. A photodetector (11) and an amplifier (12) for amplifying an electric signal from the photodetector (11) are mounted on a stem (14). A dielectric plate (18) is arranged between the stem (14) and a flexible substrate (20). To transfer an electric signal from the amplifier (12) to the substrate (20), a lead pin (15d) is provided to pass through the stem (14) and the dielectric plate (18). The output of the amplifier (12) includes a capacitance component, and the output impedance of the amplifier (12) is higher than the impedance that matches with the substrate (20). Further, the thickness d of the dielectric plate (18) is such that the inductance component of the lead pin (15d) includes an inductance component that is inductive, which cancels the capacitance component of the amplifier, and impedance matching with the substrate (20) can be achieved.
    Type: Application
    Filed: February 8, 2007
    Publication date: January 17, 2008
    Inventors: Michihide SASADA, Osamu Kagaya, Yukitoshi Okamura
  • Patent number: 7289075
    Abstract: There are disposed first coupling conductors, which comprise a pair of coupling branch lines 1 and 2 connected to the first antenna conductor 3 and extend inward from the first antenna conductor. The coupling branch lines 1 and 2 have open ends 1a and 2a disposed so as to be adjacent to each other and be capacitively coupled to each other. The open ends 1a and 2a of the coupling branch lines 1 and 2 are located at closest or substantially closest portions to each other. The second antenna conductor 13 includes second coupling conductors, which comprise a pair of coupling branch lines 11 and 12 connected the second antenna conductor 13 and extending inward from the second antenna conductor. The coupling branch lines 11 and 12 have open ends disposed so as to be adjacent to each other and be capacitively coupled to each other. The open ends of the coupling branch lines 11 and 12 are located at closest or substantially closest portions to each other.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: October 30, 2007
    Assignee: Asahi Glass Company, Limited
    Inventors: Osamu Kagaya, Kiyoshi Oshima, Koji Ikawa
  • Publication number: 20070248363
    Abstract: An optical transmission module of the invention uses a semiconductor chip forming an optical modulator integrated laser on a semi-insulating semiconductor board. An input transfer line and an anode electrode of an optical modulator element are connected by a first bonding wire. The anode electrode of the optical modulator element and one of the ends of a terminal resistor element are connected by a second bonding wire. A cathode electrode of the optical modulator element and the other end of the terminal resistor element are connected by a third bonding wire. The cathode electrode of the optical modulator element and a ground electrode are connected by a fourth bonding wire. A joint portion between the first bonding wire and the input transfer line is arranged on an opposite side to a joint portion between the fourth bonding wire and the ground electrode while interposing the semiconductor chip between them.
    Type: Application
    Filed: January 12, 2007
    Publication date: October 25, 2007
    Inventor: Osamu Kagaya
  • Publication number: 20070247379
    Abstract: A plurality of heating wires 2 have a plurality of detours 1 formed therein, the heating wires 2 have inlets 10 formed therein for connection with the detours 1, and both ends of each of the inlets 10 and both ends of each of the detours 1 are connected by a pair of connection lines 9. When a shorter one of the shortest spacing between the paired connection lines 9 and the shortest spacing between both ends of the inlets 10 is called We, when the maximum width of the detours 1 in a horizontal direction is called Wr, when a received frequency has a wavelength of ?0 in the air, and when the formula of {(Wr?We)/2}=L1 is established, the formula of L1?0.0053·?0 is satisfied.
    Type: Application
    Filed: April 17, 2007
    Publication date: October 25, 2007
    Applicant: ASAHI GLASS COMPANY LIMITED
    Inventors: Kiyoshi Oshima, Osamu Kagaya, Koji Ikawa, Toshifumi Funatsu
  • Publication number: 20070177883
    Abstract: A semiconductor chip on which a light receiving element is mounted, a preamplifier for amplifying an output signal from the light receiving element, and an insulating carrier substrate on which the light receiving element is mounted are connected such that the output signal from the light receiving element is input to the preamplifier through electrodes on the carrier substrate, and there are provided two electrodes, on the carrier substrate, having a capacitance value of 40 fF or more therebetween in a state where no light receiving element is mounted.
    Type: Application
    Filed: June 13, 2006
    Publication date: August 2, 2007
    Inventors: Osamu Kagaya, Yukitoshi Okamura, Atsushi Miura, Michihide Sasada, Hideyuki Kuwano
  • Publication number: 20070177884
    Abstract: There is provided an optical receiver in which, between an optical receiver sub-assembly and a pre-amplifier on a main printed circuit board, two transmission lines on a flexible printed circuit board for connecting an optical receiver module with the main printed circuit board, a balanced-type attenuator circuit composed of four resistor elements, and two capacitor elements connected in parallel with the balanced-type attenuator circuit are provided.
    Type: Application
    Filed: June 19, 2006
    Publication date: August 2, 2007
    Inventors: Osamu Kagaya, Michihide Sasada
  • Publication number: 20070080876
    Abstract: When it is assumed that there is a first imaginary straight line connecting between the center of gravity of the first antenna wire and the center of gravity of the second antenna wire, the first imaginary straight line is called a transverse line, and when it is assumed that there is a second imaginary line obtained by endlessly extending the transverse line, the second imaginary line is called an endless transverse line; when the center between closest portions of the first antenna wire and the second antenna wire is called an antenna center; independent conductor A is disposed on a side closer to the first antenna wire with respect to the antenna center; independent conductor B is disposed on a side closer to the second antenna wire with respect to the antenna center; and independent conductor A and independent conductor B are disposed on or in a dielectric substrate so that the endless transverse line passes through independent conductor A and independent conductor B or extends over or under independent c
    Type: Application
    Filed: September 27, 2006
    Publication date: April 12, 2007
    Applicant: ASAHI GLASS COMPANY, LIMITED
    Inventors: Osamu Kagaya, Kiyoshi Oshima, Koji Ikawa
  • Patent number: 7167494
    Abstract: The present invention provides an optical transmission module configured such that a driver IC chip to drive a semiconductor laser device, a first insulation plate having the semiconductor laser device mounted thereon and a coupling optical component are mounted in this order, a thin film inductor element and thin film resistor element which are connected in parallel are formed on a second insulation plate and a bias current is supplied to the semiconductor laser device via this LR element.
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: January 23, 2007
    Assignee: OpNext Japan, Inc.
    Inventors: Osamu Kagaya, Hideyuki Kuwano, Kenji Yoshimoto
  • Publication number: 20070001300
    Abstract: In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.
    Type: Application
    Filed: June 13, 2006
    Publication date: January 4, 2007
    Inventors: Iwamichi Kohjiro, Yasuhiro Nunogawa, Sakae Kikuchi, Shizuo Kondo, Tetsuaki Adachi, Osamu Kagaya, Kenji Sekine, Eiichi Hase, Kiichi Yamashita
  • Patent number: 7149024
    Abstract: The present invention provides an optical modulator module comprising: a chip carrier; a semiconductor optical modulator for modulating light based on an electronic signal; a strip conductor electrically connected to the semiconductor optical modulator; a first resistor electrically connected to the semiconductor optical modulator; and a second resistor electrically connected in series to the first resistor; wherein the semiconductor optical modulator, the strip conductor, and the first and second resistors are disposed on the chip carrier; and wherein the frequency characteristics of the optical modulator module is adjusted by selecting to short or not to short both ends of the first resistor by use of a wire as necessary.
    Type: Grant
    Filed: May 17, 2005
    Date of Patent: December 12, 2006
    Assignee: Opnext Japan, Inc.
    Inventors: Hiroyuki Arima, Osamu Kagaya, Masanobu Okayasu, Tetsuya Kato, Michihide Sasada
  • Patent number: 7130100
    Abstract: Even for a driving impedance of 25 ?, high transmission waveform quality of an optical transmission module is maintained using an optical modulator element designed for a driving impedance of 50 ?. The above can be achieved by adopting an optical module 100 that includes an input electrode for electrical signals, an optical modulator element for modulating laser light using the electrical signals, a termination resistance element, a first bonding wire for connecting the input electrode and the optical modulator element, a second bonding wire for connecting the optical modulator element and the termination resistance element, and a third bonding wire for connecting the input electrode and the termination resistance element.
    Type: Grant
    Filed: May 18, 2005
    Date of Patent: October 31, 2006
    Assignee: Opnext Japan, Inc.
    Inventors: Osamu Kagaya, Noriko Sasada, Kazuhiko Naoe
  • Patent number: 7123087
    Abstract: The present invention provides a radio frequency power amplifier which may not introduce radio frequency loss during switching power amplifier units between high and low output power levels. By connecting a first-stage matching network M12 and first-stage matching network M13 to respective output nodes of a power amplifier unit A11 and power amplifier unit A12 that either one operate by switching, connecting the output nodes of the first-stage matching network M12 and M13 in parallel, connecting a last-stage matching network M11 between the junction of M12 and M13 and the output terminal OUT, the first-stage matching networks M12, M13, and last-stage matching network M11 are formed, for both power amplifier units A11 and A12, so that impedance matching is established between the output terminal OUT and the power amplifier unit in operation when one unit is in operation the other is in stop of operation.
    Type: Grant
    Filed: September 21, 2005
    Date of Patent: October 17, 2006
    Assignee: Renesas Technology Corp.
    Inventors: Masami Ohnishi, Hidetoshi Matsumoto, Tomonori Tanoue, Osamu Kagaya, Kenji Sekine
  • Publication number: 20060175676
    Abstract: A high frequency substrate, on which a high frequency substrate transmission line for connecting a chip carrier transmission line and a package substrate transmission line is formed, is mounted while being inclined with respect to a package, so that each distance between the transmission lines can be reduced. Thereby, the lengths of wires for connecting the transmission lines can be reduced so as to improve frequency characteristics of an optical modulator module.
    Type: Application
    Filed: January 31, 2006
    Publication date: August 10, 2006
    Inventors: Hiroyuki Arima, Masanobu Okayasu, Osamu Kagaya, Kazuhiko Naoe, Tetsuya Kato
  • Patent number: 7068691
    Abstract: In a directly modulated optical module, the input current to drive the semiconductor laser is controlled so as to make a rate of change in fall time smaller than a rate of change in rise time (inclination) in order to improve the eye opening of an eye pattern and extend the transmission distance. In addition, the input current is overshot at least during the period of transient state following the rising edge.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: June 27, 2006
    Assignee: OpNext Japan, Inc.
    Inventors: Norio Chujo, Osamu Kagaya