Abstract: A semiconductor device module is provided that prevents adhesion defects from causing in bonding a semiconductor sensor chip to a sensor stage with an adhesive and improving the reliability thereof. The semiconductor device module includes a sensor stage and a semiconductor optical sensor chip mounted on the sensor stage. The sensor stage includes a U-groove formed in an upper central surface portion of a bottom wall thereof. The sensor chip is bonded to the sensor stage with a thermosetting and UV-curing adhesive coated in the U-groove. The U-groove, includes an island-shaped flat pedestal located at a central bottom portion of the U-groove for mounting the sensor chip thereon. Pins are preferably disposed on both sides of the pedestal to hold the sensor chip horizontally, and the side walls of the U-groove 3b are preferably slanted such that the adhesive coated in the U-groove is prevented from splashing to the outside.

Abstract: A waterproof plug (10) for a waterproof connector includes a body (11) of a generally cylindrical shape. A wire (28) can be inserted into the body to be projected therefrom, and an outer peripheral surface (12) of the body can be press-contacted with an inner peripheral surface (23) of a cavity (22), while an inner peripheral surface (13) of the body can be press-contacted with the wire (28), and an insulation barrel (26) of a terminal (25) can compressively clamp the wire (28) through the body. An insertion hole (16) in the body is tapering such that a thickness t of a clamping portion (18) of the body is uniform along an axis thereof.

Abstract: A semiconductor device in which accuracy in mounting and positioning a semiconductor chip onto a package is improved without being affected by operation of a mounting unit such as a die bonder. The semiconductor device includes a semiconductor chip disposed on a die pad section of the package using guide projections and spring projections provided around the die pad section. The semiconductor chip is die bonded while being aligned with reference to the guide projections.

Abstract: An MTIE test signal generating apparatus generates a predetermined MTIE test signal. An MTIE measuring unit includes a low-pass measuring filter having a predetermined high-cut characteristic. A cycle-amplitude setting portion sets a cycle corresponding to an observation time of each of desired plural specific points for a predetermined MTIE characteristic and an amplitude corresponding to a difference in the MTIE value between adjacent specific points. Plural signal generating portions generate plural signals each having the cycle and the amplitude having repetitive waveforms and then outputting to each of the desired plural specific points. A holding time setting portion sets a holding time for holding the upper and lower limit values of the repetitive waveforms over the predetermined time so that a signal cycle having at least the shortest cycle of the plural signals is longer than a predetermined time corresponding to the predetermined high-cut characteristic of the low-pass measuring filter.

Abstract: A waterproof connector is provided with one or more terminals each including a contact, a first crimp portion and a second crimp portion, insulated cables respectively having leading conductor clamped by the first crimp portion, rubber plugs respectively fitted on the insulated cable, being clamped by the second crimp portion and a connector housing including terminal housing chambers respectively housing the terminals. The rubber plugs are fitted into the respective terminal housing chambers so as to be waterproof. Each of the second crimp portions has a larger width than height thereof in a state where the second crimp portion clamps the rubber plug.

Abstract: A semiconductor optical sensing apparatus is formed of a casing made of an electrically insulative material and having at least one opening at a bottom portion; a wiring device extending from an inside to an outside of the casing; a semiconductor optical sensor chip bonded to the bottom portion of the casing; and a connecting device for connecting a terminal of the sensor chip and the wiring device. A transparent filler is filled in a space inside the casing to cover the sensor chip, wherein the opening absorbs a volume change of the transparent filler caused by expansion or contraction thereof. A focusing device is connected to the casing and located at a position to focus an image on the sensor chip. The focusing device and casing are made of the same material or materials having substantially same thermal expansion coefficients.

Abstract: A semiconductor device module is provided that prevents adhesion defects from causing in bonding a semiconductor sensor chip to a sensor stage with an adhesive and improving the reliability thereof. The semiconductor device module includes a sensor stage and a semiconductor optical sensor chip mounted on the sensor stage. The sensor stage includes a U-groove formed in an upper central surface portion of a bottom wall thereof. The sensor chip is bonded to the sensor stage with a thermosetting and UV-curing adhesive coated in the U-groove. The U-groove,includes an island-shaped flat pedestal located at a central bottom portion of the U-groove for mounting the sensor chip thereon. Pins are preferably disposed on both sides of the pedestal to hold the sensor chip horizontally, and the side walls of the U-groove 3b are preferably slanted such that the adhesive coated in the U-groove is prevented from splashing to the outside.

Abstract: A waterproof plug (10) for a waterproof connector includes a body (11) of a generally cylindrical shape. A wire (28) can be inserted into the body to be projected therefrom, and an outer peripheral surface (12) of the body can be press-contacted with an inner peripheral surface (23) of a cavity (22), while an inner peripheral surface (13) of the body can be press-contacted with the wire (28), and an insulation barrel (26) of a terminal (25) can compressively clamp the wire (28) through the body. An insertion hole (16) in the body is tapering such that a thickness t of a clamping portion (18) of the body is uniform along an axis thereof.

Abstract: A range finder includes an improved module structure, that facilitates injecting a transparent filler uniformly into the entire light guide spaces neither leaving any unfilled region nor impairing the characteristics thereof. A channel of flow (or U-groove) is formed across a partition wall, connecting light guide spaces arranged side by side. This feature allows smooth flow of transparent filler into the range finder module without an unfilled region and consequently no overflow of the transparent filler onto outer wall of the plastic module and onto terminal portion of the lead frame. Another feature of this invention is the presence of shield walls along the channel of flow protruding from the side walls of the channel of flow in an inter-digitated fashion, to prevent the stray light from one light guide space entering the other light guide space through the channel of flow.

Abstract: A hard carbon film (15) is formed directly or through an intermediate layer for enhancing adhesion over an inner surface (11b) of a guide bush (11) for holding a workpiece (51) rotatably and axially slidable on an automatic lathe at a position near a cutting tool, to be in sliding contact with the workpiece (51) or directly or through an intermediate layer for enhancing adhesion on the surface of a superhard lining fixed to the inner surface (11b) The guide bush (11) has remarkably enhanced durability and prevents damaging the workpiece (51) and seizing that makes a machining operation impossible even when the guide bush (11) is used for an extended period of time and when the automatic lathe operates for heavy machining.

Abstract: A holder for waterproof connector comprising a holder portion made of a resin and a packing portion made of a gel-like material for keeping a waterproof connector having the terminal portion of an electric wire with a terminal inserted therein watertight at the electric wire side thereof, wherein the packing portion made of a gel-like material is obtained by hardening a silicone composition containing all of the following components (A) to (D): (A) an organopolysiloxane having at least two alkenyl groups per molecule in an amount of 100 parts by weight; (B) an organopolysiloxane having at least two hydrogen atoms having a silicon atom bonded thereto per molecule in an amount such that the amount of the hydrogen atom having a silicon atom bonded thereto in the component (B) is from not smaller than 0.

Abstract: A cavity (5) for a mold for molding a resin is formed by a fixed mold (1) and a moving mold (2), and a diamond-like carbon film (30) is formed on at least at a part to be contacted with a stamper (6) on a surface (2a) of the mold (2) to which the stamper (6) is attached with an intermediate layer (20) made of silicon, tungsten, titanium carbide, silicon carbide, chromium carbide, or the like which improves adhesion to the surface (2a) of the mold (2) interposed in-between to drastically increase useful life of the mold for molding a resin and also increase useful life of the stamper without causing damage thereto.

Abstract: A waterproof connector is provided with one or more terminals each including a contact, a first crimp portion and a second crimp portion, insulated cables respectively having leading conductor clamped by the first crimp portion, rubber plugs respectively fitted on the insulated cable, being clamped by the second crimp portion and a connector housing including terminal housing chambers respectively housing the terminals. The rubber plugs are fitted into the respective terminal housing chambers so as to be waterproof. Each of the second crimp portions has a larger width than height thereof in a state where the second crimp portion clamps the rubber plug.

Abstract: A cavity having a first diameter is formed in a waterproof connector housing. A cylindrical body portion of a waterproof plug is formed with a plurality of ribs on an outer periphery thereof such that each root portion between the ribs has a second diameter. A cylindrical first extended portion extends continuously from a rib situated at a first longitudinal end of the body portion by a first length. The first extended portion has a third diameter. A cylindrical second extended portion extends continuously from a rib situated at a second longitudinal end of the body portion by a second length. The second extended portion has a fourth diameter, The first extended portion is first inserted into the cavity. The third diameter is equal to or less than the first diameter. The third diameter is equal to or less than the first length.

Abstract: An apparatus for mounting electronic parts on a printed circuit board in which a number of electronic parts to be mounted on a printed circuit board are arranged as a set and loaded in a loading member for electronic parts. A set of such loading members for electronic parts, each carrying a set of electronic parts of the same type, are arrayed in a loading member furnishing casing. This set of the loading members for electronic parts, arrayed and held in the loading member furnishing casings inserted and held by a loading member holder by which the set of the loading members for electronic parts can be held in register with an electronic part mounting portion of the printed circuit board. The loading member holder holding the set of the loading members for electronic parts is loaded on an electronic part loading device. The set of the electronic parts held by the loading member holder is loaded at one time on the sole printed circuit board by the electronic part loading device.

Abstract: A hard carbon film (15) is formed directly or through an intermediate layer for enhancing adhesion over an inner surface (11b) of a guide bush (11) for holding a workpiece (51) rotatably and axially slidable on an automatic lathe at a position near a cutting tool, to be in sliding contact with the workpiece (51) or directly or through an intermediate layer for enhancing adhesion on the surface of a superhard lining fixed to the inner surface (11b). The guide bush (11) has remarkably enhanced durability and prevents damaging the workpiece (51) and seizing that makes a machining operation impossible even when the guide bush (11) is used for an extended period of time and when the automatic lathe operates for heavy machining.

Abstract: A range finder includes an improved module structure, that facilitates injecting a transparent filler uniformly into the entire light guide spaces neither leaving any unfilled region nor impairing the characteristics thereof. A channel of flow (or U-groove) is formed across a partition wall, connecting light guide spaces arranged side by side. This feature allows smooth flow of transparent filler into the range finder module without an unfilled region and consequently no overflow of the transparent filler onto outer wall of the plastic module and onto terminal portion of the lead frame. Another feature of this invention is the presence of shield walls along the channel of flow protruding from the side walls of the channel of flow in an inter-digitated fashion, to prevent the stray light from one light guide space entering the other light guide space through the channel of flow.

Abstract: The range finder measures the distance to the object based on the principle of triangulation, and includes a pair of lenses; a lens supporting frame; a CCD supporting plate; CCD packages supported by the plate; and temperature sensors. One sensor is positioned on the frame between the lenses, and the other is positioned on the plate between the CCD packages. Each CCD package includes a CCD chip located at a focal plane of the lens, a casing and a transparent plate. The lenses, frame, casing and transparent plates are made of the same plastic material so that the thermal expansion of the entire range finder caused by the temperature change may not affect to the distance measurement. Bonding ribs connected to the transparent plate are located near an image ray hole to face each other and on the line perpendicular to the optical axis of the CCD chip and the plane containing the optical axes of the CCD chips.

Abstract: The invention provides a guide bush wherein a cemented carbide alloy containing at least cobalt is provided on an inner surface thereof for holding a workpiece rotatably and slidably in the longitudinal axial direction thereof in close proximity of a cutting tool, and a DLC film is formed over the cemented carbide alloy, cobalt being removed from the surface of the cemented carbide alloy, adjoining the DLC film. By forming the DLC film 15 on the surface of the cemented carbide alloy 12 from which cobalt has been removed, with an intermediate layer formed therebetween, adhesiveness of the DLC film against the cemented carbide alloy fixedly attached to the inner surface of the guide bush is further enhanced.

Abstract: An apparatus for mounting electronic parts on a printed circuit board is disclosed. Plural electronic parts to be mounted on a printed circuit board are arranged as a set and loaded in a loading member for electronic parts. A set of such loading members for electronic parts, each carrying a set of electronic parts of the same type, are arrayed in a loading member furnishing casing. This set of the loading members for electronic parts, arrayed and held in the loading member furnishing casing is inserted and held by a loading member holder by which the set of the loading members for electronic parts can be held in register with an electronic part mounting portion of the printed circuit board. The loading member holder holding the set of the loading members for electronic parts is loaded on a electronic part loading device. The set of the electronic parts held by the loading member holder is loaded at a time on the sole printed circuit board by the electronic part loading device.