Patents by Inventor Paige A. Poore

Paige A. Poore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding method employing organometallic interconnectors
    Patent number: 5503698
    Abstract: A chemical solder is described that includes an organometallic complex or compound which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal. A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
    Type: Grant
    Filed: July 9, 1991
    Date of Patent: April 2, 1996
    Assignee: International Business Machines Corporation
    Inventors: Martin J. Goldberg, Hiroshi Ito, Caroline A. Kovac, Michael J. Palmer, Roger A. Pollak, Paige A. Poore
  • Chemical solder comprising a metal salt, polyphthalaldehyde and a solvent
    Patent number: 5132351
    Abstract: A chemical solder is described that includes an organometallic which thermally degrades within a predetermined temperature range to a metal and volatile compounds. The solder also includes a polymeric matrix that decomposes within the same temperature range to volatile fractions, thereby leaving only the metal.A method for bonding first and second bodies is disclosed wherein a chemical solder, as above-described, is disposed between the first and second bodies and heat is applied to elevate the solder to the predetermined temperature range to thermally degrade the organometallic compound and to decompose the polymeric matrix. The remaining metal bonds the first and second bodies.
    Type: Grant
    Filed: July 11, 1991
    Date of Patent: July 21, 1992
    Assignee: International Business Machines Corporation
    Inventors: Martin J. Goldberg, Hiroshi Ito, Caroline A. Kovac, Michael J. Palmer, Roger A. Pollak, Paige A. Poore
  • Double electronic device structure having beam leads solderlessly bonded between contact locations on each device and projecting outwardly from therebetween
    Patent number: 4862322
    Abstract: An integrated circuit device package in which integrated circuit devices are mounted with active faces placed facing each other to form a double-device structure. Input/output terminals on the active faces of each device can be electrically interconnected by placing an interconnection means between the chips to electrically interconnect input/output terminals on the active faces of the first and second device. Beam leads, each having an inner and outer lead bond site, project outwardly from between the devices where each of the inner lead bond site is solderlessly bonded between conducting patterns on each device bonded. A series of double-device structures can be formed on a tape having a plurality of sets of beam lead patterns thereon. Each beam lead of each set having an inner and outer lead bond site, projects outwardly from between the double-device structure, the inner lead bond site being solderlessly bonded between conducting patterns on each device.
    Type: Grant
    Filed: May 2, 1988
    Date of Patent: August 29, 1989
    Inventors: Harry R. Bickford, Mark F. Bregman, Paul A. Moskowitz, Michael J. Palmer, Timothy C. Reiley, Paige A. Poore, Caroline A. Kovac