Patents by Inventor Pasi Hyttinen

Pasi Hyttinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9048602
    Abstract: A cover for an electronic device is provided that may include a connector housing integrally molded with the cover. The connector housing may define a cavity configured to receive a connector plug therein, and a plurality of connector springs may be configured to contact the connector plug when the connector plug occupies the cavity. The plurality of springs may be protected and, as such, may not be visible when the cover is removed from the electronic device.
    Type: Grant
    Filed: July 30, 2012
    Date of Patent: June 2, 2015
    Assignee: Nokia Technologies Oy
    Inventors: Kari Ensio Seitz, Jari R. Kytöläinen, Petri Ihalainen, Pasi Hyttinen, Jarmo Ketko, Michaela Reuscher, Andreas Fromel, Ralf Beck
  • Publication number: 20140030931
    Abstract: A cover for an electronic device is provided that may include a connector housing integrally molded with the cover. The connector housing may define a cavity configured to receive a connector plug therein, and a plurality of connector springs may be configured to contact the connector plug when the connector plug occupies the cavity. The plurality of springs may be protected and, as such, may not be visible when the cover is removed from the electronic device.
    Type: Application
    Filed: July 30, 2012
    Publication date: January 30, 2014
    Applicant: Nokia Corporation
    Inventors: Kari Ensio Seitz, Jari R. Kytöläinen, Petri Ihalainen, Pasi Hyttinen, Jarmo Ketko, Michaela Reuscher, Andreas Frömel, Ralf Beck