Abstract: A device for machining material includes a rotatable turret including a plurality of plank holding positions, each plank holding position including a plank holding device. A projector is configured to project at least one cut line on a first surface of a plank. A cutting device is positioned adjacent to the turret, the cutting device includes a cutting tool configured to cut a trim section along a second surface of the plank to establish a substantially planar portion and/or to locate defects of the first edge. A sensor is configured to scan the first edge of the plank and determine whether the groove and the substantially planar portion are within a predetermined tolerance. A jointing device is positioned adjacent to the turret, the jointing device includes a joint cutting tool configured to cut at least one groove on the second surface.

Abstract: A semi-automated wood-cutting machine includes a receiving/alignment stage adapted to receive a piece of wood, the receiving/alignment stage having an alignment aid adapted to facilitate manual alignment of the piece of wood, and a cutting stage spaced from the receiving/alignment stage, the cutting stage being configured to cut the piece of wood along a predetermined cut pathway.

Abstract: A semi-automated wood-cutting machine includes a receiving/alignment stage adapted to receive a piece of wood, the receiving/alignment stage having an alignment aid adapted to facilitate manual alignment of the piece of wood, and a cutting stage spaced from the receiving/alignment stage, the cutting stage being configured to cut the piece of wood along a predetermined cut pathway.