Patents by Inventor Paul ARMAND

Paul ARMAND has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210233839
    Abstract: An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 29, 2021
    Inventors: Paul Armand Asentista Calo, Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim, Michael Stadler, Mei Qi Tay
  • Patent number: 10998691
    Abstract: A method and system for adjusting the profile of a laser wavefront formed by at least a laser beam to a desired laser wavefront profile, the laser beam or beams presenting random phases and intensities, comprises a mixing module, configured to generate, from interference phenomena among the laser beam or beams, a laser field, a second intensity measuring module configured to measure the mixed intensities of the laser field portions, a calculation unit configured to calculate one or several phase correction values of the phase of the laser beam or the phases of laser beams, from the intensities of the laser beams, the mixed intensities and one or several predetermined target phases, and a phase adjustment module configured to apply the phase correction value or values obtained from the calculation unit to the laser beam phases.
    Type: Grant
    Filed: January 17, 2019
    Date of Patent: May 4, 2021
    Assignees: COMPAGNIE INDUSTRIELLE DES LASERS CILAS, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS), UNIVERSITÉ DE LIMOGES
    Inventors: Paul Armand, Jérémy Saucourt, Vincent Kermene, Agnès Desfarges-Berthelemot, Joël Benoist, Alain Barthelemy, Julien Leval
  • Publication number: 20210057375
    Abstract: A power semiconductor package includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip and having a first surface that is coupled to a power electrode of the power semiconductor chip, an encapsulation body at least partially encapsulating the power semiconductor chip and the electrical connector, and an electrical insulation layer arranged at a second surface of the electrical connector opposite the first surface, wherein parts of the encapsulation body and the electrical insulation layer form a coplanar surface of the power semiconductor package.
    Type: Application
    Filed: August 12, 2020
    Publication date: February 25, 2021
    Inventors: Wee Aun Jason Lim, Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan, Ying Pok Sam, Chee Voon Tan
  • Publication number: 20210025774
    Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.
    Type: Application
    Filed: June 2, 2020
    Publication date: January 28, 2021
    Inventors: Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee, Swee Kah Lee, Theng Chao Long, Jayaganasan Narayanasamy, Khay Chwan Saw
  • Publication number: 20200051898
    Abstract: In an embodiment, a leadframe includes a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part, a second recess arranged in the inner surface of the second part, and a first electrically conductive insert that is arranged in, and extends between, the first recess and the second recess and bridges the gap between the first part and the second part.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventors: Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Swee Kah Lee, Khay Chwan Saw
  • Publication number: 20190221992
    Abstract: A method and system for adjusting the profile of a laser wavefront formed by at least a laser beam to a desired laser wavefront profile, the laser beam or beams presenting random phases and intensities, comprises a mixing module, configured to generate, from interference phenomena among the laser beam or beams, a laser field, a second intensity measuring module configured to measure the mixed intensities of the laser field portions, a calculation unit configured to calculate one or several phase correction values of the phase of the laser beam or the phases of laser beams, from the intensities of the laser beams, the mixed intensities and one or several predetermined target phases, and a phase adjustment module configured to apply the phase correction value or values obtained from the calculation unit to the laser beam phases.
    Type: Application
    Filed: January 17, 2019
    Publication date: July 18, 2019
    Applicants: COMPAGNIE INDUSTRIELLE DES LASERS CILAS, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS), UNIVERSITÉ DE LIMOGES
    Inventors: Paul Armand, Jérémy Saucourt, Vincent Kermene, Agnès Desfarges-Berthelemot, Joël Benoist, Alain Barthelemy, Julien Leval
  • Publication number: 20190082619
    Abstract: An aeroponic system for supporting efficient low-resource-usage plant growth comprises a housing having one or more openings for a stalk of a plant to pass therethrough, and one or more root chambers for positioning therein of roots of the plant; one or more sealing members coupled to the one or more openings, each sealing member configured to substantially conform to the stalk of the plant and to substantially isolate a canopy of the plant from the one or more root chambers; a nutrient distribution system for introducing nutrients into the one or more root chambers; and a network interface configured to enable the aeroponic system to communicate with an external control system via a computer network.
    Type: Application
    Filed: April 13, 2018
    Publication date: March 21, 2019
    Inventor: John-Paul Armand Martin
  • Patent number: 10116114
    Abstract: According to the invention, a plurality of elementary laser beams (fi) are generated, the phases of which are adjusted by an electro-optical feedback loop (6, 7i, 8i, 9) implementing the matrix equation of a phase-contrast filtering device (6).
    Type: Grant
    Filed: October 14, 2015
    Date of Patent: October 30, 2018
    Assignees: COMPAGNIE INDUSTRIELLE DES LASERS CILAS, CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (CNRS), UNIVERSITE DE LIMOGES
    Inventors: Vincent Kermene, Agnes Desfarges-Berthelemot, Paul Armand, Joel Benoist, David Kabeya, Alain Barthelemy, David Sabourdy, Jean-Eucher Montagne
  • Patent number: 9974243
    Abstract: An aeroponic system for supporting efficient low-resource-usage plant growth comprises a housing comprising one or more openings and one or more root chambers; one or more sealing members configured to substantially conform to a stalk of a plant and to substantially isolate a canopy of the plant from the one or more root chambers; one or more root chamber sensors; one or more nutrient storage reservoirs for storage of plant nutrients; one or more air-assisted nozzles configured to introduce atomized nutrient solution into the one or more root chambers; a temperature control system configured to control a temperature of the one or more root chambers; and a control system configured to control the temperature control apparatus and the one or more air-assisted nozzles to maintain environmental parameters associated with the one or more root chambers within desired parameter ranges.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: May 22, 2018
    Assignee: GROWX INC.
    Inventor: John-Paul Armand Martin
  • Publication number: 20180007845
    Abstract: An aeroponic system for supporting efficient low-resource-usage plant growth comprises a housing comprising one or more openings and one or more root chambers; one or more sealing members configured to substantially conform to a stalk of a plant and to substantially isolate a canopy of the plant from the one or more root chambers; one or more root chamber sensors; one or more nutrient storage reservoirs for storage of plant nutrients; one or more air-assisted nozzles configured to introduce atomized nutrient solution into the one or more root chambers; a temperature control system configured to control a temperature of the one or more root chambers; and a control system configured to control the temperature control apparatus and the one or more air-assisted nozzles to maintain environmental parameters associated with the one or more root chambers within desired parameter ranges.
    Type: Application
    Filed: July 27, 2017
    Publication date: January 11, 2018
    Inventor: John-Paul Armand Martin
  • Publication number: 20170324213
    Abstract: According to the invention, a plurality of elementary laser beams (fi) are generated, the phases of which are adjusted by an electro-optical feedback loop (6, 7i, 8i, 9) implementing the matrix equation of a phase-contrast filtering device (6).
    Type: Application
    Filed: October 14, 2015
    Publication date: November 9, 2017
    Inventors: Vincent KERMENE, Agnes DESFARGES-BERTHELEMOT, Paul ARMAND, Joel BENOIST, David KABEYA, Alain BARTHELEMY, David SABOURDY, Jean-Eucher MONTAGNE
  • Patent number: 9640459
    Abstract: A semiconductor device includes a leadframe and a semiconductor chip including a contact. The contact faces the leadframe and is electrically coupled to the leadframe via solder. The semiconductor device includes a solder barrier adjacent to the first contact and an edge of the chip.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: May 2, 2017
    Assignee: Infineon Technologies AG
    Inventors: Wee Boon Tay, Kuan Ching Woo, Paul Armand Calo
  • Patent number: 8497164
    Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
    Type: Grant
    Filed: July 13, 2012
    Date of Patent: July 30, 2013
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Armand Vincent C. Jereza, Paul Armand Calo, Erwin Victor R. Cruz
  • Publication number: 20120329214
    Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
    Type: Application
    Filed: July 13, 2012
    Publication date: December 27, 2012
    Inventors: Armand Vincent C. Jereza, Paul Armand Calo, Erwin Victor R. Cruz
  • Patent number: 8222718
    Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
    Type: Grant
    Filed: February 5, 2009
    Date of Patent: July 17, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Armand Vincent C. Jereza, Paul Armand Calo, Erwin Victor R. Cruz
  • Patent number: 8110492
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: February 7, 2012
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, Jr., Paul Armand Calo
  • Publication number: 20100304534
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Application
    Filed: August 13, 2010
    Publication date: December 2, 2010
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, JR., Paul Armand Calo
  • Patent number: 7800207
    Abstract: Disclosed in this specification is a semiconductor package with a die attach pad and a lead frame which are electrically and mechanically connected to one another through a conductive wire ribbon. Such a configuration reduces the package footprint and also permits different styles of die attach pads and lead frames to be interchanged, thus reducing production costs.
    Type: Grant
    Filed: October 17, 2007
    Date of Patent: September 21, 2010
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Erwin Ian V. Almagro, Honorio T. Granada, Jr., Paul Armand Calo
  • Publication number: 20100193921
    Abstract: A semiconductor die package. The semiconductor die package includes a premolded clip structure assembly having a clip structure, a semiconductor die attached to the clip structure, and a first molding material covering at least a portion of the clip structure and the semiconductor die. The semiconductor die package also includes a leadframe structure having a die attach pad, where the leadframe structure is attached to premolded clip structure assembly.
    Type: Application
    Filed: February 5, 2009
    Publication date: August 5, 2010
    Inventors: Armand Vincent C. Jereza, Paul Armand Calo, Erwin Victor R. Cruz
  • Patent number: 7586179
    Abstract: Disclosed in this specification is a wireless semiconductor package with multiple dies, at least two of which are attached to a thermally and electrically conductive heat sink. The package provides an efficient means for dissipating heat.
    Type: Grant
    Filed: October 9, 2007
    Date of Patent: September 8, 2009
    Assignee: Fairchild Semiconductor Corporation
    Inventors: Paul Armand Calo, Margie T. Rios, Tiburcio A. Maldo, JoonSeo Son, Erwin Ian V. Almagro