Patents by Inventor Paul Armand Asentista Calo

Paul Armand Asentista Calo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210233839
    Abstract: An electrical interconnect structure includes a bond pad having a substantially planar bonding surface, and a solder enhancing structure that is disposed on the bonding surface and includes a plurality of raised spokes that are each elevated from the bonding surface. Each of the raised spokes has a lower wettability relative to a liquefied solder material than the bonding surface. Each of the raised spokes extend radially outward from a center of the solder enhancing structure.
    Type: Application
    Filed: January 28, 2020
    Publication date: July 29, 2021
    Inventors: Paul Armand Asentista Calo, Tek Keong Gan, Ser Yee Keh, Tien Heng Lem, Fong Lim, Michael Stadler, Mei Qi Tay
  • Publication number: 20210057375
    Abstract: A power semiconductor package includes a power semiconductor chip, an electrical connector arranged at a first side of the power semiconductor chip and having a first surface that is coupled to a power electrode of the power semiconductor chip, an encapsulation body at least partially encapsulating the power semiconductor chip and the electrical connector, and an electrical insulation layer arranged at a second surface of the electrical connector opposite the first surface, wherein parts of the encapsulation body and the electrical insulation layer form a coplanar surface of the power semiconductor package.
    Type: Application
    Filed: August 12, 2020
    Publication date: February 25, 2021
    Inventors: Wee Aun Jason Lim, Paul Armand Asentista Calo, Ting Soon Chin, Chooi Mei Chong, Sanjay Kumar Murugan, Ying Pok Sam, Chee Voon Tan
  • Publication number: 20210025774
    Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.
    Type: Application
    Filed: June 2, 2020
    Publication date: January 28, 2021
    Inventors: Chau Fatt Chiang, Paul Armand Asentista Calo, Chan Lam Cha, Kok Yau Chua, Jo Ean Chye, Chee Hong Lee, Swee Kah Lee, Theng Chao Long, Jayaganasan Narayanasamy, Khay Chwan Saw
  • Publication number: 20200051898
    Abstract: In an embodiment, a leadframe includes a first electrically conductive part and a second electrically conductive part, each having an outer surface arranged to provide substantially coplanar outer contact areas having a footprint and an inner surface opposing the outer surface, the first part being spaced apart from the second part by a gap, a first recess arranged in the inner surface of the first part, a second recess arranged in the inner surface of the second part, and a first electrically conductive insert that is arranged in, and extends between, the first recess and the second recess and bridges the gap between the first part and the second part.
    Type: Application
    Filed: August 6, 2019
    Publication date: February 13, 2020
    Inventors: Chau Fatt Chiang, Paul Armand Asentista Calo, Kok Yau Chua, Josef Hoeglauer, Swee Kah Lee, Khay Chwan Saw