Abstract: A MEMS device includes a bottom plate structure supporting a conductive electrode. A flexible conductive top plate movably supported by a flexure is affixed to a small peripheral portion of the top plate that is aligned with the electrode. Drive circuitry applies a high level of a drive voltage signal between the electrode and the top plate to produce an attracting electrostatic force between the top plate and the electrode sufficient to overcome the flexure and draw the top plate against the electrode. The drive circuitry later applies a low level of the drive voltage signal to remove the electrostatic force and allow the flexure to peel the peripheral portion away from the electrode. Additional drive voltage signals may be applied to additional electrodes to draw additional peripheral portions of the top plate against the additional electrodes and successively removed to allow peripheral portions of the top plate to be sequentially peeled away from the electrodes.

Abstract: A MEMS device includes a bottom plate structure supporting a conductive electrode. A flexible conductive top plate movably supported by a flexure is affixed to a small peripheral portion of the top plate that is aligned with the electrode. Drive circuitry applies a high level of a drive voltage signal between the electrode and the top plate to produce an attracting electrostatic force between the top plate and the electrode sufficient to overcome the flexure and draw the top plate against the electrode. The drive circuitry later applies a low level of the drive voltage signal to remove the electrostatic force and allow the flexure to peel the peripheral portion away from the electrode. Additional drive voltage signals may be applied to additional electrodes to draw additional peripheral portions of the top plate against the additional electrodes and successively removed to allow peripheral portions of the top plate to be sequentially peeled away from the electrodes.

Abstract: A visual inspection system (10) and method for inspecting the operation of micromechanical devices. The system has a vision system (16), a vision system controller (18), a system controller (20), an illumination system (12), a digital signal processor and a mounting stage (22). The objects undergoing inspection, either wafers or devices, are mounted under the visions system. A probe card is engaged to the object and power is provided. The vision system (16) records which elements or devices on the object begin operating at that voltage. The voltage is then incremented and the process continues until a determination is made as to the objects operability. The system can also be adapted to inspect micromechanical spatial light modulators by generating images with the modulator and capturing them with the image system. The digital signal processor then analyzes the images while the vision system moves to the next object to be inspected.