Abstract: A power and data delivery system for a machine. The system includes a power and data conductor located throughout at least a portion of the machine, a plurality of processing nodes, each connected to the conductor at various locations, and a plurality of devices, each connected to a corresponding one of the plurality of processing nodes and controlled by the processing node, wherein each processing node may be connected at any location of the conductor.

Abstract: An electrical connector for a high voltage application. The connector may include a plug housing having a plurality of plug openings and a header housing have a plurality of header openings. The plurality of header openings may be matable with a respective plug opening. A plurality of sockets are insertable into each respective plug opening. A plurality of pins may be operable to be received by a corresponding socket. The plug housing and sockets may be configured to maintain a seal with the plug housing connected to and disconnected from the header housing.

Abstract: An electrical connector for a high voltage application. The connector may include a plug housing having a plurality of plug openings and a header housing have a plurality of header openings. The plurality of header openings may be matable with a respective plug opening. A plurality of sockets are insertable into each respective plug opening. A plurality of pins may be operable to be received by a corresponding socket. The plug housing and sockets may be configured to maintain a seal with the plug housing connected to and disconnected from the header housing.

Abstract: A wiring harness for use in a networked wiring system wherein one or more multiplexed electronic circuits are contained within the wiring harness. Provision of such electronics within the wiring harness reduces the number of wires used in a networked wiring system without requiring their provision within sensor or actuator devices, or in external electronic boxes. Inclusion of such electronics within the wiring harness also eliminates the need for extra interconnections, and provides protection of the electronics from environmental conditions.

Abstract: An electronic assembly includes a flex-rigid circuit board having a flexible polyimide layer disposed on the upper side of a rigid substrate, conductive circuit paths formed within the substrate and on the polyimide layer, and a base for dissipating heat generated by electrical components mounted on the circuit board. The flex-rigid circuit board has a cavity therein extending from a lower electrical insulation layer through the rigid substrate to the upper polyimide layer. A heat-generating electrical component is mounted on the upper layer over the cavity in the circuit board. The base has a boss that protrudes into the cavity and contacts the upper polyimide layer such that heat from the electrical component is conducted through the upper polyimide layer and into the base. Cool electrical components requiring no heat sinking are mounted on the lower insulation layer and/or the upper polyimide layer.

Abstract: A thermal attachment assembly for heat generating electronic devices which uses a canted coil spring to apply pressure directly against electronic components. The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against a surface of a shoulder or side wall of the heat sink housing. The force of the canted coil spring can be counterbalanced by a cover for the housing, or by an abutment that is either fixed in the housing or floats between attachment and an assembly at each of opposite sides of the housing.

Abstract: A thermal attachment assembly for heat generating electronic devices which includes a multi-element spring having low force, high deflection, spring fingers, and which is adjustable and attached by screws to a cover to apply pressure directly against electronic components arranged generally perpendicular to at least one edge of a printed wired board (PWB). The attachment assembly includes a heat sink housing in which the electronic components are pressed against an electrically insulating, thermally conductive film positioned against one wall of the heat sink housing. The PWB is snapped to a carrier and both are placed into the housing so that the electronic devices are positioned within spaces of the carrier. The carrier includes sloping surfaces, so that the spring fingers are deflected downward when the cover is attached to the housing, thereby insuring that the spring fingers are properly positioned onto the electronic devices, between the spaces of the carrier.