Patents by Inventor Paul H. Kydd

Paul H. Kydd has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8360184
    Abstract: A control system is disclosed which permits operation of a Plug-in Hybrid IC-Electric Hybrid Vehicle (PHEV) in either parallel electric hybrid or IC modes with a single accelerator pedal. The operation of the electrical equipment is optimized to provide maximum electric power as long as the battery has useable capacity while being completely transparent to the driver. This control system is particularly suitable for converting an existing vehicle to a PHEV.
    Type: Grant
    Filed: June 1, 2009
    Date of Patent: January 29, 2013
    Inventor: Paul H Kydd
  • Publication number: 20100004807
    Abstract: A control system is disclosed which permits operation of a Plug-in Hybrid IC-Electric Hybrid Vehicle (PHEV) in either parallel electric hybrid or IC modes with a single accelerator pedal. The operation of the electrical equipment is optimized to provide maximum electric power as long as the battery has useable capacity while being completely transparent to the driver. This control system is particularly suitable for converting an existing vehicle to a PHEV.
    Type: Application
    Filed: June 1, 2009
    Publication date: January 7, 2010
    Inventor: Paul H Kydd
  • Publication number: 20070169970
    Abstract: An assembly is described for converting an Internal Combustion (IC) vehicle to an IC-electric hybrid vehicle comprising a battery, a battery charger, a controller, an electric motor and a power transmission means involving a flexible rotational speed reduction to connect the motor to a drive shaft of the vehicle. The system can be made available in the form of a kit allowing those skilled in automobile mechanics to perform the conversion. Regenerative braking and provision of AC power from the vehicle can be made available as options.
    Type: Application
    Filed: January 17, 2007
    Publication date: July 26, 2007
    Inventor: Paul H. Kydd
  • Patent number: 7211205
    Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: May 1, 2007
    Assignee: Parelec, Inc.
    Inventors: Brian F. Conaghan, Gregory A. Jablonski, Paul H. Kydd, Isabel Mendoza, David L. Richard
  • Patent number: 7141185
    Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
    Type: Grant
    Filed: January 29, 2003
    Date of Patent: November 28, 2006
    Assignee: Parelec, Inc.
    Inventors: Brian F. Conaghan, Paul H. Kydd, David L. Richard
  • Patent number: 7115218
    Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.
    Type: Grant
    Filed: June 28, 2001
    Date of Patent: October 3, 2006
    Assignee: Parelec, Inc.
    Inventors: Paul H. Kydd, Gregory A. Jablonski, David L. Richard
  • Publication number: 20040265549
    Abstract: An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
    Type: Application
    Filed: March 17, 2004
    Publication date: December 30, 2004
    Inventor: Paul H. Kydd
  • Patent number: 6824603
    Abstract: A composition of matter comprising a mixture of an oxide powder or powders and a Reactive Organic Medium (ROM) which can be used to create electronic components on a suitable. The materials are applied to conventional polymer-based circuit substrates by any convenient printing process and thermally cured to well-consolidated oxide components at a temperature, which the substrate can withstand. Mixtures for various components, including resistors, capacitor dielectrics and magnetic cores and processes to apply them are disclosed.
    Type: Grant
    Filed: October 18, 2002
    Date of Patent: November 30, 2004
    Assignee: Parelec, Inc.
    Inventor: Paul H. Kydd
  • Publication number: 20040178391
    Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
    Type: Application
    Filed: January 26, 2004
    Publication date: September 16, 2004
    Inventors: Brian F. Conaghan, Paul H. Kydd, David L. Richard
  • Publication number: 20040151893
    Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (ROM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The pattern can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.
    Type: Application
    Filed: December 26, 2003
    Publication date: August 5, 2004
    Inventors: Paul H. Kydd, Gregory A. Jablonski, David L. Richard
  • Publication number: 20040144959
    Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include additives which reduce the curing temperatures for use with low-temperature substrates. Conductive ink compositions can be deposited on a substrate coated with a cure temperature reducing agent to reduce the curing temperatures.
    Type: Application
    Filed: January 29, 2003
    Publication date: July 29, 2004
    Inventors: Brian F. Conaghan, Paul H. Kydd, David L. Richard
  • Publication number: 20040144958
    Abstract: Conductive ink compositions which can be cured to highly conductive metal traces by means of “chemical welding” include adhesion promoting additives for providing improved adhesion of the compositions to various substrates.
    Type: Application
    Filed: January 29, 2003
    Publication date: July 29, 2004
    Inventors: Brian F. Conaghan, Gregory A. Jablonski, Paul H. Kydd, Isabel Mendoza, David L. Richard
  • Patent number: 6743319
    Abstract: An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
    Type: Grant
    Filed: October 4, 2002
    Date of Patent: June 1, 2004
    Assignee: Paralec Inc.
    Inventor: Paul H. Kydd
  • Publication number: 20030211246
    Abstract: A method of printing electronic circuits and components on polymers which would normally distort at the cure temperature of the metallic printing inks is disclosed. The method consists of restraining the polymer film either mechanically or by laminating it to a rigid backing. The rigid backing can be temporary and reusable or it can be a permanent part of the product.
    Type: Application
    Filed: November 12, 2002
    Publication date: November 13, 2003
    Inventors: Paul H. Kydd, David L. Richard, Yvonne M. Kunz
  • Publication number: 20030070747
    Abstract: An electronic circuit is made by printing a Parmod® composition on a temporary substrate and curing it to produce a pattern of metal conductors. The conductors are laminated to a substrate under heat and pressure to produce a laminate with the metal prepatterned into the desired circuit configuration. The conductor can also be coated with a polymer and cured to form a prepatterned substrate. Single and double-sided circuits or multilayers can be made this way.
    Type: Application
    Filed: October 4, 2002
    Publication date: April 17, 2003
    Inventor: Paul H. Kydd
  • Patent number: 6379745
    Abstract: A composition of matter having a metal powder or powders of specified characteristics in a Reactive Organic Medium (TOM). These compositions can be applied by any convenient printing process to produce patterns of electrical conductors on temperature-sensitive electronic substrates. The patterns can be thermally cured in seconds to form pure metal conductors at a temperature low enough to avoid damaging the substrate.
    Type: Grant
    Filed: August 20, 1999
    Date of Patent: April 30, 2002
    Assignee: Parelec, Inc.
    Inventors: Paul H. Kydd, Gregory A. Jablonski, David L. Richard
  • Patent number: 6274412
    Abstract: A process sequence is disclosed for fabricating arrays of Thin Film Transistors by printing metallic conductors for the gate and data lines and possibly the Indium Tin Oxide Pixel electrode as well. The process eliminates conventional step-and-repeat photolithographic patterning, and provides high conductivity metallization for large arrays. These arrays may be used in displays, detectors and scanners.
    Type: Grant
    Filed: December 21, 1999
    Date of Patent: August 14, 2001
    Assignee: Parelec, Inc.
    Inventors: Paul H. Kydd, Sigurd Wagner, Helena Gleskova
  • Patent number: 6153348
    Abstract: A metal particle liquid toner using PARMOD.TM. technology can be used to electrostatically print high resolution, electrically conductive metal images. The invention comprises a dispersion of metallic toner particles having metal particles combined with a metallo-organic compound, dispersed in an electrically insulating, organic liquid such as Exxon's Isopar with the addition of a charge director to give the proper charge on the toner particles and an appropriate conductivity to the dispersion. This dispersion can be used as a liquid toner to develop an electrostatically produced latent image. The developed image can then be heated to give a conductive image on the printing plate, or it can be transferred to a desirable low or high temperature substrate by an electrostatic gap transfer method and heated to give a conductive image.
    Type: Grant
    Filed: August 6, 1999
    Date of Patent: November 28, 2000
    Assignee: Parelec LLC
    Inventors: Paul H. Kydd, David L. Richard
  • Patent number: 6036889
    Abstract: The present invention relates to a thick film formed of a mixture of metal powders and metallo-organic decomposition (MOD) compounds in an organic liquid vehicle and a process for advantageously applying them to a substrate by silk screening or other printing technology. The mixtures preferably contain metal flake with a ratio of the maximum dimension to the minimum dimension of between 5 and 50. The vehicle may include a colloidal metal powder with a diameter of about 10 to about 40 nanometers. The concentration of the colloidal metal in the suspension can range from about 10 to about 50% by weight. The MOD compound begins to decompose at a temperature of approximately about 200.degree. C. to promote consolidation of the metal constituents and bonding to the substrate which is complete at temperatures less than 450.degree. C. in a time less than six minutes.
    Type: Grant
    Filed: March 3, 1998
    Date of Patent: March 14, 2000
    Assignee: Parelec, Inc.
    Inventor: Paul H. Kydd
  • Patent number: 5882722
    Abstract: The present invention relates to a thick film formed of a mixture of metal powders and metallo-organic decomposition (MOD) compounds in an organic liquid vehicle and a process for advantageously applying them to a substrate by silk screening or other printing technology. The mixtures preferably contain metal flake with a ratio of the maximum dimension to the minimum dimension of between 5 and 50. The vehicle may include a colloidal metal powder with a diameter of about 10 to about 40 nanometers. The concentration of the colloidal metal in the suspension can range from about 10 to about 50% by weight. The MOD compound begins to decompose at a temperature of approximately about 200.degree. C. to promote consolidation of the metal constituents and bonding to the substrate which is complete at temperatures less than 450.degree. C. in a time less than six minutes.
    Type: Grant
    Filed: July 12, 1995
    Date of Patent: March 16, 1999
    Assignee: Partnerships Limited, Inc.
    Inventor: Paul H. Kydd