Patents by Inventor Paul Lefevre
Paul Lefevre has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190217441Abstract: A robotised hammering method for hammering a weld seam (C) made on a base surface (S) of a metal workpiece (V) using a robotised system (32), comprising the following steps:—controlling the robotised system (32) provided with an effector (35; 38) carrying a scanning tool (30) in such a way as to follow, with the scanning tool (30), an initial path along the weld seam (C), said initial path having been determined from the digital model of the workpiece or from the actual workpiece,—acquiring, by means of the scanning tool (30), along the initial path, local data concerning the elevation and position of the weld seam and of the area or areas of the base surface close to the weld seam,—calculating, from the elevation and position data acquired in this way and from the initial path, a corrected path, and—controlling the robotised system (32) provided with an effector (40; 38) carrying a hammering tool (41) to hammer the weld seam along this corrected path.Type: ApplicationFiled: July 21, 2017Publication date: July 18, 2019Applicant: SONATS - SOCIETE DES NOUVELLES APPLICATIONS DES TECHNIQUES DE SURFACEInventors: Paul LEFEVRE, Vincent DESFONTAINE, Patrick CHEPPE
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Patent number: 9796063Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: June 30, 2014Date of Patent: October 24, 2017Assignee: FNS TECH CO., LTD.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Scott Xin Qiao, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin
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Patent number: 9477708Abstract: Systems and methods are disclosed for managing a multi-store execution environment by applying opportunistic materialized views to improve workload performance and executing a plan on multiple database engines to increase query processing speed by leveraging unique capabilities of each engine by enabling stages of a query to execute on multiple engines, and by moving materialized views across engines.Type: GrantFiled: November 6, 2013Date of Patent: October 25, 2016Assignee: NEC CorporationInventors: Vahit Hakan Hacigumus, Jagan Sankaranarayanan, Jeffrey Paul LeFevre, Junichi Tatemura, Neoklis Polyzotis
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Publication number: 20160030910Abstract: The present disclosure relates to a nanoparticle production system and methods of using the system. The nanoparticle production system includes a plasma gun including a male electrode, a female electrodes and a working gas supply configured to deliver a working gas in a vortexing helical flow direction across a plasma generation region. The system also includes a continuous feed system, a quench chamber, a cooling conduit that includes a laminar flow disruptor, a system overpressure module, and a conditioning fluid purification and recirculation system.Type: ApplicationFiled: March 12, 2014Publication date: February 4, 2016Inventors: Maximillian A. BIBERGER, David LEAMON, Frederick p. LAYMAN, Paul LEFEVRE
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Patent number: 9162341Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: GrantFiled: May 6, 2013Date of Patent: October 20, 2015Assignee: FNS TECH CO., LTDInventors: Paul LeFevre, Anoop Mathew, Scott Xin Qiao, Guangwei Wu, David Adam Wells, Oscar K. Hsu
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Publication number: 20140311043Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: ApplicationFiled: June 30, 2014Publication date: October 23, 2014Inventors: Paul LEFEVRE, Anoop MATHEW, Guangwei WU, Scott Xin QIAO, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN
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Publication number: 20140263190Abstract: The present disclosure relates to a nanoparticle production system and methods of using the system. The nanoparticle production system includes a plasma gun including a male electrode, a female electrodes and a working gas supply configured to deliver a working gas in a vortexing helical flow direction across a plasma generation region. The system also includes a continuous feed systems, a quench chamber, a cooling conduit that includes a laminar flow disruptor, a system overpressure module, and a conditioning fluid purification and recirculation system.Type: ApplicationFiled: March 12, 2014Publication date: September 18, 2014Inventors: Maximilian A. Biberger, David Leamon, Frederick P. Layman, Paul Lefevre
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Patent number: 8790165Abstract: The present disclosure relates to a chemical mechanical planarization pad and a method of making and using a chemical mechanical planarization pad. The chemical mechanical planarization pad may include a first component including a water soluble composition and water insoluble composition exhibiting a solubility in water of less than that of the water soluble composition, wherein at least one of the water soluble and water insoluble compositions of the first component is formed of fibers. The chemical mechanical planarization pad may also include a second component, wherein the first component is present as a discrete phase in a continuous of the second component.Type: GrantFiled: January 5, 2010Date of Patent: July 29, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Xuechan Zhao
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Publication number: 20140207755Abstract: Systems and methods are disclosed for managing a multi-store execution environment by applying opportunistic materialized views to improve workload performance and executing a plan on multiple database engines to increase query processing speed by leveraging unique capabilities of each engine by enabling stages of a query to execute on multiple engines, and by moving materialized views across engines.Type: ApplicationFiled: November 6, 2013Publication date: July 24, 2014Applicant: NEC Laboratories America, Inc.Inventors: Vahit Hakan Hacigumus, Jagan Sankaranarayanan, Jeffrey Paul LeFevre, Junichi Tatemura, Neoklis Polyzotis
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Patent number: 8758659Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: GrantFiled: September 29, 2010Date of Patent: June 24, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin, Guangwei Wu, Anoop Mathew
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Patent number: 8684794Abstract: A polishing pad and a method of producing a polishing pad. The method includes providing a mold, having a first cavity and a second cavity, wherein the first cavity defines a recess, providing a polymer matrix material including void forming elements in the recess, forming a polishing pad and removing at least a portion of the elements from the polishing pad forming void spaces within the polishing pad by one of a chemical method or mechanical method, prior to use in chemical/mechanical planarization procedures.Type: GrantFiled: August 4, 2008Date of Patent: April 1, 2014Assignee: FNS Tech Co., Ltd.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Patent number: 8546260Abstract: A chemical-mechanical planarization pad for semiconductor manufacturing is provided. The pad comprises synthetic fibers that are non-crimped fibers which are present in an amount of 1.0% by weight to 98.0% by weight in the mat and wherein the non-crimped fibers have a length of 0.1 cm to 127 cm and a diameter of 1.0 to 1000 micrometers.Type: GrantFiled: September 3, 2009Date of Patent: October 1, 2013Assignee: Innopad, Inc.Inventors: Oscar K. Hsu, Paul Lefevre
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Publication number: 20130244548Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: ApplicationFiled: May 6, 2013Publication date: September 19, 2013Inventors: Paul LEFEVRE, Anoop MATHEW, Scott Xin QIAO, Guangwei WU, David Adam WELLS, Oscar K. HSU
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Patent number: 8491360Abstract: The present disclosure is directed at a chemical-mechanical planarization polishing pad comprising interconnecting elements and a polymer filler material, wherein the interconnecting elements include interconnecting junction points that are present at a density of 1 interconnecting junction point/cm3 to 1000 interconnecting junction points/cm3, and wherein the interconnecting elements have a length between interconnection junction points of 0.1 microns to 20 cm.Type: GrantFiled: October 23, 2008Date of Patent: July 23, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, Marc C. Jin, John Erik Aldeborgh
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Patent number: 8435099Abstract: An aspect of the present disclosure relates to a chemical mechanical planarization pad including a first domain and a second continuous domain wherein the first domain includes discrete elements regularly spaced within the second continuous domain. The pad may be formed by forming a plurality of openings for a first domain within a second continuous domain of the pad, wherein the openings are regularly spaced within the second domain, and forming the first domain within the plurality of openings in second continuous domain. In addition, the pad may be used in polishing a substrate with a polishing slurry.Type: GrantFiled: January 27, 2010Date of Patent: May 7, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, Anoop Mathew, Guangwei Wu, David Adam Wells, Oscar K. Hsu, Xuechan Zhao
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Patent number: 8430721Abstract: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500 psi when compressed at a pressure of 1 to 50 psi.Type: GrantFiled: December 31, 2008Date of Patent: April 30, 2013Assignee: Innopad, Inc.Inventors: Oscar K. Hsu, Paul Lefevre, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
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Patent number: 8377351Abstract: A chemical-mechanical planarization polishing pad is provided comprising a network of elements dispersed within a polymer, a plurality of voids formed in the pad and at least a portion of said network of elements is connected to at least a portion of the voids. A method of forming the pad is also disclosed, which comprises providing a composition, the composition comprising a network of elements and at least one of a polymer or a reactive prepolymer, introducing a gas to the composition and using the gas to produce a plurality of voids in the composition. A method of forming voids is also disclosed, which relies upon the application of a force to the network of elements within the polymer or reactive polymer, followed by removal of the force and void formation.Type: GrantFiled: October 2, 2008Date of Patent: February 19, 2013Assignee: Innopad, Inc.Inventors: Paul Lefevre, David Adam Wells, Marc C. Jin, Oscar K. Hsu, John Erik Aldeborgh, Scott Xin Qiao, Anoop Mathew, Guangwei Wu
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Patent number: 8172648Abstract: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the pad is abraded the surface is renewed exposing at least a portion of the chemical agent.Type: GrantFiled: December 31, 2008Date of Patent: May 8, 2012Assignee: Innopad, Inc.Inventors: Paul Lefevre, Oscar K. Hsu, Marc C. Jin, John Erik Aldeborgh, David Adam Wells
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Publication number: 20120073210Abstract: A method of forming a chemical mechanical polishing pad. The method includes polymerizing one or more polymer precursors and forming a chemical-mechanical planarization pad including a surface, forming grooves in the surface defining lands between the grooves, wherein the grooves have a first width, and shrinking the lands from a first land length (L1) at the surface to a second land length (L2) at the surface, wherein the second land length (L2) is less than the first land length (L1) and the grooves have a second width (W2) wherein (W1)?(X)(W2), wherein (X) has a value in the range of 0.01 to 0.75.Type: ApplicationFiled: September 29, 2010Publication date: March 29, 2012Applicant: INNOPAD, INC.Inventors: Paul LEFEVRE, Oscar K. HSU, David Adam WELLS, John Erik ALDEBORGH, Marc C. JIN, Guangwei WU, Anoop MATHEW
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Patent number: 7985121Abstract: A chemical mechanical polishing pad. The pad includes a surface and a polymer matrix capable of transmitting at least a portion of incident radiation. In addition, at least one embedded structure in the polymer matrix, including a portion of the pad where the embedded structure is not present, and a window integral to the pad defined by the portion of the pad where the embedded structure is not present.Type: GrantFiled: July 24, 2008Date of Patent: July 26, 2011Assignee: Innopad, Inc.Inventors: Paul Lefevre, Oscar K. Hsu, David Adam Wells, John Erik Aldeborgh, Marc C. Jin