Abstract: An electronic device includes a housing defining an internal volume, a front opening, and a rear opening. The electronic device can include a display component disposed at the front opening and a rear cover disposed at the rear opening. A logic board can be disposed in the internal volume. The device can also include a thin film thermopile including a cold junction bonded to the logic board and a hot junction bonded to the rear cover.

Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.

Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.

Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.

Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.

Abstract: Embodiments include a temperature sensing device that includes a temperature sensor stack that includes a flexible substrate and an array of temperature sensors coupled to the flexible substrate. Each temperature sensor in the array of temperature sensors can include a conductive material defining a continuous pattern extending from a first node to a second node, a first set of conductive traces coupled to the flexible substrate, and a second set of conductive traces coupled to the flexible substrate. The temperature sensing device can include a processing circuit configured to apply an electrical signal across the conductive material of each temperature sensor using the first set of conductive traces, detect an effect of the conductive material of each temperature sensor on the electrical signal using the second set of conductive traces, and determine a temperature for the temperature sensors in the array using the detected effects of the conductive material on the electrical signal.

Abstract: An electronic device housing encloses a temperature sensing system including a temperature sensor and a differential temperature probe. The differential temperature probe includes a flexible substrate defining two ends. A first end is thermally coupled to the temperature sensor and a second end is thermally coupled to a surface, volume, or component of the electronic device. The temperature probe is an in-plane thermopile including a series-coupled set of thermocouples extending from the first end to the second end. A temperature measured at the temperature sensor can be a first measured temperature and a voltage difference across leads of the differential temperature probe can be correlated to a differential temperature relative to the first measured temperature. A sum of the differential temperature and the first measured temperature is a second measured temperature, quantifying a temperature of the second end of the differential temperature probe.

Abstract: The present invention is directed to crosslinked cation exchange polymers comprising a fluoro group and an acid group, pharmaceutical compositions of these polymers, compositions of a linear polyol and a salt of such polymer. Crosslinked cation exchange polymers having beneficial physical properties, including combinations of particle size, particle shape, particle size distribution, viscosity, yield stress, compressibility, surface morphology, and/or swelling ratio are also described. These polymers and compositions are useful to bind potassium in the gastrointestinal tract.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating one or more UV-blocking layers.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating light-stabilizers and/or oxygen barriers.

Abstract: The present invention provides methods and compositions for the treatment of ion imbalances using core-shell composites and compositions comprising such core-shell composites. In particular, the invention provides core-shell particles and compositions comprising potassium binding polymers, and core-shell particles and compositions comprising sodium binding polymers, and in each case, pharmaceutical compositions thereof. Methods of use of the polymeric and pharmaceutical compositions for therapeutic and/or prophylactic benefits are also disclosed. The compositions and methods of the invention offer improved approaches for treatment of hyperkalemia and other indications related to potassium ion homeostasis, and for treatment of hypertension and other indicates related to sodium ion homeostasis.

Abstract: The present disclosure is directed to a method of forming a layered structure including a nanostructure layer having nanostructures. The method includes: forming a coating layer on the surface of the nanostructure layer, reflowing the coating layer, depositing one or more conductive plugs into the coating layer, and hardening the coating layer. The one or more conductive plugs each has a first portion configured to be placed in electrical communication with the nanostructure layer and a second portion not covered by the coating layer.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating light-stabilizers.

Abstract: The present invention is directed to crosslinked cation exchange polymers comprising a fluoro group and an acid group, pharmaceutical compositions of these polymers, compositions of a linear polyol and a salt of such polymer. Crosslinked cation exchange polymers having beneficial physical properties, including combinations of particle size, particle shape, particle size distribution, viscosity, yield stress, compressibility, surface morphology, and/or swelling ratio are also described. These polymers and compositions are useful to bind potassium in the gastrointestinal tract.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating one or more UV-blocking layers.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating light-stabilizers.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating one or more UV-blocking layers.

Abstract: The present disclosure is directed to a method of forming a layered structure including a nanostructure layer having nanostructures. The method includes: forming a coating layer on the surface of the nanostructure layer, reflowing the coating layer, depositing one or more conductive plugs into the coating layer, and hardening the coating layer. The one or more conductive plugs each has a first portion configured to be placed in electrical communication with the nanostructure layer and a second portion not covered by the coating layer.

Abstract: Various embodiments of the present disclosure are directed to structures comprising a nanostructure layer that includes a plurality of transparent conductors and coating layer formed on a surface thereof. In some embodiments, the coating layer includes one or more conductive plugs having outer and inner surfaces. The inner surface the plug is placed in electrical communication with the nanostructure layer and the outer surface forms conductive surface contacts proximate an outer surface of the coating layer. In some embodiments, the structure includes a polarizer and is used as a shielding layer in flat panel electrochromic displays, such as liquid crystal displays, touch panels, and the like.

Abstract: Disclosed herein are optical stacks that are stable to light exposure by incorporating one or more UV-blocking layers.