Patents by Inventor Paul Ozawa

Paul Ozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5030931
    Abstract: A flexible laminated delay line assembly formed to include a plurality of patterned regions which may be folded into sandwiched relation to one another without affecting electrical continuity. The transmission line layer is laminated between successively adjacent dielectric and ground plane layers. Windows cut into the ground plane and dielectric layers facilitate folding and decoupling of a support spine, folding of the conductor sections and sizing of the assembly. In one construction, the dielectric layers comprise a flexible insulative substrate laminated between upper and lower thermoset layers. In another construction the dielectric layers comprise a polyetherimide that is melt flowed about the pathways of the transmission line.
    Type: Grant
    Filed: May 16, 1989
    Date of Patent: July 9, 1991
    Assignee: Thin Film Technology Corporation
    Inventors: Mark Brooks, J. Paul Ozawa, Gary L. Seibel
  • Patent number: 4942373
    Abstract: Multi-layered, thick/thin film, nanosecond delay lines, the inductive/capacitive characteristics of which are tailored to provide line impedances yielding unit delays of 1 to 10 nanoseconds. The delay lines are constructed on a supporting ceramic, resin/fiber or plastic substrate. In alternative embodiments, a serpentine conductive layer of tailored line widths and conductor spacings is sandwiched relative to overlying dielectric layers of 25 to 200 microns thickness and associated ground plane layers. In another embodiment, multiple conductor layers are sandwiched relative to intervening dielectric and ground plane layers. Lateral contact pads/pins, vertical vias and jumper conductors permit circuit connection and interconnection of the layers.
    Type: Grant
    Filed: April 11, 1988
    Date of Patent: July 17, 1990
    Assignee: Thin Film Technology Corporation
    Inventors: Paul Ozawa, Mark Brooks, Fumitoshi Nakanata