Abstract: A flexible laminated delay line assembly formed to include a plurality of patterned regions which may be folded into sandwiched relation to one another without affecting electrical continuity. The transmission line layer is laminated between successively adjacent dielectric and ground plane layers. Windows cut into the ground plane and dielectric layers facilitate folding and decoupling of a support spine, folding of the conductor sections and sizing of the assembly. In one construction, the dielectric layers comprise a flexible insulative substrate laminated between upper and lower thermoset layers. In another construction the dielectric layers comprise a polyetherimide that is melt flowed about the pathways of the transmission line.

Abstract: Multi-layered, thick/thin film, nanosecond delay lines, the inductive/capacitive characteristics of which are tailored to provide line impedances yielding unit delays of 1 to 10 nanoseconds. The delay lines are constructed on a supporting ceramic, resin/fiber or plastic substrate. In alternative embodiments, a serpentine conductive layer of tailored line widths and conductor spacings is sandwiched relative to overlying dielectric layers of 25 to 200 microns thickness and associated ground plane layers. In another embodiment, multiple conductor layers are sandwiched relative to intervening dielectric and ground plane layers. Lateral contact pads/pins, vertical vias and jumper conductors permit circuit connection and interconnection of the layers.