Patents by Inventor Peng-Chih Li

Peng-Chih Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210091536
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Application
    Filed: December 8, 2020
    Publication date: March 25, 2021
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Pi-Cheng LAW
  • Patent number: 10908370
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: February 2, 2021
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10892604
    Abstract: An aspect of a photon source may have a substrate with a surface, a focus lens disposed above the surface, and a plurality of optical sources. Each optical source may be composed of a mirror and an optical emitter. The optical emitter may include a beam twister. The emitter is aligned with the mirror along an axis and may emit a collimated beam along the axis, A plurality of mirrors may be composed of each mirror of the plurality of optical sources, arranged in a first ring-like configuration. Alternatively, the plurality of mirrors may be aggregated into a polygonal pyramidal mirror. A plurality of emitters may be composed of each emitter of the plurality of optical sources, arranged in a second ring-like configuration. The optical emitters may be composed of a laser diode mounted on a sub-mount having a plane orthogonal to the planar surface.
    Type: Grant
    Filed: December 27, 2018
    Date of Patent: January 12, 2021
    Assignee: Nanjing Casela Technologies Corporation Limited
    Inventors: Imtiaz Majid, Chih-Hao Wang, Peng-Chih Li
  • Patent number: 10892598
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: January 12, 2021
    Assignees: INPHI CORPORATION, Luxnet Corporation
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Pi-Cheng Law
  • Publication number: 20200379194
    Abstract: A photon source may have a substrate, a focus lens disposed above the substrate, and a plurality of optical sources disposed on the substrate. Each optical source may have a mirror disposed on the substrate configured to reflect a collimated beam emitted by an optical emitter disposed on the substrate. The plurality of mirrors may be arranged in a first ring-like configuration defining a first diameter. The plurality of optical emitters may be arranged in a second ring-like configuration defining a second diameter which is larger than the first diameter. In some aspects each optical source may include a second optical emitter emitting a second optical beam and an optical combiner configured to combine the first emitted optical beam and the second emitted optical beam to form the collimated beam. In another aspect, the photon source may be composed of a vertical array of multiple substrates.
    Type: Application
    Filed: December 27, 2018
    Publication date: December 3, 2020
    Inventors: Imtiaz Majid, Chih-Hao Wang, Peng-Chih Li
  • Publication number: 20200341217
    Abstract: A photon source may be composed of a substrate defining a planar surface, an optical shell having an annular base surface disposed above the substrate, and a plurality of optical sources. Each optical source may be composed of a mirror and an optical emitter aligned with the mirror along an optical axis. The mirror may be configured to reflect a collimated optical beam emitted by the optical emitter onto the annular base surface. The mirrors of the plurality of optical sources may be arranged in a first ring-like configuration. The annular base surface may be disposed above the first ring-like configuration. The optical emitters of the plurality of optical sources may be arranged in a second ring-like configuration. In one aspect, the optical shell may be a hollow frustum. In another aspect, a focus lens may be disposed between the substrate and the optical shell.
    Type: Application
    Filed: December 27, 2018
    Publication date: October 29, 2020
    Inventors: Imtiaz Majid, Chih-Hao Wang, Peng-Chih Li
  • Publication number: 20200343684
    Abstract: An aspect of a photon source may have a substrate with a surface, a focus lens disposed above the surface, and a plurality of optical sources. Each optical source may be composed of a mirror and an optical emitter. The optical emitter may include a beam twister. The emitter is aligned with the mirror along an axis and may emit a collimated beam along the axis, A plurality of mirrors may be composed of each mirror of the plurality of optical sources, arranged in a first ring-like configuration. Alternatively, the plurality of mirrors may be aggregated into a polygonal pyramidal mirror. A plurality of emitters may be composed of each emitter of the plurality of optical sources, arranged in a second ring-like configuration. The optical emitters may be composed of a laser diode mounted on a sub-mount having a plane orthogonal to the planar surface.
    Type: Application
    Filed: December 27, 2018
    Publication date: October 29, 2020
    Inventors: Imtiaz Majid, Chih-Hao Wang, Peng-Chih Li
  • Publication number: 20200183105
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Application
    Filed: February 18, 2020
    Publication date: June 11, 2020
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Masaki KATO
  • Patent number: 10605999
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Publication number: 20200076158
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Application
    Filed: November 8, 2019
    Publication date: March 5, 2020
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Pi-Cheng LAW
  • Patent number: 10559941
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: February 11, 2020
    Assignees: INPHI CORPORATION, LUXNET CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Pi-Cheng Law
  • Publication number: 20200018912
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Application
    Filed: September 23, 2019
    Publication date: January 16, 2020
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Masaki KATO
  • Patent number: 10466431
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: November 5, 2019
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Publication number: 20190212507
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Application
    Filed: March 13, 2019
    Publication date: July 11, 2019
    Applicant: INPHI CORPORATION
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Masaki KATO
  • Patent number: 10274688
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: June 20, 2018
    Date of Patent: April 30, 2019
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Publication number: 20190067903
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Application
    Filed: October 15, 2018
    Publication date: February 28, 2019
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Pi-Cheng LAW
  • Patent number: 10141717
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: November 27, 2018
    Assignees: INPHI CORPORATION, LUXNET CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Pi-Cheng Law
  • Publication number: 20180299629
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Application
    Filed: June 20, 2018
    Publication date: October 18, 2018
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Masaki KATO
  • Patent number: 10025046
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: July 17, 2018
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Publication number: 20180123316
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Application
    Filed: December 27, 2017
    Publication date: May 3, 2018
    Inventors: Radhakrishnan L. NAGARAJAN, Peng-Chih LI, Pi-Cheng LAW