Patents by Inventor Per F. Høvesten

Per F. Høvesten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11418890
    Abstract: The disclosure relates to microphone and other sensor assemblies having a transduction element and an integrated circuit. The integrated circuit includes a switched-capacitor delta-sigma analog-to-digital converter (ADC) including a first integrator stage having a switched-capacitor circuit and a first plurality of parallel amplifiers. A logic circuit coupled to the integrator circuit is configured to selectably disable a subset of enabled amplifiers of the first integrator stage during a first phase of operation and to re-enable the subset of disabled amplifiers during a second phase.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: August 16, 2022
    Assignee: KNOWLES ELECTRONICS, LLC
    Inventors: Allan Nielsen, Emil Jakobsen, Per F. Høvesten
  • Patent number: 8406437
    Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.
    Type: Grant
    Filed: February 19, 2009
    Date of Patent: March 26, 2013
    Assignee: Epcos Pte Ltd
    Inventors: Leif Steen Johansen, Per F. Høvesten, Gino Rocca
  • Patent number: 8094846
    Abstract: The present invention relates to a condenser microphone assembly comprising a condenser microphone transducer comprising adjacently positioned diaphragm and back-plate members having an air gap there between. Moreover, the assembly comprises a deep sub-micron MOS integrated circuit die comprising a preamplifier comprising a first signal input terminal for receipt of electrical signals generated by the condenser microphone transducer. The first signal input terminal is operatively coupled to an input stage of the preamplifier, said input stage comprising a thick-oxide transistor. The present invention further relates to a deep sub-micron MOS integrated circuit die comprising a thick-oxide transistor-based preamplifier.
    Type: Grant
    Filed: December 17, 2007
    Date of Patent: January 10, 2012
    Assignee: Epcos PTE Ltd.
    Inventors: Per F. Høvesten, Lars Jørn Stenberg
  • Publication number: 20090214061
    Abstract: The present invention relates to a miniature microphone assembly comprising a capacitive microphone transducer comprising a microphone electrical contact or terminal, a microphone carrier comprising a carrier electrical contact or terminal formed on a first surface thereof, and an integrated circuit die comprising a die electrical terminal operatively coupled to signal amplification or signal conditioning circuitry of the integrated circuit die. The first surface of the microphone carrier comprises a first electrically conductive path surrounding the carrier electrical contact or terminal.
    Type: Application
    Filed: February 19, 2009
    Publication date: August 27, 2009
    Applicant: Pulse MEMS ApS.
    Inventors: Leif Steen Johansen, Per F. Høvesten, Gino Rocca