Abstract: A heating element of a fluid ejection device, the heating element including a ring-type body, an inner edge of the body, and an outer edge of the body, wherein at least one of the inner edge and the outer edge defines an undulated surface contour.

Abstract: A method of forming a contact printing stamp, including creating a stamp material in a plurality of recessed regions formed in an exposed end-region of a multilayer thin film structure. The stamp material having a printing surface adapted to transfer a transfer material.

Abstract: A piezoelectric actuator includes a thin film sheet, a first electrode, and a second electrode. The thin film sheet is to physically deform in response to an electric field induced within the thin film sheet. The first electrode is embedded within the thin film sheet. The second electrode is embedded within the thin film sheet, and is interdigitated in relation to the first electrode. The electric field is induced within the thin film sheet via application of a voltage across the first and the second electrodes.

Abstract: A piezoelectric mechanism includes first and second electrodes and a thin film sheet of piezoelectric material. The second electrode is interdigitated in relation to the first electrode. The first and the second electrodes are embedded within the thin film sheet. The thin film sheet is polarized in a direction at least substantially perpendicular to a surface of the thin film sheet. The thin film sheet is to physically deform in a shear mode due to polarization of the thin film sheet at least substantially perpendicular to the surface of the thin film sheet, responsive to an electric field induced within the thin film sheet at least substantially parallel to the sheet via application of a voltage across the first and the second electrodes.

Abstract: A ring-type heating resistor for a thermal fluid-ejection mechanism includes resistive segments and conductive segments. The resistive segments are rectangular in shape. The resistive segments are separated from one another. The conductive segments are interleaved in relation to the resistive segments such that each conductive segment electrically connects two of the resistive segments. The resistive segments and the conductive segments together form a pseudo-ring that approximates a true ring.

Abstract: In an embodiment, a method of compensating for capacitance change in a piezoelectric element of a fluid ejection device includes sensing a current driving a piezoelectric element, determining from the current that capacitance of the piezoelectric element has changed, and altering a rise time of the current driving the piezoelectric element to compensate for the changed capacitance.

Abstract: Embodiments of methods, apparatuses, devices, and/or systems for forming a solution processed device are described.

Abstract: Formation of an article having capped nano-pillars is provided for herein, the article including a substrate with a nano-structure array formed thereon, the nano-structure array including a plurality of nano-pillars having stem portions of a first thickness and cap portions of a second thickness, different than the first thickness.

Abstract: A fluid ejection device includes a firing chamber having an ejection orifice opposite a chamber floor, a heating element and a mesa projecting from the chamber floor, the mesa is spaced from the heating element to define a passive zone between the mesa and heating element.

Abstract: A fluid ejection device includes a firing chamber having a chamber floor with an orifice opposite the chamber floor and a heating element partially covering the chamber floor, a region of the chamber floor being contoured to define a cavity extending into the chamber floor.

Abstract: A thermal fluid-ejection mechanism includes a substrate having a top surface. A cavity formed within the substrate has one or more sidewalls and a floor. The angle of the sidewalls from the floor is greater than or equal to nominally ninety degrees. The thermal fluid-ejection mechanism includes a patterned conductive layer on one or more of the substrate's top surface and the cavity's sidewalls. The thermal fluid-ejection mechanism includes a patterned resistive layer on the sidewalls of the cavity. The patterned resistive layer is located over the patterned conductive layer where the patterned conductive layer is formed on the sidewalls of the cavity. The patterned resistive layer is formed as a heating resistor of the thermal-fluid ejection mechanism. The conductive layer is formed as a conductor of the thermal-fluid ejection mechanism, to permit electrical activation of the heating resistor to cause fluid to be ejected from the thermal fluid-ejection mechanism.

Abstract: A piezoelectric printhead and related methods provide a first metallic electrode and a second metallic electrode deposited over a top surface and a bottom surface, respectively, of a piezoceramic plate. The second electrode is segmented into a plurality of electrode segments. A diaphragm is positioned over a plurality of pressure chambers, where the diaphragm includes a conductor positioned over each chamber. The piezoceramic plate is attached to the diaphragm such that each conductor on the diaphragm faces multiple electrode segments.

Abstract: An article is provided, the article including a substrate having a surface with a first wettability characteristic. A nano-structure array is formed on the surface of the substrate to provide a nano-structured surface having a second wettability characteristic. A thin-layer surface coating is formed on the nano-structured surface, the thin-layer surface coating being configured to tune the nano-structured surface to a target wettability characteristic.

Abstract: An article is provided, the article including a substrate having a surface, a nano-structure array formed on the substrate, the nano-structure array including a plurality of nano-structures extending from the surface of the substrate, and a cover layer formed on and around the nano-structures to anchor the cover layer to the substrate.

Abstract: A method of forming a nano-structured substrate is provided, the method comprising including forming non-integral nano-pillars on a substrate surface and directionally etching the substrate surface using the non-integral nano-pillars as a mask to form integral nano-structures in the substrate.

Abstract: Nano-scale structures are provided wherein nano-structures are formed on a substrate surface and a base material is applied between the nano-structures.

Abstract: A method of forming a nano-structure (100?) involves forming a multi-layered structure (10) including an oxidizable material layer (14) established on a substrate (12), and another oxidizable material layer (16) established on the oxidizable material layer (14). The oxidizable material layer (14) is an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. Anodizing the other oxidizable material layer (16) forms a porous anodic structure (16?), and anodizing the oxidizable material layer (14) forms a dense oxidized layer (14?) and nano-pillars (20) which grow through the porous anodic structure (16?) into pores (18) thereof. The porous structure (16?) is selectively removed to expose the nano-pillars (20). A surface (I) between the dense oxidized layer (14?) and a remaining portion of the oxidizable material layer (14) is anodized to consume a substantially cone-shaped portion (32) of the nano-pillars (20) to form cylindrical nano-pillars (20?).

Abstract: A method of forming a micro-structure (100, 100?, 100?, 100??) involves forming a multi-layered structure (10) including i) an oxidizable material layer (14) on a substrate (12) and ii) another oxidizable material layer (16) on the oxidizable material layer (14). The oxidizable material layer (14) is formed of an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. The method further involves forming a template (16?), including a plurality of pores (18), from the other oxidizable material layer (16), and growing a nano-pillar (20) inside each pore (18). The nano-pillar (18) has a predefined length (L) that terminates at an end (21). A portion of the template (16?) is selectively removed to form a substantially even plane (23) that is oriented in a position opposed to the substrate (12).

Abstract: A method of forming a nano-structure (100, 100?) includes forming a multi-layered structure (10) including an oxidizable material layer (14) established on a substrate (12), and another oxidizable material layer (16) established on the oxidizable material layer (14). The oxidizable material layer (14) is an oxidizable material having an expansion coefficient, during oxidation, that is more than 1. A template (16?), including a plurality of pores (18), is formed out of the other oxidizable material layer (16). An oxide structure (14?) is grown from the oxidizable material layer (14) through each of the pores (18) and over a template surface. Growing the oxide structure (14?) includes forming an individual nano-pillar (20) inside each of the pores (18) that is oriented in a position that is substantially normal to the substrate (12).

Abstract: A nano-structure (100, 100?) includes an oxidized layer (14?), and at least two sets (24, 24?) of super nano-pillars (20) positioned on the oxidized layer (14?). Each of the at least two sets (24, 24?) of super nano-pillars (20) includes a plurality of super nano-pillars (20), where each set (24, 24?) is separated a spaced distance from each other set (24, 24?).