Abstract: Injection molding parts onto a carrier web located between mold halves, each mold half having a cavity, resulting in molded articles having parts on both sides of the carrier web. Polymer flow into the cavities is assisted by application of ultrasonic energy to the mold. After the molding operation, mold halves are separated, and the carrier web is advanced, or indexed, to a next position for another molding sequence. Articles produced include lenses with part of the carrier web between lens halves, and a carrier web bearing an array of molded parts.

Abstract: Injection molding, parts onto a carrier web (34) located between mold halves (18,20). Flow of polymer melt into the mold is assisted by application of ultrasonic energy to the mold cavity. After the molding operation, mold halves are separated, and the carrier web is advanced, or indexed, to a next position for another molding sequence. Molding apparatus comprises a moving mold face (20), that can move toward and away from a first mold member (18) (which can be stationary) in which the mold cavity is located, a means (24,25,26,30,32) for moving and/or indexing carrier web between the first mold member and the moving mold face, means (16) to inject polymer melt into the mold cavity, and an ultrasonic system (42) providing ultrasonic energy to the mold cavity. The carrier web can transport molded parts to subsequent process steps, such as coating, drying, inspection, curing, assembly or packaging.

Abstract: Methods of altering charge on a dielectric material involve application of an at least weakly conductive liquid to at least a portion of the dielectric material. The liquid is then at least partially removed from the dielectric material leaving a substantially uniform electrostatic charge on at least the portion of the dielectric material. Some methods provide a dielectric material that is both net neutral and completely neutral. Other methods generate a charge pattern that is used for subsequent processing.

Abstract: A system(109) for altering charge of a dielectric material (90) uses ultraviolet radiation. The system includes a gas source (102) and an ultraviolet radiation source (104). The gas source (102) introduced a gas (103) to a region adjacent the dielectric material (90). The ultraviolet radiation source (104) is arranged to irradiate the region to adjust charge on the dielectric material. A method of altering charge on a dielectric material (90) is also disclosed in which a gas (103) is introduced to a region adjacent the dielectric materia (90)1. The region is then irradiated with the ultraviolet radiation (105) to alter charge on the dielectric material (90).

Abstract: Methods and apparatus (40) to neutralize the charge on a moving web (42) by splitting the field present on the web (42). One portion of the field is removed by a grounded element (55a, 55) proximate to, and optionally contacting, one side of the web (42). Proximate the opposite side of the web, the apparatus includes an ion source (57a, 57b, 57c), which provides ions to the web (42) to neutralize the charge remaining on the web (42), and a second grounded element (50a, 50b, 50c) positioned between the ion source (57a, 57b,57c) and the web (42). The methods provide a web (42) that is net neutralized and is also dual-side or bipolar neutralized.

Abstract: Injection molding, parts onto a carrier web (34) located between mold halves (18,20). Flow of polymer melt into the mold is assisted by application of ultrasonic energy to the mold cavity. After the molding operation, mold halves are separated, and the carrier web is advanced, or indexed, to a next position for another molding sequence. Molding apparatus comprises a moving mold face (20), that can move toward and away from a first mold member (18) (which can be stationary) in which the mold cavity is located, a means (24,25,26,30,32) for moving and/or indexing carrier web between the first mold member and the moving mold face, means (16) to inject polymer melt into the mold cavity, and an ultrasonic system (42) providing ultrasonic energy to the mold cavity. The carrier web can transport molded parts to subsequent process steps, such as coating, drying, inspection, curing, assembly or packaging.

Abstract: A radiation curing apparatus comprises a plurality of solid state radiation sources to generate radiation that cures a first material. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The curing apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

Abstract: A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

Abstract: A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

Abstract: A radiation modifying apparatus comprises a plurality of solid state radiation sources to generate radiation that modifies a first material such as by curing or creating alignment through polarization. The solid state radiation sources can be disposed in an array pattern. Optical concentrators, arranged in a corresponding array pattern, receive radiation from corresponding solid state radiation sources. The concentrated radiation is received by a plurality of optical waveguides, also arranged in a corresponding array pattern. Each optical waveguide includes a first end to receive the radiation and a second end to output the radiation. The radiation modifying apparatus can be utilized for continuous substrate, sheet, piece part, spot curing, and/or 3D radiation-cure processes.

Abstract: Method of selectively removing volatile components from a composition, comprising coating the composition onto a first substrate surface of a substrate, wherein the composition comprises a nonresident volatile component and a resident volatile component. The method further includes positioning at least a portion of the coated substrate between a condensing surface having a condensing surface temperature and a heating surface having a heating surface temperature that is greater than the condensing surface temperature, wherein the condensing surface is in a spaced apart, confronting relationship to the coated surface of the substrate and wherein the heated surface is in thermal contact with a second substrate surface opposite the first substrate surface. In the method, the heated surface temperature and the condensing surface temperature are such that the positioning step causes the nonresident volatile component to be selectively removed from the portion of the coated substrate.

Abstract: A system for applying a fluid coating onto a substrate includes forming a fluid wetting line by introducing a stream of fluid onto a first side of the substrate along a laterally disposed fluid-substrate contact area. An electrical force is created on the fluid from an electrical field (originating from electrical charges which are on the second side of the substrate) that is substantially at and downstream of the fluid wetting line. The electrical field can be generated by charges that have been transferred to the second side of the substrate from a remote charge generator.

Abstract: A vapor collection method and apparatus capable of capturing vapor compositions without substantial dilution. The method and apparatus utilize a material that has a surface with an adjacent gas phase. A chamber is positioned in close proximity to a surface of the material. The position of the chamber creates a relatively small gap between the surface of the material and the chamber. The adjacent gas phase between the chamber and the surface define a region possessing an amount of mass. At least a portion of the mass is drawn through the region by induced flow. The utilization of a small gap limits the flow of mass that is external to the chamber from being swept through the chamber by induced flow.

Abstract: A system for applying a fluid coating onto a substrate includes forming a fluid wetting line by introducing a stream of fluid onto a first side of the substrate along a laterally disposed fluid-substrate contact area. An electrical force is created on the fluid from an electrical field (originating from electrical charges which are on the second side of the substrate) that is substantially at and downstream of the fluid wetting line. The electrical field can be generated by charges that have been transferred to the second side of the substrate from a remote charge generator.

Abstract: A method for applying a fluid coating onto a substrate includes forming a fluid wetting line by introducing a stream of fluid onto a first side of the substrate along a laterally disposed fluid-substrate contact area. An electrical force is created on the fluid from an electrical field (originating from electrical charges which are on the second side of the substrate) that is substantially at and downstream of the fluid wetting line. The electrical field can be generated by charges that have been transferred to the second side of the substrate from a remote charge generator.

Abstract: Method of selectively removing volatile components from a composition, comprising coating the composition onto a first substrate surface of a substrate, wherein the composition comprises a nonresident volatile component and a resident volatile component. The method further includes positioning at least a portion of the coated substrate between a condensing surface having a condensing surface temperature and a heating surface having a heating surface temperature that is greater than the condensing surface temperature, wherein the condensing surface is in a spaced apart, confronting relationship to the coated surface of the substrate and wherein the heated surface is in thermal contact with a second substrate surface opposite the first substrate surface. In the method, the heated surface temperature and the condensing surface temperature are such that the positioning step causes the nonresident volatile component to be selectively removed from the portion of the coated substrate.

Abstract: A vapor collection method and apparatus capable of capturing vapor compositions without substantial dilution. The method and apparatus utilize a material that has a surface with an adjacent gas phase. A chamber is positioned in close proximity to a surface of the material. The position of the chamber creates a relatively small gap between the surface of the material and the chamber. The adjacent gas phase between the chamber and the surface define a region possessing an amount of mass. At least a portion of the mass is drawn through the region by induced flow. The utilization of a small gap limits the flow of mass that is external to the chamber from being swept through the chamber by induced flow.

Abstract: A system for applying a fluid coating onto a substrate includes forming a fluid wetting line by introducing a stream of fluid onto a first side of the substrate along a laterally disposed fluid-substrate contact area. An electrical force is created on the fluid from an electrical field (originating from electrical charges which are on the second side of the substrate) that is substantially at and downstream of the fluid wetting line. The electrical field can be generated by charges that have been transferred to the second side of the substrate from a remote charge generator.